Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.

Abstract: A cloud-based system includes a cloud server system with cloud computing capability, and an embedded device coupled to the cloud server system through a network. The embedded device is configured to request the cloud server system for a specific service by generating a service request to the cloud server system. A cloud-based processing method includes: utilizing an embedded device to generate a service request for a specific service, and serving the service request by cloud computing.

Abstract: A telephone connecting socket to be fixed in a wall for a connecting plug of a telephone to fit in a hole in the socket having a front cap, a body and a rear cap, the front cap covering a front portion of the body and the rear cap covering a rear half portion of the body, the front cap having an opening normally closed up with a shield elastically pushed by a coil spring, the body having an inner socket with a hole for the connecting plug of a telephone to fit therein by passing through the opening in the front cap with the shield pushed open.