Abstract: Disclosed are a zoom lens and an imaging device. An optical axis is formed within the zoom lens, the zoom lens is provided with an object side and an image side opposite to the object side along an optical axis direction, the zoom lens includes a base, a fixed lens assembly, a moving lens assembly and a linear magnetic drive structure, the fixed lens assembly is mounted on the base, the fixed lens assembly includes a first fixed lens group and a second fixed lens group provided at intervals along the optical axis direction, the moving lens assembly is movably mounted on the base along the optical axis direction, and the moving lens assembly includes a first moving lens group and a second moving lens group provided at intervals along the optical axis direction.

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.

Abstract: The present disclosure provides a system and method to convert three-dimensional data into a two-dimensional height displacement map and extract the three-dimensional features and dimensions of a three-dimensional object using a two-dimensional image processing technique. An illumination source of the system scans across the workspace using a line laser and generates a two-dimensional height displacement map of the workspace. The individual pixel location represents an actual workspace sampled location. The pixel gray scale intensity represents the Z displacement height at the pixel location. A processing device processes the features and dimensions within two-dimensional image as a gray scale using two-dimensional image processing such as pattern match, blob, convolution and edge detection.

Abstract: A method and a system for inspecting a wafer. The system comprises an optical inspection head, a wafer table, a wafer stack, a XY table and vibration isolators. The optical inspection head comprises a number of illuminators, image capture devices, objective lens and other optical components. The system and method enables capture of brightfield images, darkfield images, 3D profile images and review images. Captured images are converted into image signals and transmitted to a programmable controller for processing. Inspection is performed while the wafer is in motion. Captured images are compared with reference images for detecting defects on the wafer. An exemplary reference creation process for creating reference images and an exemplary image inspection process is also provided by the present invention. The reference image creation process is an automated process.

Abstract: The present disclosure provides a system and method to convert three-dimensional data into a two-dimensional height displacement map and extract the three-dimensional features and dimensions of a three-dimensional object using a two-dimensional image processing technique. An illumination source of the system scans across the workspace using a line laser and generates a two-dimensional height displacement map of the workspace. The individual pixel location represents an actual workspace sampled location. The pixel gray scale intensity represents the Z displacement height at the pixel location. A processing device processes the features and dimensions within two-dimensional image as a gray scale using two-dimensional image processing such as pattern match, blob, convolution and edge detection.

Abstract: A wall hanger includes a fastening member, a linking member including a top wall, a lateral wall, and a bottom wall, and a sleeving member. A first connecting portion is at the fastening member. A second connecting portion is at the top wall to connect with the first connecting portion. The lateral wall is extending vertically toward a first direction distant from the top wall and has first teeth. The bottom wall is extending toward the first direction from the lateral wall and is parallel to the top wall. The sleeving member includes a base member, a supporting wall standing on the base member, and an abutting wall extending from the supporting wall and parallel to the base member. A groove is defined by the base member, the supporting wall, and the abutting wall. The top surface of the abutting wall has second teeth.

Abstract: A wall hanger includes a fastening member, a linking member including a top wall, a lateral wall, and a bottom wall, and a sleeving member. A first connecting portion is at the fastening member. A second connecting portion is at the top wall to connect with the first connecting portion. The lateral wall is extending vertically toward a first direction distant from the top wall and has first teeth. The bottom wall is extending toward the first direction from the lateral wall and is parallel to the top wall. The sleeving member includes a base member, a supporting wall standing on the base member, and an abutting wall extending from the supporting wall and parallel to the base member. A groove is defined by the base member, the supporting wall, and the abutting wall. The top surface of the abutting wall has second teeth.

Abstract: An object positioning system includes an object positioning device and a detecting device. The object positioning device includes one or more magnetic bars forming a marked magnetic field. The detecting device includes a magnetic field generating unit for outputting a detecting magnetic field according to a detecting signal in an electromagnetic conversion process, and an analyzing unit for detecting whether the detecting signal varies when the detecting magnetic field passes the marked magnetic field along a moving direction. The analyzing unit analyzes whether a character of the variation corresponds to the marked magnetic field and accordingly outputs a detecting result. When people are trapped under snow or collapsed buildings because of an avalanche or an earthquake, the system can be utilized to find out trapped people. The system can also be utilized to find out objects buried underground. Money and time consumed by mass excavation can be saved.

Abstract: A wall mount hanger includes a hanging section and a sleeve section. The hanging section is protrusively disposed on a wall surface and has a first arc surface and a stop portion. The first arc surface has plural protruding teeth, and the stop portion is protrusively disposed on the first arc surface. The sleeve section has a first surface and a second surface lower than the first surface. A second arc surface and a slot are disposed between the first surface and the second surface. The second arc surface has plural protruding teeth. The protruding teeth of the second arc surface are engaged with the protruding teeth of the first arc surface. Since the sleeve section and the hanging section are engaged with each other through the protruding teeth, the sleeve section can be rotated fixed to a required angle relative to the hanging section.

Abstract: A system for on-the-fly inspection of components is provided. The system includes a prism structure disposed below an inspection item transit path. An image data system is disposed below the prism structure. A lighting assembly provides a first lighting source to illuminate a plurality of sides of an inspection item and a second lighting source to illuminate a bottom of the inspection item.

Abstract: A system for inspecting components is provided. The system includes a prism having a first end, a second end, a first reflecting surface, and a second reflecting surface. The first end of the prism is located in a plane that is parallel to and axially separated from a plane of one or more of a plurality of inspection pieces. An image data system is disposed beyond the second end of the prism and generates image data of one or more of the inspection piece that includes a top surface of at least one of the inspection pieces and at least one side of at least one of the inspection pieces. An inspection piece transportation system, such as a pick and place tool or conveyor, moves a plurality of inspection pieces past the first end of the prism through an inspection area.

Abstract: A method and a system for inspecting a wafer. The system comprises an optical inspection head, a wafer table, a wafer stack, a XY table and vibration isolators. The optical inspection head comprises a number of illuminators, image capture devices, objective lens and other optical components. The system and method enables capture of brightfield images, darkfield images, 3D profile images and review images. Captured images are converted into image signals and transmitted to a programmable controller for processing. Inspection is performed while the wafer is in motion. Captured images are compared with reference images for detecting defects on the wafer. An exemplary reference creation process for creating reference images and an exemplary image inspection process is also provided by the present invention. The reference image creation process is an automated process.

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer.

Abstract: A system for on-the-fly inspection of components is provided. The system includes a prism structure disposed below an inspection item transit path. An image data system is disposed below the prism structure. A lighting assembly provides a first lighting source to illuminate a plurality of sides of an inspection item and a second lighting source to illuminate a bottom of the inspection item.

Abstract: A system for inspecting components is provided. The system includes a prism having a first end, a second end, a first reflecting surface, and a second reflecting surface. The first end of the prism is located in a plane that is parallel to and axially separated from a plane of one or more of a plurality of inspection pieces. An image data system is disposed beyond the second end of the prism and generates image data of one or more of the inspection piece that includes a top surface of at least one of the inspection pieces and at least one side of at least one of the inspection pieces. An inspection piece transportation system, such as a pick and place tool or conveyor, moves a plurality of inspection pieces past the first end of the prism through an inspection area.

Abstract: A new way of providing search results that include audio/video thumbnails for searches of audio and video content is disclosed. An audio/video thumbnail includes one or more audio/video segments retrieved from within the content of audio/video files selected as relevant to a search or other user input. For an audio/video thumbnail of more than one segment, the audio/video segments from an individual audio/video file responsive to the search are concatenated into a multi-segment audio/video thumbnail. The audio/video segments provide enough information to be indicative of the nature of the audio/video file from which each of the audio/video thumbnails is retrieved, while also fast enough that a user can scan through a series of audio/video thumbnails relatively quickly.

Abstract: A composite mouse assembly for a computer includes a mouse case. A computer interface encoder is contained in the mouse case. A positional sensor is connected to the interface encoder for controlling a screen indicator used for selecting menu items appearing on a display screen of the computer. A wireless remote control device is connected to the positional sensor and includes a plurality of user-activated direction control keys for transmitting digital serial encoded signals. A receiver unit is contained in the mouse case for receiving and amplifying the digital signals transmitted by the remote control device. A decoder is provided for interpreting the digital signals transferred by the receiver unit into one of a plurality digital direction control signals corresponding to the direction control keys of the remote control device. A converter converts the digital direction control signals to analog signals.