Abstract: A kind of light-heat dual curing anisotropic conductive adhesive includes light curing activated monomer 15.0-18.0%, light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%, insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%, light curing agent 3.0-5.0% and latent heat curing agent 12.0-16.0%, wherein the components are counted according to weight percentage. The present invention also discloses a kind of light-heat dual curing anisotropic conductive film (ACF) and its preparation methods. Ultraviolet light curing method is applied to produce ACF can avoid using solvent to protect the natural environment. When using ACF, heat curing method is then applied to guarantee the quality of banding and the reliability.