Patents by Inventor Cheng-Du Jing

Cheng-Du Jing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6741468
    Abstract: A heat dissipating assembly (1) includes a plurality of fins (10), three heat pipes (20), and a base (30). Each fin defines three through holes (11) across a middle portion thereof. A plurality of dome-shaped protruding portions (14) is formed in each fin. The protruding portions are arranged in a regular array of offset rows. Adjacent protruding portions in any row protrude from front and rear faces of the fin in a regular alternating configuration. One end of each heat pipe is respectively inserted into the corresponding through holes of the fins, and an opposite end of each heat pipe is attached in the base. The base is attached on an electronic device, for absorbing heat produced by the electronic device. The protruding portions increase a heat dissipating surface area of the fins, and deflect airflow that passes across the fins in a direction parallel to the fins.
    Type: Grant
    Filed: August 31, 2002
    Date of Patent: May 25, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Cheng-Du Jing, Ching Huan Lin
  • Publication number: 20040017659
    Abstract: A heat dissipating assembly (1) includes a plurality of fins (10), three heat pipes (20), and a base (30). Each fin defines three through holes (11) across a middle portion thereof. A plurality of dome-shaped protruding portions (14) is formed in each fin. The protruding portions are arranged in a regular array of offset rows. Adjacent protruding portions in any row protrude from front and rear faces of the fin in a regular alternating configuration. One end of each heat pipe is respectively inserted into the corresponding through holes of the fins, and an opposite end of each heat pipe is attached in the base. The base is attached on an electronic device, for absorbing heat produced by the electronic device. The protruding portions increase a heat dissipating surface area of the fins, and deflect airflow that passes across the fins in a direction parallel to the fins.
    Type: Application
    Filed: August 31, 2002
    Publication date: January 29, 2004
    Inventors: Cheng-Du Jing, Ching Huan Lin
  • Patent number: D478055
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: August 5, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Cheng-Du Jing, Ching Huan Lin