Abstract: A method for performing light shaping with aid of an adaptive projector and associated apparatus are provided.

Abstract: A method for performing light shaping with aid of an adaptive projector and associated apparatus are provided.

Abstract: A processing apparatus for overlay shift includes a storage unit and a control unit, and is applicable to a semiconductor wafer with several inspection regions. Each of the inspection regions has several sets of overlay marks for inspection. One set of overlay marks includes an original alignment mark without any overlay shift, and several split alignment marks with predetermined overlay shifts arranged near the original alignment mark. The original after-etch inspection (AEI) overlay data of the inspection regions is stored in the storage unit. The after-develop inspection (ADI) overlay data of the original alignment mark and the split alignment marks are compared with the original AEI overlay data by the control unit, thereby acquiring ADI pre-bias data of the original alignment mark and the split alignment marks. The control unit determines whether an overlay shift compensation is performed according to the acquired ADI pre-bias data.

Abstract: A structured-light three-dimensional (3D) scanning system includes a projector that emits a projected light with a predetermined pattern onto an object; an image capture device that generates a captured image according to a reflected light reflected from the object, the predetermined pattern of the projected light being distorted due to 3D shape of the object, thereby resulting in a distorted pattern; a depth decoder that converts the distorted pattern into a depth map representing the 3D shape of the object; and a depth fusion device that generates a fused depth map according to at least two different depth maps associated with the object.

Abstract: A fin field effect transistor (FinFET) device structure is provided. The FinFET device structure includes a plurality of fin structures above a substrate, an isolation structure over the substrate and between the fin structures, and a gate structure formed over the fin structure. The FinFET device structure includes a source/drain (S/D) structure over the fin structure, and the S/D structure is adjacent to the gate structure. The FinFET device structure also includes a metal silicide layer over the S/D structure, and the metal silicide layer is in contact with the isolation structure.

Abstract: The device includes a projecting device, an image sensor and a computing circuit. The projecting device provides a light beam having a predetermined pattern that is projected onto an object. The image sensor receives the light beam reflected from the object to generate an image. The computing circuit compares the image with a first ground-truth image and a ground-truth image to generate a first depth value and a second depth value respectively. The first and second depth values are combined to generate a depth result.

Abstract: Guide holders for engaging a motherboard sled with an input-output sled stacked thereon within an electronic chassis, are disclosed. The electronic chassis includes a motherboard sled having a housing having a first sidewall and a second sidewall opposite to the first sidewall, a first guide holder and a second guide holder. The first guide holder is coupled to the first sidewall and includes a first plurality of slots for directing motion of a first plurality of guide pins of an input-output sled in a predetermined direction. The second guide holder is coupled to the second sidewall and includes a second plurality of slots for directing motion of a second plurality of guide pins of the input-output sled in the predetermined direction. The motion of the first plurality of guide pins and the second plurality of guide pins, upon completion, locks the input-output sled to the motherboard sled.

Abstract: An electronic chassis includes a motherboard sled configured to engage in or out of the electronic chassis. The motherboard sled includes a housing and a mechanical actuator for engaging the motherboard sled into or out of an electronic chassis. The mechanical actuator includes at least one lever rotatably coupled to a hinge to form a first fulcrum adjacent to a vertical edge of a front surface of the housing. The mechanical actuator also includes a guiding arm adjacent to the hinge and mechanically connected to the at least one lever to form a second fulcrum. The guiding arm rotates between a secured position adjacent to the front surface and an unsecured position away from the front surface.

Abstract: A carrier for different electronic components for installation in an expansion card for a computing device is disclosed. The carrier conforms to M.2 standards such as an M.2 22110 form factor. The carrier has a top heat sink and a bottom heat sink. A circuit board includes the electronic device. The circuit board is seated between the top heat sink and the bottom heat sink. A side clip includes a top panel and a bottom panel. The side clip has an open position and a closed position. When the side clip is in the closed position, the top panel of the side clip contacts the top heat sink, and the bottom panel of the side clip contacts the bottom heat sink, to hold the top heat sink to the bottom heat sink.

Abstract: Guide holders for engaging a motherboard sled with an input-output sled stacked thereon within an electronic chassis, are disclosed. The electronic chassis includes a motherboard sled having a housing having a first sidewall and a second sidewall opposite to the first sidewall, a first guide holder and a second guide holder. The first guide holder is coupled to the first sidewall and includes a first plurality of slots for directing motion of a first plurality of guide pins of an input-output sled in a predetermined direction. The second guide holder is coupled to the second sidewall and includes a second plurality of slots for directing motion of a second plurality of guide pins of the input-output sled in the predetermined direction. The motion of the first plurality of guide pins and the second plurality of guide pins, upon completion, locks the input-output sled to the motherboard sled.

Abstract: An electronic chassis includes a motherboard sled configured to engage in or out of the electronic chassis. The motherboard sled includes a housing and a mechanical actuator for engaging the motherboard sled into or out of an electronic chassis. The mechanical actuator includes at least one lever rotatably coupled to a hinge to form a first fulcrum adjacent to a vertical edge of a front surface of the housing. The mechanical actuator also includes a guiding arm adjacent to the hinge and mechanically connected to the at least one lever to form a second fulcrum. The guiding arm rotates between a secured position adjacent to the front surface and an unsecured position away from the front surface.

Abstract: A computer chassis can include an airflow channel for permitting airflow specifically to cool one or more power supply units (PSUs) within respective power supply receiving space(s). The chassis can include a baffle device positioned between the power supply receiving space and the airflow channel for directing airflow through the PSU into the airflow channel. The airflow channel can be located between first and second spaces of the chassis, each containing computing components. The baffle device can include a cable passthrough that receives a cable that facilitates communication between component(s) in the first space and component(s) in the second space. The baffle device can include one or more ribs that stop the PSU from being fully inserted into the power supply receiving space when the PSU is inserted in an incorrect orientation, thus signaling to the user to remove the PSU and re-insert it in a correct orientation.

Abstract: A computer chassis can include an airflow channel for permitting airflow specifically to cool one or more power supply units (PSUs) within respective power supply receiving space(s). The chassis can include a baffle device positioned between the power supply receiving space and the airflow channel for directing airflow through the PSU into the airflow channel. The airflow channel can be located between first and second spaces of the chassis, each containing computing components. The baffle device can include a cable passthrough that receives a cable that facilitates communication between component(s) in the first space and component(s) in the second space. The baffle device can include one or more ribs that stop the PSU from being fully inserted into the power supply receiving space when the PSU is inserted in an incorrect orientation, thus signaling to the user to remove the PSU and re-insert it in a correct orientation.

Abstract: A riser bracket for supporting a riser board and a computer card inserted into the riser board is disclosed. The riser bracket includes a first riser bracket piece, a first latch, a second riser bracket piece, and a second latch. The computer card and the riser board are positioned on a motherboard. The first riser bracket piece is configured to be coupled to the riser board. The first latch is configured to the first riser bracket piece to a first mounting point of the motherboard, and to move between a latched position and an unlatched position. The second riser bracket piece is coupled to the first riser bracket piece. The second latch is configured to couple the second riser bracket piece to a second mounting point of the motherboard, and move between a latched position and an unlatched position.

Abstract: A carrier for different electronic components for installation in an expansion card for a computing device is disclosed. The carrier conforms to M.2 standards such as an M.2 22110 form factor. The carrier has a top heat sink and a bottom heat sink. A circuit board includes the electronic device. The circuit board is seated between the top heat sink and the bottom heat sink. A side clip includes a top panel and a bottom panel. The side clip has an open position and a closed position. When the side clip is in the closed position, the top panel of the side clip contacts the top heat sink, and the bottom panel of the side clip contacts the bottom heat sink, to hold the top heat sink to the bottom heat sink.

Abstract: A node sled is for installation into an electronics chassis. The node sled includes a housing that contains electronic components. The housing includes a front bracket and a catch mechanism. The node sled further includes a lever having an engagement arm, an actuation arm, and a mounting portion. The mounting portion is pivotably mounted to the housing. The actuation arm is manually moveable between a first position in which the engagement arm locks the node sled into the electronics chassis, and a second position in which the engagement arm is released from the electronics chassis. The actuation arm has a latch that engages the catch mechanism in response to the actuation arm being in the first position.

Abstract: A node sled is for installation into an electronics chassis. The node sled includes a housing that contains electronic components. The housing includes a front bracket and a catch mechanism. The node sled further includes a lever having an engagement arm, an actuation arm, and a mounting portion. The mounting portion is pivotably mounted to the housing. The actuation arm is manually moveable between a first position in which the engagement arm locks the node sled into the electronics chassis, and a second position in which the engagement arm is released from the electronics chassis. The actuation arm has a latch that engages the catch mechanism in response to the actuation arm being in the first position.

Abstract: A riser bracket for supporting a riser board and a computer card inserted into the riser board is disclosed. The riser bracket includes a first riser bracket piece, a first latch, a second riser bracket piece, and a second latch. The computer card and the riser board are positioned on a motherboard. The first riser bracket piece is configured to be coupled to the riser board. The first latch is configured to the first riser bracket piece to a first mounting point of the motherboard, and to move between a latched position and an unlatched position. The second riser bracket piece is coupled to the first riser bracket piece. The second latch is configured to couple the second riser bracket piece to a second mounting point of the motherboard, and move between a latched position and an unlatched position.

Abstract: A baseboard management controller (BMC) carrier module that contains a BMC carrier bracket and a thumb screw is disclosed. The BMC carrier bracket has a back plate, a top plate, a side plate, and a corner plate. The corner plate includes a first section and a second section. The second section of the corner plate extends perpendicularly from the first section of the corner plate. The BMC carrier bracket is configured to receive a BMC board between the first section of the corner plate and the side plate. The BMC board includes an aperture to receive a screw to secure the BMC board to the BMC carrier bracket, at a distance from the back plate. The thumb screw is coupled to the second section of the corner plate of the BMC carrier bracket, and is configured to bias a memory carrier module against the side plate.

Abstract: A baseboard management controller (BMC) carrier module that contains a BMC carrier bracket and a thumb screw is disclosed. The BMC carrier bracket has a back plate, a top plate, a side plate, and a corner plate. The corner plate includes a first section and a second section. The second section of the corner plate extends perpendicularly from the first section of the corner plate. The BMC carrier bracket is configured to receive a BMC board between the first section of the corner plate and the side plate. The BMC board includes an aperture to receive a screw to secure the BMC board to the BMC carrier bracket, at a distance from the back plate. The thumb screw is coupled to the second section of the corner plate of the BMC carrier bracket, and is configured to bias a memory carrier module against the side plate.