Patents by Inventor Cheng-Feng Chou

Cheng-Feng Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11143798
    Abstract: The present disclosure provides a dual-molded circular optical element including an outer plastic peripheral portion and an inner sheet portion. The outer plastic peripheral portion locates at an outer annular surface of the circular optical element. The inner sheet portion is enclosed in the outer plastic peripheral portion, and the inner sheet portion forms a minimal central opening of the circular optical element. Two sides of the outer plastic peripheral portion are disposed with a flat plane, and each of the flat planes is perpendicular to a central axis of the circular optical element.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: October 12, 2021
    Inventors: Ming-Ta Chou, Cheng-Feng Lin
  • Patent number: 11131833
    Abstract: An annular optical component includes an inner surface, an outer surface, an object-side surface and an image-side surface. The inner surface includes multiple L-shaped annular grooves. The annular optical component includes multiple stripe-shaped structures disposed in the L-shaped annular grooves. The L-shaped annular grooves include an object-side L-shaped annular groove closest to the object-side surface and an image-side L-shaped annular groove closest to the image-side surface. A bottom diameter of the image-side L-shaped annular groove is larger than a bottom diameter of the object-side L-shaped annular groove. Each L-shaped annular groove includes a first side and a second side located between the object-side surface and the image-side surface. The stripe-shaped structures are disposed on the first side or the second side, and a degree of inclination between the first side and the central axis is larger than a degree of inclination between the second side and the central axis.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: September 28, 2021
    Inventors: Ming-Ta Chou, Cheng-Feng Lin, Wei-Hung Weng
  • Publication number: 20140284090
    Abstract: The invention provides a method for manufacturing a thin film substrate. The method comprises steps of: providing a substrate having at least one through hole; forming a first metallic layer on a surface of the substrate and the through holes; forming a resist layer and a first opening on the first metallic layer; forming a second metallic layer in the first opening and the through hole; removing the resist layer and a part of the first metallic layer to form a circuit layer and a plurality of grooves; forming a solder mask layer on the circuit layer and in the groove, and forming a second opening on the solder mask layer to expose a part of the circuit layer; and polishing the surface of the exposed circuit layer and the solder mask layer.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 25, 2014
    Applicant: ECOCERA Optronics Co., Ltd.
    Inventors: Cheng-Feng Chou, Ssu-Yu Chen, Ming-Hsin Hsu
  • Publication number: 20140190728
    Abstract: The invention provides a method for manufacturing a circuit board comprising the steps of: (a) forming a through hole in a substrate; (b) providing a photo resist to cover a predetermined area adjacent to the through hole on a first surface and a second surface opposite to the first surface of the substrate; and (c) performing an etching process to make the through hole has a shape of dumbbell.
    Type: Application
    Filed: March 14, 2013
    Publication date: July 10, 2014
    Inventors: Cheng-Feng Chou, Hung-Pin Lee, Tzu-Yuan Lin
  • Publication number: 20140041909
    Abstract: A method for reducing roughens of the metals on a ceramic substrate having metal filled via holes, comprising forming via holes, a seed layer, and through film coating, exposure and development process followed by multiple steps of DC electroplating to achieve copper circuit with desired surface roughness.
    Type: Application
    Filed: July 17, 2013
    Publication date: February 13, 2014
    Inventors: Hsiang-Wei TSENG, Kuan-Chou Chen, Han-Chung Chang, Cheng-Feng Chou, Chan-Li Lin, Yuan-Chen Hsu