Patents by Inventor Cheng-Chung Yu

Cheng-Chung Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080009153
    Abstract: A semiconductor package and its fabrication method are disclosed. The fabrication method has the steps of: providing at least a lead frame having a plurality of terminal leads formed with flat portions and contacting portions, providing at least a circuit board having a plurality of electrical connection pads, mounting the contacting portions on and electrically connecting to the electrical connection pads, attaching and electrically connecting electronic elements to the circuit board, forming an encapsulant for encapsulating the lead frames and the electronic elements but uncovering the flat portions of the terminal leads, and cutting around the circuit board along a cutting path that crosses through each of the terminal leads so as to allow each of the terminal leads to be electrically independent, wherein the terminal leads are employed to act as the electrical terminals of USB memory cards for storing or retrieving data.
    Type: Application
    Filed: May 8, 2007
    Publication date: January 10, 2008
    Applicant: Siliconware Precision Industries Co., Ltd.
    Inventors: Toniady Tan, Cheng-Chung Yu, Hung-Chi Wei, Chih-Hou Chang, Huan-Shiang Li
  • Publication number: 20070267732
    Abstract: A circuit card module and a method for fabricating the same are disclosed. The present invention includes the steps of providing a carrier having at least a first carrying region and a second carrying region that are co-planar; respectively mounting a substrate electrically connected to a first chip on the first carrying region, and a second chip electrically connected the substrate on the second carrying region, wherein the substrate is provided with at least an area of electrical connecting portion for being connected with external devices so as to reduce areas required for mounting a larger substrate or another substrate, thereby allowing a circuit card module to be fabricated with a minimized substrate.
    Type: Application
    Filed: May 8, 2007
    Publication date: November 22, 2007
    Applicant: Siliconware Precision Industries Co., Ltd.
    Inventors: Toniady Tan, Cheng-Chung Yu, Hung-Chi Wei, Chih-Hou Chang, Huan-Shiang Li
  • Publication number: 20050214493
    Abstract: A refractory building structure includes a regeneration layer, and at least one non-metallic fiber layer mounted in the regeneration layer. The regeneration layer is coated on an outside of the non-metallic fiber layer and includes cement, mineral waste and adhesive. Thus, the refractory building structure efficiently reuses the waste material, thereby recycling the natural resources, and thereby reducing the environmental pollution.
    Type: Application
    Filed: March 29, 2004
    Publication date: September 29, 2005
    Inventor: Cheng-Chung Yu