Abstract: In a method, a wafer is bonded to a first carrier. The wafer includes a semiconductor substrate, and a first plurality of through-vias extending into the semiconductor substrate. The method further includes bonding a plurality of chips over the wafer, with gaps located between the plurality of chips, performing a gap-filling process to form gap-filling regions in the gaps, bonding a second carrier onto the plurality of chips and the gap-filling regions, de-bonding the first carrier from the wafer, and forming electrical connectors electrically connecting to conductive features in the wafer. The electrical connectors are electrically connected to the plurality of chips through the first plurality of through-vias.

Abstract: In a method, a wafer is bonded to a first carrier. The wafer includes a semiconductor substrate, and a first plurality of through-vias extending into the semiconductor substrate. The method further includes bonding a plurality of chips over the wafer, with gaps located between the plurality of chips, performing a gap-filling process to form gap-filling regions in the gaps, bonding a second carrier onto the plurality of chips and the gap-filling regions, de-bonding the first carrier from the wafer, and forming electrical connectors electrically connecting to conductive features in the wafer. The electrical connectors are electrically connected to the plurality of chips through the first plurality of through-vias.

Abstract: In a method, a wafer is bonded to a first carrier. The wafer includes a semiconductor substrate, and a first plurality of through-vias extending into the semiconductor substrate. The method further includes bonding a plurality of chips over the wafer, with gaps located between the plurality of chips, performing a gap-filling process to form gap-filling regions in the gaps, bonding a second carrier onto the plurality of chips and the gap-filling regions, de-bonding the first carrier from the wafer, and forming electrical connectors electrically connecting to conductive features in the wafer. The electrical connectors are electrically connected to the plurality of chips through the first plurality of through-vias.

Abstract: In a method, a wafer is bonded to a first carrier. The wafer includes a semiconductor substrate, and a first plurality of through-vias extending into the semiconductor substrate. The method further includes bonding a plurality of chips over the wafer, with gaps located between the plurality of chips, performing a gap-filling process to form gap-filling regions in the gaps, bonding a second carrier onto the plurality of chips and the gap-filling regions, de-bonding the first carrier from the wafer, and forming electrical connectors electrically connecting to conductive features in the wafer. The electrical connectors are electrically connected to the plurality of chips through the first plurality of through-vias.

Abstract: A spray device includes a base seat unit, a liquid container having a liquid-receiving space, a nozzle unit including a nozzle and a drawing tube, and an electric gas pump. The nozzle has an outlet, and a gas inlet and a liquid entrance that are in spatial communication with the outlet. The drawing tube spatially interconnects the liquid-receiving space and the liquid entrance. The electric gas pump has a gas supplying hole spatially communicated with the gas inlet. The electric gas pump is operable to provide a gas into the gas inlet through the gas supplying hole, such that the liquid stored in the liquid-receiving space is drawn into the liquid entrance through the drawing tube and thereafter exits the outlet together with the gas.

Abstract: An automatic cleaning device includes an accelerometer, a sprayer, a driving module and a processing unit. The accelerometer is mounted to a door, measures acceleration of the door, and outputs an acceleration value accordingly. The sprayer is for storing cleaner, and is operable to spray the cleaner. The processing unit is electrically connected to the driving module and the accelerometer, and determines whether the acceleration value is greater than an acceleration threshold, and generates a driving signal and transmits the same to the driving module for enabling the driving module to drive the sprayer to spray the cleaner when determining that the acceleration value is greater than the acceleration threshold.

Abstract: A method for measuring a width of a gap of a display module includes the following steps. A sample image of the display module is captured from a viewpoint, the sample image includes a frame region corresponding to a frame part of the display module, an inner region corresponding to a display part of the display module, and a gap region corresponding to the gap between the frame and the display parts. A first line and a second line segments are determined in the sample image, the first line segment is a part of a boundary between the frame and the gap regions, and the second line segment is a part of a boundary between the gap and the inner regions. A distance between the first line and the second line segments is calculated to obtain the width of the gap.

Abstract: An automatic liquid supply system includes an assembly of a storage component and a pump device operable to allow liquid flow out of the storage component, an installation component for installing the assembly, an RFID tag that records an authentication code and that is disposed on the assembly, a storage unit storing qualified authentication codes, a transmission unit controlling the pump device, and a control unit. The control unit controls the transmission unit to activate the pump device to allow the liquid flow when the control unit determines that the authentication code matches one of the qualified authentication codes.

Abstract: A complex high-density soybean grinder comprises a first filter unit and a second filter unit; a suction unit having a feeding tube for supplying soybeans; a lateral side of the suction unit being installed with a blower and a sound canceller so that soybean can enter into the suction unit; a feeding unit connected to the suction unit and the first filter unit; an electric controller serving to control the feeding unit; a regeneration barrel set connected to the first filter unit and the second filter unit for mixing and agitating soybean dregs from the first filter unit with water; and then the mixed dregs and water being fed into the second filter unit; a reuse barrel set connected to the first filter unit for feeding liquid from the second filter unit to the regeneration barrel set and then to the first filter unit through a pump.

Abstract: A complex high-density soybean grinder comprises a first filter unit and a second filter unit; a suction unit having a feeding tube for supplying soybeans; a lateral side of the suction unit being installed with a blower and a sound canceller so that soybean can enter into the suction unit; a feeding unit connected to the suction unit and the first filter unit; an electric controller serving to control the feeding unit; a regeneration barrel set connected to the first filter unit and the second filter unit for mixing and agitating soybean dregs from the first filter unit with water; and then the mixed dregs and water being fed into the second filter unit; a reuse barrel set connected to the first filter unit for feeding liquid from the second filter unit to the regeneration barrel set and then to the first filter unit through is pump.

Abstract: An automatic bean curd maker includes a computer control device, grinding device, stirring device, and molding device. The stirring device is arranged to a side of the grinding device. The molding device is arranged in front of the grinding device. The computer control device is arranged to a side of the molding device. The operation of the automatic bean curd maker assembled by above components is described in the following. The soy beans of certain proportion set by the computer control device are grinded by the grinding device as a bean pulp. The steamed bean pulp is stirred in the stirring device with coagulator as a semi-finished bean curd. The semi-finished bean curd is coagulated by removing moisture and gas in the molding device as a finished bean curd.

Abstract: An energy conserving device is adapted to be connected to an infrared receiving circuit of a remote controlled apparatus that receives an infrared control signal from a remote controller, and controls the supply of an operating voltage to the infrared receiving circuit. The energy conserving device includes an input voltage unit for providing a voltage output that is lower than the operating voltage, a voltage increasing unit, and a sleep control unit. The voltage increasing unit is operable in one of a wake mode, where the voltage increasing unit is enabled to generate the operating voltage from the voltage output of the input voltage unit and to supply the operating voltage to the infrared receiving circuit, and a sleep mode, where the voltage increasing unit is inhibited from generating the operating voltage to the infrared receiving circuit.

Abstract: A holder includes a casing, a timer-controlled press device, a holding frame, and a locking device. The casing is adapted to keep a deodorant bottle therein and has an opening formed therethrough. The timer-controlled press unit is installed in the casing and can press a spray head of the deodorant bottle at pre-set times to spray out deodorant from the bottle so that the deodorant flows out from the casing through the opening of the casing, thereby spreading fragrance around the casing. The holding frame is mounted slidably within the casing at a normal position and is adapted to carry the bottle thereon. The frame can slide on the casing to an extended position, in which the bottle can be taken out from the frame by hand for replacement. The locking device locks releasably the frame at the normal position within the casing. The locking device can be actuated by the use of a needle-shaped tool so as to unlock the frame from the casing, thus permitting movement of the frame to the extended position.