Abstract: A circuit is disclosed. The circuit includes a first pump circuit configured to receive a first reference voltage and provide an output voltage at a first level based on the first reference voltage. The circuit includes a second pump circuit configured to receive a second reference voltage and provide the output voltage at a second level based on the second reference voltage. The first reference voltage is lower than the second reference voltage, and the first level is lower than the second level.

Abstract: A temperature control module and a temperature control method, which are suitable for a projector. A thermal sensor is disposed on the projector and suitable for sensing the ambient temperature to generate an ambient temperature sensing signal. A cooling device is disposed on the projector and suitable for cooling a target element of the projector. When the projector is in a brightness adjustment mode, a control circuit generates a control signal to the cooling device according to the ambient temperature sensing signal from the thermal sensor and the brightness setting signal of the projector. The cooling device adjusts the temperature regulation operation performed on the target element according to the control signal.

Abstract: A heat dissipation module disposed in a projection device and dissipating heat from a heat source includes a heat dissipation member, a thermoelectric cooler, a heat conduction member, and a sealant. The thermoelectric cooler has a heat absorbing surface, a heat dissipating surface contacting the heat dissipation member, and a first side surface adjacent between the heat absorbing surface and the heat dissipating surface. The heat conduction member has a first contact surface, a second contact surface opposite to the first contact surface, and a second side surface adjacent between the first and the second contact surfaces. The first contact surface contacts the heat source, and at least part of the second contact surface contacts the heat absorbing surface. The sealant is filled between the heat dissipation member and the heat source to cover the first side surface and the second side surface. A projection device is also provided.

Abstract: A projection device including a light source module, an optical engine module and a projection lens is provided. The optical engine module includes a casing, a heat-conducting base, a heat pipe, a light valve and a thermal conductive layer. The casing has an opening. The heat-conducting base has an assembly opening, wherein the heat-conducting base is disposed on the casing, and the assembly opening is aligned with the opening of the casing. The heat pipe is connected to the heat-conducting base and disposed on the heat-conducting base. The light valve is disposed on the heat-conducting base corresponding to the assembly opening. The light valve is thermally coupled to the heat-conducting base through the thermal conductive layer. The light valve has a first stepped surface and a second stepped surface, and the thermal conductive layer covers at least a part of the first stepped surface and the second stepped surface.

Abstract: A circuit includes a multiplier circuit that receives a signed mantissa of each data element of pluralities of input and weight data elements and generates two's complement products by performing multiplication and reformatting operations on some or all of the input data element signed mantissas and some or all of the weight data element signed mantissas, a summing circuit that receives an exponent of each data element of the pluralities of input and weight data elements and generates sums by adding each input data element exponent to each weight data element exponent, a shifting circuit that shifts each product by an amount equal to a difference between a corresponding sum and a maximum sum, and an adder tree that generates a mantissa sum from the shifted products.

Abstract: A method for fabricating a semiconductor device includes following steps: A patterned mask layer including a plurality of standing walls and a covering part is formed on a surface of a semiconductor substrate, wherein two adjacent standing walls define a first opening exposing a part of the surface, and the covering part blankets the surface. A first patterned photoresist layer is formed to partially cover the covering part. A first etching process is performed to form a first trench in the substrate, passing through the surface and aligning with the first opening. A portion of the patterned mask layer is removed to form a second opening exposing another portion of the surface. A second etching process is performed to form a second trench in the substrate and define an active area on the surface. The depth of the first trench is greater than that of the second trench.

Abstract: A method for fabricating a semiconductor device includes following steps: A patterned mask layer including a plurality of standing walls and a covering part is formed on a surface of a semiconductor substrate, wherein two adjacent standing walls define a first opening exposing a part of the surface, and the covering part blankets the surface. A first patterned photoresist layer is formed to partially cover the covering part. A first etching process is performed to form a first trench in the substrate, passing through the surface and aligning with the first opening. A portion of the patterned mask layer is removed to form a second opening exposing another portion of the surface. A second etching process is performed to form a second trench in the substrate and define an active area on the surface. The depth of the first trench is greater than that of the second trench.

Abstract: A processing method for an electronic expense certification includes steps of: displaying a 2D barcode on a mobile device, reading the 2D barcode by a first 2D barcode reader at a first time period to generate a first time data, reading the 2D barcode by a second 2D barcode reader at a second time period to generate a second time data, and generating an expense data according to the first and second time data.