Patents by Inventor Cheng-En WENG

Cheng-En WENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: 11594506
    Abstract: A semiconductor package is provided. The semiconductor package includes a first conductive layer, a plurality of first conductive pads, a plurality of second conductive pads, and a first dielectric layer. The first conductive pads are electrically connected to the first conductive layer. The second conductive pads are electrically disconnected from the first conductive layer.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: February 28, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Pei-Jen Lo, Shun-Tsat Tu, Cheng-En Weng
  • SEMICONDUCTOR PACKAGE
    Publication number: 20220093548
    Abstract: A semiconductor package is provided. The semiconductor package includes a first conductive layer, a plurality of first conductive pads, a plurality of second conductive pads, and a first dielectric layer. The first conductive pads are electrically connected to the first conductive layer. The second conductive pads are electrically disconnected from the first conductive layer.
    Type: Application
    Filed: September 23, 2020
    Publication date: March 24, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pei-Jen LO, Shun-Tsat TU, Cheng-En WENG
  • Semiconductor device packages and methods of manufacturing the same
    Patent number: 11011491
    Abstract: A semiconductor device package includes a connection structure having a first portion and a second portion extending from the first portion, the second portion having a width less than the first portion; and a dielectric layer surrounding the connection structure, wherein the dielectric layer and the second portion of the connection structure defines a space.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: May 18, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shun-Tsat Tu, Pei-Jen Lo, Fong Ren Sie, Cheng-En Weng, Min Lung Huang
  • SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20210074669
    Abstract: A semiconductor device package includes a connection structure having a first portion and a second portion extending from the first portion, the second portion having a width less than the first portion; and a dielectric layer surrounding the connection structure, wherein the dielectric layer and the second portion of the connection structure defines a space.
    Type: Application
    Filed: September 6, 2019
    Publication date: March 11, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shun-Tsat TU, Pei-Jen LO, Fong Ren SIE, Cheng-En WENG, Min Lung HUANG