Abstract: A power management integrated circuit (PMIC) soldered onto a printed circuit board, includes: a first output stage circuit and a second output stage circuit. In a separate power supply configuration, first and second current inflow pins of the first and second output stage circuits are soldered to first and second current inflow printed lines, respectively, wherein the first and second current inflow printed lines are not directly electrically connected to each other; and, first and second current outflow pins of the first and second output stage circuits are soldered to first and second current outflow printed lines respectively, wherein the first and second current outflow printed lines are not directly electrically connected to each other. In a cooperation power supply configuration, the first and second current inflow pins are both soldered to a common current inflow printed line of the PCB, to be electrically connected with each other.

Abstract: A laptop computer including a system host, a modular platform, a rail structure, and at least one tool is provided. The rail structure is disposed at the system host and the modular platform, and the modular platform slides relative to the system host via the rail structure to be assembled to or detached from the system host. The tool is plugged into or out of the system host, and the tool is located on a sliding path of the modular platform when the tool is assembled to the system host.

Abstract: A key structure includes a base, an elastic member disposed on the base, a scissors structure movably disposed on the base, and a keycap module having a carrier and a light source. The carrier is detachably assembled to the scissors structure and abuts the elastic member. The light source is disposed in the carrier. The light source is electrically connected to a bottom portion of the base through a flexible circuit member penetrating the carrier, passing the scissors structure, and penetrating the base. A top portion of the carrier has light transmittance, so that light of the light source can pass through the top portion to be projected from the key structure.

Abstract: A laptop computer includes a body, a bracket disposed in the body, a latching member movably disposed on the bracket, a first key module detachably assembled onto the bracket, and a second key module disposed on the bracket. A part of the first key module is located on a moving path of the latching member. The latching member is adapted to be driven by an external force to push the part of the first key module away from the bracket.

Abstract: A key structure including a base plate, a thin film circuit, a display key, an elastic supporting member, and a lifting mechanism is provided. The thin film circuit is disposed on the base plate. The display key is disposed above the thin film circuit. The elastic supporting member is disposed between the display key and the thin film circuit. The lifting mechanism is disposed between the display key and the base plate.

Abstract: A keyboard including an electronic paper display module, a front light module, a supporting member, a light-transmitting keycap, and an elevating support is provided. The front light module is disposed on the electronic paper display module. The supporting member is disposed on the front light module. The supporting member includes an elastic supporting protrusion and a light guide part embedded in the elastic supporting protrusion, and the elastic supporting protrusion has an opening exposing a portion of the front light module. The light guide part is located in the opening of the elastic supporting protrusion. The light-transmitting keycap is disposed on the elastic supporting protrusion and covers the opening of the elastic supporting protrusion. The elevating support is disposed between the light-transmitting keycap and the front light module.

Abstract: A device and method for fabricating the same is disclosed. For example, the device includes a sensor having a front side and a back side, a metal interconnect layer formed on the front side of the sensor, an anti-reflective coating formed on the back side of the sensor, a composite etch stop mask layer formed on the anti-reflective coating. wherein the composite etch stop mask layer includes a silicon nitride layer and a stressed layer. A percentage of Si—H bonds in the silicon nitride layer is greater than a percentage of Si—H bonds in the stressed layer.

Abstract: A key structure, including a base plate, a thin film circuit, a dome switch, a scissor structure, an elastic piece, and a keycap, is provided. The thin film circuit is disposed on the base plate. The dome switch is disposed on the thin film circuit. The scissor structure is disposed on the base plate, wherein the scissor structure includes a first support and a second support pivotally connected to the first support, and the second support surrounds the first support. The first support has a trigger part, and the second support has a chamber disposed corresponding to the trigger part. The elastic piece is engaged inside the chamber, wherein the elastic piece has an interfering part located outside the chamber, and the interfering part is located on a moving path of the trigger part. The keycap is disposed on the scissor structure and the dome switch.

Abstract: A device and method for fabricating the same is disclosed. For example, the device includes a sensor having a front side and a back side, a metal interconnect layer formed on the front side of the sensor, an anti-reflective coating formed on the back side of the sensor, a composite etch stop mask layer formed on the anti-reflective coating wherein the composite etch stop mask layer includes a hydrogen rich layer and a compressive high density layer, and a light filter formed on the composite etch stop mask layer.