Patents by Inventor Cheng Feng LEE

Cheng Feng LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105121
    Abstract: An electronic device includes a substrate, a first silicon transistor, a second silicon transistor and a first oxide semiconductor transistor. The first silicon transistor, the second silicon transistor and the first oxide semiconductor transistor are disposed on the substrate. The first silicon transistor has a first terminal electrically connected to a first voltage level, a second terminal and a control terminal. The second silicon transistor has a first terminal electrically connected to the second terminal of the first silicon transistor, a second terminal electrically connected to a second voltage level, and a control terminal electrically connected to the control terminal of the first silicon transistor. The first oxide semiconductor transistor has a first terminal electrically connected to the first terminal of the second silicon transistor. Wherein, a voltage value of the first voltage level is greater than a voltage value of the second voltage level.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Inventors: Lien-Hsiang CHEN, Kung-Chen KUO, Ming-Chun TSENG, Cheng-Hsu CHOU, Kuan-Feng LEE
  • Patent number: 11944019
    Abstract: A memory device includes a substrate, a transistor disposed over the substrate, an interconnect structure disposed over and electrically connected to the transistor, and a memory stack disposed between two adjacent metallization layers of the interconnect structure. The memory stack includes a bottom electrode disposed over the substrate and electrically connected to a bit line, a memory layer disposed over the bottom electrode, a selector layer disposed over the memory layer, and a top electrode disposed over the selector layer and electrically connected to a word line. Besides, at least one moisture-resistant layer is provided adjacent to and in physical contact with the selector layer, and the at least one moisture-resistant layer includes an amorphous material.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Feng Hsu, Chien-Min Lee, Tung-Ying Lee, Cheng-Hsien Wu, Hengyuan Lee, Xinyu Bao
  • Patent number: 11925273
    Abstract: An armrest for a chair includes a first member and a second member. The first member includes a body extending in a longitudinal direction from a first end to a second end. The body includes one or more recesses. The first member also includes one or more magnets disposed in the one or more recesses. The second member is releasably attached to the first member. The second member includes a cavity configured to receive the first member and one or more magnetizable plate members disposed in the cavity. The one or more magnetizable plate members are adjacent the one or more magnets when the first member is received in the cavity.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: March 12, 2024
    Assignee: SECRETLAB SG PTE. LTD.
    Inventors: Vincent Sin, Jon Hao Chan, Elroy Cheng Feng Lee
  • Patent number: 11719589
    Abstract: A pressure sensor assembly includes an external housing unit; a sensor unit received within the external housing unit, the external housing unit has an external surface including a mounting surface; a sensing element mounted within the sensor unit and including a pressure-sensing surface; a substrate upon which the mounting surface is mounted; an air passage to enable air to impinge on the sensing element; and a filling passage, separate from the air flow passage, for the introduction of an encapsulation material onto the sensor unit, during assembly. The encapsulation material covers at least a part of the external surface of the sensor unit but does not cover the pressure-sensing surface of the sensing element which remains directly exposed to air within the air passage.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: August 8, 2023
    Assignee: DELPHI TECHNOLOGIES IP LIMITED
    Inventors: Jia luan Lau, Cheng Feng Lee
  • Publication number: 20230000255
    Abstract: A head support assembly and a method of supporting a cushion on a headrest are disclosed. The head support assembly comprises a headrest extending upwardly from a seatback, the headrest comprising one or more magnetizable plate members; a cushion adjustable between a first position and a second position relative to the headrest, the cushion comprising a plurality of magnets, wherein the one or more magnetizable plate members and the plurality of magnets are configured to magnetically attach the cushion to the headrest for supporting the cushion at the first or second position.
    Type: Application
    Filed: July 1, 2022
    Publication date: January 5, 2023
    Inventors: Vincent Sin, Jon Hao Chan, Gabriel Lim, Elroy Cheng Feng Lee, Hong Kai Lam
  • Publication number: 20220322835
    Abstract: An armrest for a chair includes a first member and a second member. The first member includes a body extending in a longitudinal direction from a first end to a second end. The body includes one or more recesses. The first member also includes one or more magnets disposed in the one or more recesses. The second member is releasably attached to the first member. The second member includes a cavity configured to receive the first member and one or more magnetizable plate members disposed in the cavity. The one or more magnetizable plate members are adjacent the one or more magnets when the first member is received in the cavity.
    Type: Application
    Filed: April 11, 2022
    Publication date: October 13, 2022
    Inventors: Vincent Sin, Jon Hao Chan, Elroy Cheng Feng Lee
  • Publication number: 20220082465
    Abstract: A pressure sensor assembly includes an external housing unit; a sensor unit received within the external housing unit, the external housing unit has an external surface including a mounting surface; a sensing element mounted within the sensor unit and including a pressure-sensing surface; a substrate upon which the mounting surface is mounted; an air passage to enable air to impinge on the sensing element; and a filling passage, separate from the air flow passage, for the introduction of an encapsulation material onto the sensor unit, during assembly. The encapsulation material covers at least a part of the external surface of the sensor unit but does not cover the pressure-sensing surface of the sensing element which remains directly exposed to air within the air passage.
    Type: Application
    Filed: December 19, 2019
    Publication date: March 17, 2022
    Inventors: Jia Iuan LAU, Cheng Feng LEE