Abstract: A method of configuring a signal transducer of a foldable UE includes: providing a first panel comprising a first conductor configured to provide a first portion of the signal transducer; providing a second panel comprising a second conductor configured to provide a second portion of the signal transducer; providing a hinge connected to the first panel and the second panel and configured to allow the first panel to rotate relative to the second panel about a pivot axis of the hinge, the hinge comprising a third conductor configured to provide a third portion of the signal transducer, the third conductor electrically coupling the first conductor to the second conductor; providing a fourth conductor that is physically separate from the first conductor, the second conductor, and the third conductor; and selectively causing the fourth conductor to provide a fourth portion of the signal transducer.

Abstract: Aspects described herein include millimeter wave integrated hinges. In one aspect, wireless communication apparatus includes a bracket, a first pivot structure attached to the bracket configured to pivot the bracket around a first line, and a second pivot structure attached to the bracket and configured to pivot the bracket around a second line, wherein the second line is parallel to the first line. A millimeter wave antenna array is mounted to the bracket such that the mmW antenna array is positioned between the first line and the second line.

Abstract: Aspects described herein include devices, wireless communication apparatuses, methods, and associated operations for heatsinks integrating millimeter wave and non-millimeter wave operation. In some aspects, an apparatus comprising a millimeter wave (mmW) module is provided. The apparatus includes at least one mmW antenna and at least one mmW signal node configured to communicate a data signal in association with the at least one mmW antenna. The apparatus further includes mixing circuitry configured to convert between the data signal and a mmW signal for communications associated with the at least one mmW antenna. The apparatus further includes a heatsink comprising a non-mmW antenna and a non-mmW feed point coupled to the non-mmW antenna. The non-mmW feed point is configured to provide a signal path to the non-mmW antenna for a non-mmW signal. The heatsink is mechanically coupled to the mmW module.

Abstract: Aspects described herein include devices, wireless communication apparatuses, methods, and associated operations for heatsinks integrating millimeter wave and non-millimeter wave operation. In some aspects, an apparatus comprising a millimeter wave (mmW) module is provided. The apparatus includes at least one mmW antenna and at least one mmW signal node configured to communicate a data signal in association with the at least one mmW antenna. The apparatus further includes mixing circuitry configured to convert between the data signal and a mmW signal for communications associated with the at least one mmW antenna. The apparatus further includes a heatsink comprising a non-mmW antenna and a non-mmW feed point coupled to the non-mmW antenna. The non-mmW feed point is configured to provide a signal path to the non-mmW antenna for a non-mmW signal. The heatsink is mechanically coupled to the mmW module.

Abstract: A multi-band antenna for assembling to an insulation base and metal base of an electronic device comprises: a radiating element; a first connecting element; a second connecting element; a grounding element; and a first grounding foil and a second grounding foil respectively electrically connected to the second connecting element and the grounding element along a longitudinal direction perpendicular to the transversal direction and extending to the metal base. The first grounding foil and the second grounding foil has a first part respectively extending from the second connecting and grounding element to a joint line between the insulation and the metal base and a second part attached to the metal base. A slot is formed among the first part of the first grounding foil, the first part of the second grounding foil, the second connecting element, and the joint line between the insulation base and the metal base.

Abstract: A multi-band antenna for assembling to an insulation base and metal base of an electronic device comprises: a radiating element; a first connecting element; a second connecting element; a grounding element; and a first grounding foil and a second grounding foil respectively electrically connected to the second connecting element and the grounding element along a longitudinal direction perpendicular to the transversal direction and extending to the metal base. The first grounding foil and the second grounding foil has a first part respectively extending from the second connecting and grounding element to a joint line between the insulation and the metal base and a second part attached to the metal base. A slot is formed among the first part of the first grounding foil, the first part of the second grounding foil, the second connecting element, and the joint line between the insulation base and the metal base.

Abstract: A multi-band antenna includes a grounding element extending along a lengthwise direction to form a side edge, a first radiating element, a second radiating element and a feeding line. The first radiating element is separated from and unconnected to the grounding element and comprises a feeding portion perpendicular to and separated from the grounding element and a first and second radiating portion respectively extending from the feeding portion along two different directions, the first radiating element being used on a first higher frequency band. The second radiating element is located on one side of the first radiating portion. The second radiating element works on a second lower frequency band by coupled to the second radiating portion. The second radiating portion of the first radiating element is separated from the second radiating element and the grounding element to respectively form two slots.