Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.

Abstract: Duplicated packet transmission methods are provided. The duplicated packet transmission method may include the following steps. A sender may determine whether to pad at least one duplicated packet into a multi-user physical-protocol-data-unit (MU-PPDU) based on at least one condition. Then, the sender may transmit the MU-PPDU with the duplicated packet to at least one receiver when the condition is met.

Abstract: A battery equalizer for equalizing electrical energy of a first battery unit and a second battery unit includes a first diode, a first switch, a second diode, a second switch, a capacitor and an inductor. The components are electrically connected to be able to form different circuit loops to equalize the electrical energy of the two battery units.