Abstract: The present invention discloses a resistor supported on a metal plate composed of a low temperature coefficient of resistance (TCR) metallic material. The resistor includes at least two electrode columns composed of the low TCR metallic material disposed on the metal plate. The resistor further includes at least an electrode layer disposed on each of the electrode columns to form an electrode for each of the electrode columns. In a preferred embodiment, the low TCR metallic material composed of the metal plate further comprises a nickel-copper alloy. In another preferred embodiment, the electrode layer disposed on each of the electrode columns further comprises a copper layer and a tin-lead alloy layer on each of the electrode columns. In another preferred embodiment, the electrode columns disposed on the metal plate having a precisely defined position for providing precisely defined resistance for the resistor ranging between one milli-ohm to one ohm.

Abstract: A leadframe resistance structure comprises: at least a resistance foil; a plurality of leads, each of the plurality of leads respectively having a first lead surface and an opposite second lead surface, wherein the resistance foil is disposed on the first lead surface of the leads and connected to the leads; and an encapsulating material that encapsulates the resistance foil, and a portion of the first surface of the leads.

Abstract: A leadframe resistance structure comprises: at least a resistance foil; a plurality of leads, each of the plurality of leads respectively having a first lead surface and an opposite second lead surface, wherein the resistance foil is disposed on the first lead surface of the leads and connected to the leads; and an encapsulating material that encapsulates the resistance foil, and a portion of the first surface of the leads.

Abstract: The present invention discloses a resistor supported on a metal plate composed of a low temperature coefficient of resistance (TCR) metallic material. The resistor includes at least two electrode columns composed of the low TCR metallic material disposed on the metal plate. The resistor further includes at least an electrode layer disposed on each of the electrode columns to form an electrode for each of the electrode columns. In a preferred embodiment, the low TCR metallic material composed of the metal plate further comprises a nickel-copper alloy. In another preferred embodiment, the electrode layer disposed on each of the electrode columns further comprises a copper layer and a tin-lead alloy layer on each of the electrode columns. In another preferred embodiment, the electrode columns disposed on the metal plate having a precisely defined position for providing precisely defined resistance for the resistor ranging between one milli-ohm to one ohm.