Patents by Inventor Cheng-Fen Lai

Cheng-Fen Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTERCONNECT AND METHOD OF FABRICATING THE SAME
    Publication number: 20150194382
    Abstract: Provided is a method of fabricating an interconnect including the following steps. A conductive plug and a dielectric layer are provided, wherein a surface of the conductive plug and the surface of the dielectric layer substantially form a planar surface. A chemical mechanical polishing process is performed to the planar surface, wherein a chemical removal rate of the dielectric layer is greater than a chemical removal rate of the conductive plug. A conductive line is formed to electrically connect the conductive plug.
    Type: Application
    Filed: January 3, 2014
    Publication date: July 9, 2015
    Applicant: MACRONIX International Co., Ltd.
    Inventors: Cheng-Fen Lai, Meng-Shien Hsieh, Shiau-Lian Liu