Abstract: A door locking mechanism and semiconductor container using the same include door panel, cover, and locking module. The door panel has a first stop structure. The cover and the door panel define an accommodating space for receiving the locking module. The locking module includes rotating member, holding member, and elastic member. The elastic member is disposed on the holding member and has a second stop structure near the first stop structure. The elastic member is disposed between the holding and the rotating member. The elastic member is compressed when a force is applied to the holding member, and the second stop structure detaches from a limitation state with the first stop structure for allowing a rotating operation of the rotating member. The elastic member elastically restores when the force is removed, and the second stop structure returns to the limitation state for limiting the rotating operation.

Abstract: The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier substrate; forming a first base layer on the carrier substrate; forming a working unit on the first base layer, performing a detection step on the working unit to identify whether a defect is present, wherein the detection step includes automated optical inspection (AOI), electrical detection, or a combination thereof; and repairing the electronic device.

Abstract: An immersion cooling system is provided and includes: a box body having a first accommodating space and a second accommodating space, where the first accommodating space accommodates a heat dissipation medium and at least one heating unit; a condensing unit arranged in the second accommodating space; and at least one valve unit disposed in the box body and corresponding to the second accommodating space and the condensing unit. The gasified heat dissipation medium flows and impacts the condensing unit to blow off the liquefied heat dissipation medium attached onto the condensing unit when the valve unit is opened.

Abstract: A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern including a conductive pattern, and the conductive pattern is formed of the conductive layer. The conductive pattern comprises a plurality of sub-portions arranged along at least one direction, and sizes of the plurality of sub-portions increase sequentially along the at least one direction.

Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.

Abstract: A holding device for a top-opening substrate container includes a holding assembly for pushing a substrate actuator disposed at a substrate to operate. The holding assembly includes a holding body and a pushing actuator. The pushing actuator includes a first guiding sloped surface for pressing against a second guiding sloped surface of an inner surface of a container door structure. The first guiding sloped surface causing corresponding pushing and displacement between the first guiding sloped surface and the second guiding sloped surface according to a supporting force of the container door structure. A pushing section is connected to the first guiding sloped surface, and capable of correspondingly pushing the substrate actuator to operate according to a level of the pushing and displacement of the first guiding sloped surface, such that the substrate actuator displaces substrates and stacks the substrates with another in layers.

Abstract: A switching board and a soldering method thereof are provided. The switching board includes a circuit board having a board body and a first metal ring, where the board body has a first surface, and the first metal ring is formed on the first surface and surrounds a periphery of the board body. The switching board further includes a first metal element disposed on the first surface and fastened to the first metal ring by soldering. The switching board has a high pressure resistance and a low leakage rate.

Abstract: An Ethernet power supply receives a DC voltage through a bus positive terminal and a bus negative terminal, and is coupled to a load device. The Ethernet power supply includes a first control module and a second control module. The first control module is used to provide a first control signal through the bus negative terminal to confirm whether the load device is a valid load. The second control module is used to connect or disconnect a coupling relationship between the bus positive terminal and the first control module according to the load device being connected or not.

Abstract: An Ethernet power supply receives a DC voltage through a bus positive terminal and a bus negative terminal, and is coupled to a load device. The Ethernet power supply includes a first control module and a second control module. The first control module provides a first control signal through the bus negative terminal to confirm whether the load device is a valid load. The second control module is used to connect or disconnect a coupling relationship between the bus positive terminal and the first control module according to whether the load device is connected to the Ethernet power supply.

Abstract: A heat dissipation device is provided and includes a frame body having an airflow channel therein; a first partition plate and a second partition plate for separating the airflow channel into a first channel, a second channel, a third channel and a fourth channel; a first flow guiding structure for isolating the fourth channel from the second channel; and a second flow guiding structure for isolating the first channel from the third channel. The first partition plate, the first flow guiding structure, the second flow guiding structure and the second partition plate collectively form a first flow channel communicating the first channel and the fourth channel and a second flow channel communicating the second channel and the third channel, where the first flow channel and the second flow channel are separate from one another.

Abstract: An Ethernet power supply receives a DC voltage through a bus positive terminal and a bus negative terminal, and is coupled to a load device. The Ethernet power supply includes a first control module and a second control module. The first control module is used to provide a first control signal through the bus negative terminal to confirm whether the load device is a valid load. The second control module is used to connect or disconnect a coupling relationship between the bus positive terminal and the first control module according to the load device being connected or not.

Abstract: An Ethernet power supply receives a DC voltage through a bus positive terminal and a bus negative terminal, and is coupled to a load device. The Ethernet power supply includes a first control module and a second control module. The first control module provides a first control signal through the bus negative terminal to confirm whether the load device is a valid load. The second control module is used to connect or disconnect a coupling relationship between the bus positive terminal and the first control module according to whether the load device is connected to the Ethernet power supply.

Abstract: A heat dissipation device is provided and includes a frame body having an airflow channel therein; a first partition plate and a second partition plate for separating the airflow channel into a first channel, a second channel, a third channel and a fourth channel; a first flow guiding structure for isolating the fourth channel from the second channel; and a second flow guiding structure for isolating the first channel from the third channel. The first partition plate, the first flow guiding structure, the second flow guiding structure and the second partition plate collectively form a first flow channel communicating the first channel and the fourth channel and a second flow channel communicating the second channel and the third channel, where the first flow channel and the second flow channel are separate from one another.

Abstract: A power source device coupled to a power device includes an output port and a controller. When the output port is coupled to a connection cable, the controller is activated to generate a handshake signal, so as to communicate with the power device. When it is determined that the power device is able to be powered according to the handshake signal, the controller controls the power supply device to power the power device through the connection cable. When the connection cable is not coupled to the output port, the controller is deactivated and thus the handshake signal is not generated.

Abstract: A power source device coupled to a power device includes an output port and a controller. When the output port is coupled to a connection cable, the controller is activated to generate a handshake signal, so as to communicate with the power device. When it is determined that the power device is able to be powered according to the handshake signal, the controller controls the power supply device to power the power device through the connection cable. When the connection cable is not coupled to the output port, the controller is deactivated and thus the handshake signal is not generated.

Abstract: An optical measuring apparatus and an operating method thereof are disclosed. The optical measuring apparatus includes a light source, a carrier chip, a light sensor, an analyzing chip and a display. Samples are uniformly distributed on the carrier chip. The light source emits sensing lights toward the carrier chip. The light sensor receives the sensing lights passing through the carrier chip at a plurality of times to obtain a plurality of images corresponding to the plurality of times respectively. The analyzing chip is coupled to the light sensor. The analyzing chip analyzes the object number and distribution variation with time in the sample according to the plurality of images corresponding to the plurality of times and estimates intrinsic characteristics of the object in the sample accordingly. The display is coupled to the analyzing chip. The display displays the intrinsic characteristics of the object in the sample.

Abstract: An optical measuring apparatus and an operating method thereof are disclosed. The optical measuring apparatus includes a light source, a carrier chip, a light sensor, an analyzing chip and a display. Samples are uniformly distributed on the carrier chip. The light source emits sensing lights toward the carrier chip. The light sensor receives the sensing lights passing through the carrier chip at a plurality of times to obtain a plurality of images corresponding to the plurality of times respectively. The analyzing chip is coupled to the light sensor. The analyzing chip analyzes the object number and distribution variation with time in the sample according to the plurality of images corresponding to the plurality of times and estimates intrinsic characteristics of the object in the sample accordingly. The display is coupled to the analyzing chip. The display displays the intrinsic characteristics of the object in the sample.

Abstract: A frequency tracking circuit is disclosed. The frequency tracking circuit includes an edge selector, a phase-frequency processor and a digital controlled oscillator. The edge selector receives a data signal and feedback clock signal and sequentially outputs a data edge signal and a feedback-clock-edge signal. The phase-frequency processor receives the data edge signal and the feedback-clock-edge signal and outputs a frequency adjusting digital signal after executing differential operation according to a first phase difference and a second phase difference. The digital controlled oscillator receives the frequency adjusting digital signal so as to adjust frequency of the feedback clock signal. The phase-frequency processor outputs a frequency tracking signal to the edge selector, wherein the edge selector utilizes the frequency tracking signal for acquiring the data edge signal and utilizes the data edge signal for acquiring the feedback-clock-edge signal.

Abstract: A frequency tracking circuit is disclosed. The frequency tracking circuit includes an edge selector, a phase-frequency processor and a digital controlled oscillator. The edge selector receives a data signal and feedback clock signal and sequentially outputs a data edge signal and a feedback-clock-edge signal. The phase-frequency processor receives the data edge signal and the feedback-clock-edge signal and outputs a frequency adjusting digital signal after executing differential operation according to a first phase difference and a second phase difference. The digital controlled oscillator receives the frequency adjusting digital signal so as to adjust frequency of the feedback clock signal. The phase-frequency processor outputs a frequency tracking signal to the edge selector, wherein the edge selector utilizes the frequency tracking signal for acquiring the data edge signal and utilizes the data edge signal for acquiring the feedback-clock-edge signal.