Patents by Inventor CHENG-FAN WEI

CHENG-FAN WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955688
    Abstract: Aspects described herein include devices, wireless communication apparatuses, methods, and associated operations for heatsinks integrating millimeter wave and non-millimeter wave operation. In some aspects, an apparatus comprising a millimeter wave (mmW) module is provided. The apparatus includes at least one mmW antenna and at least one mmW signal node configured to communicate a data signal in association with the at least one mmW antenna. The apparatus further includes mixing circuitry configured to convert between the data signal and a mmW signal for communications associated with the at least one mmW antenna. The apparatus further includes a heatsink comprising a non-mmW antenna and a non-mmW feed point coupled to the non-mmW antenna. The non-mmW feed point is configured to provide a signal path to the non-mmW antenna for a non-mmW signal. The heatsink is mechanically coupled to the mmW module.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: April 9, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Cheng-Fan Wei, Chao-Kuei Chang, Yi-Hsiang Kung
  • Publication number: 20230096131
    Abstract: Aspects described herein include devices, wireless communication apparatuses, methods, and associated operations for heatsinks integrating millimeter wave and non-millimeter wave operation. In some aspects, an apparatus comprising a millimeter wave (mmW) module is provided. The apparatus includes at least one mmW antenna and at least one mmW signal node configured to communicate a data signal in association with the at least one mmW antenna. The apparatus further includes mixing circuitry configured to convert between the data signal and a mmW signal for communications associated with the at least one mmW antenna. The apparatus further includes a heatsink comprising a non-mmW antenna and a non-mmW feed point coupled to the non-mmW antenna. The non-mmW feed point is configured to provide a signal path to the non-mmW antenna for a non-mmW signal. The heatsink is mechanically coupled to the mmW module.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Cheng-Fan WEI, Chao-Kuei CHANG, Yi-Hsiang KUNG
  • Patent number: 9466878
    Abstract: A multi-band antenna for assembling to an insulation base and metal base of an electronic device comprises: a radiating element; a first connecting element; a second connecting element; a grounding element; and a first grounding foil and a second grounding foil respectively electrically connected to the second connecting element and the grounding element along a longitudinal direction perpendicular to the transversal direction and extending to the metal base. The first grounding foil and the second grounding foil has a first part respectively extending from the second connecting and grounding element to a joint line between the insulation and the metal base and a second part attached to the metal base. A slot is formed among the first part of the first grounding foil, the first part of the second grounding foil, the second connecting element, and the joint line between the insulation base and the metal base.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: October 11, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Cheng-Fan Wei, Lung-Sheng Tai, Wen-Fong Su
  • Publication number: 20140043200
    Abstract: A multi-band antenna for assembling to an insulation base and metal base of an electronic device comprises: a radiating element; a first connecting element; a second connecting element; a grounding element; and a first grounding foil and a second grounding foil respectively electrically connected to the second connecting element and the grounding element along a longitudinal direction perpendicular to the transversal direction and extending to the metal base. The first grounding foil and the second grounding foil has a first part respectively extending from the second connecting and grounding element to a joint line between the insulation and the metal base and a second part attached to the metal base. A slot is formed among the first part of the first grounding foil, the first part of the second grounding foil, the second connecting element, and the joint line between the insulation base and the metal base.
    Type: Application
    Filed: August 12, 2013
    Publication date: February 13, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Cheng-Fan WEI, Lung-Sheng TAI, Wen-Fong SU
  • Publication number: 20120162022
    Abstract: A multi-band antenna includes a grounding element extending along a lengthwise direction to form a side edge, a first radiating element, a second radiating element and a feeding line. The first radiating element is separated from and unconnected to the grounding element and comprises a feeding portion perpendicular to and separated from the grounding element and a first and second radiating portion respectively extending from the feeding portion along two different directions, the first radiating element being used on a first higher frequency band. The second radiating element is located on one side of the first radiating portion. The second radiating element works on a second lower frequency band by coupled to the second radiating portion. The second radiating portion of the first radiating element is separated from the second radiating element and the grounding element to respectively form two slots.
    Type: Application
    Filed: December 23, 2011
    Publication date: June 28, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHENG-FAN WEI