Patents by Inventor Cheng-Fang CHIU

Cheng-Fang CHIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cell activation reactor and cell activation method
    Patent number: 11959101
    Abstract: A cell activation reactor and a cell activation method are provided. The cell activation reactor includes a body, a rotating part, an upper cover, a microporous film, and multiple baffles. The body has an accommodating space, which is suitable for accommodating multiple cells and multiple magnetic beads. The rotating part is disposed in the accommodating space and includes multiple impellers. The microporous film is disposed in the accommodating space and covers multiple holes of the accommodating space. The baffles are disposed in the body. When the rotating part is driven to rotate, the interaction between the baffles and the impellers separates the cells and the magnetic beads.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: April 16, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Ting-Hsuan Chen, Kuo-Hsing Wen, Ya-Hui Chiu, Nien-Tzu Chou, Ching-Fang Lu, Cheng-Tai Chen, Ting-Shuo Chen, Pei-Shin Jiang
  • Surface-mount device platform and assembly
    Patent number: 11583171
    Abstract: A surface-mount device platform includes a surface-mounting region, a connection region, and a bendable region therebetween, each including a respective part of a base substrate. The base substrate includes electrically-conductive layers interspersed with electrically-insulating build-up layers. Each of the surface-mounting region, the connection region, and the bendable region spans between a bottom substrate-surface and a top substrate-surface of the base substrate. The surface-mounting region further includes an electrically-insulating first top rigid-layer, and device bond-pads exposed on a top surface of the first top rigid-layer facing away from the top substrate-surface in the surface-mounting region.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: February 21, 2023
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Chien-Chan Yeh, Cheng-Fang Chiu, Wei-Feng Lin
  • SURFACE-MOUNT DEVICE PLATFORM AND ASSEMBLY
    Publication number: 20210052134
    Abstract: A surface-mount device platform includes a surface-mounting region, a connection region, and a bendable region therebetween, each including a respective part of a base substrate. The base substrate includes electrically-conductive layers interspersed with electrically-insulating build-up layers. Each of the surface-mounting region, the connection region, and the bendable region spans between a bottom substrate-surface and a top substrate-surface of the base substrate. The surface-mounting region further includes an electrically-insulating first top rigid-layer, and device bond-pads exposed on a top surface of the first top rigid-layer facing away from the top substrate-surface in the surface-mounting region.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 25, 2021
    Inventors: Teng-Sheng CHEN, Chien-Chan YEH, Cheng-Fang CHIU, Wei-Feng LIN