Patents by Inventor Cheng-Fen Chen

Cheng-Fen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip package with electrical interconnection
    Patent number: 6927480
    Abstract: A multi-chip package with electrical interconnection comprises a leadframe, at least a relay conductor, at least a first chip, at least a second chip, a plurality of bonding wires and a molding compound. A dielectric carrier is attached to the leadframe for fixing the relay conductor. The relay conductor has a top surface for interconnection of the bonding wires and a bottom surface attached to the dielectric carrier to electrically isolated from the leadframe. The bonding wires electrically connect the bonding pads of the first chip and second chip to the common lead of the leadframe through the relay conductor so as to achieve electrical interconnection of the plurality of chips and the leadframe inside the molding compound with lower cost.
    Type: Grant
    Filed: May 5, 2004
    Date of Patent: August 9, 2005
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Bau-Nan Lee, Cheng-Fen Chen, Chih-Wei Tsai, Chih-Pin Hung
  • Multi-chip package with electrical interconnection
    Publication number: 20040222503
    Abstract: A multi-chip package with electrical interconnection comprises a leadframe, at least a relay conductor, at least a first chip, at least a second chip, a plurality of bonding wires and a molding compound. A dielectric carrier is attached to the leadframe for fixing the relay conductor. The relay conductor has a top surface for interconnection of the bonding wires and a bottom surface attached to the dielectric carrier to electrically isolated from the leadframe. The bonding wires electrically connect the bonding pads of the first chip and second chip to the common lead of the leadframe through the relay conductor so as to achieve electrical interconnection of the plurality of chips and the leadframe inside the molding compound with lower cost.
    Type: Application
    Filed: May 5, 2004
    Publication date: November 11, 2004
    Applicant: Advanced Semiconductor Engineering Inc.
    Inventors: Bau-Nan Lee, Cheng-Fen Chen, Chih-Wei Tsai, Chih-Pin Hung