Patents by Inventor Cheng-Fei Yu

Cheng-Fei Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
    Publication number: 20230282494
    Abstract: An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.
    Type: Application
    Filed: May 15, 2023
    Publication date: September 7, 2023
    Inventors: Cheng-Fei YU, Chang-Chen Tsao, Ting-Yau Shiu, Cheng-Kang Hu, Hsu-Shui Liu, Jiun-Rong Pai
  • Fully automated wafer debonding system and method thereof
    Patent number: 11670524
    Abstract: An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: June 6, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Fei Yu, Chang-Chen Tsao, Ting-Yau Shiu, Cheng-Kang Hu, Hsu-Shui Liu, Jiun-Rong Pai
  • FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
    Publication number: 20210242043
    Abstract: An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.
    Type: Application
    Filed: December 2, 2020
    Publication date: August 5, 2021
    Inventors: Cheng-Fei Yu, Chang-Chen TSAO, Ting-Yau Shiu, Cheng-Kang Hu, Hsu-Shui Liu, Jiun-Rong Pai