Patents by Inventor Cheng-Han Shen

Cheng-Han Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250038073
    Abstract: A package structure and a method for forming the same are provided. The package structure includes a first package structure and a second package structure. The first package structure includes a first device formed over a first substrate. The first device includes a first conductive plug connected to a through substrate via (TSV) structure formed in the first substrate. A buffer layer surrounds the first substrate. A first bonding layer is formed over the first substrate and the buffer layer. The second package structure includes a second device formed over a second substrate. A second bonding layer is formed over the second device. A hybrid bonding structure is between the first package structure and the second package structure by bonding the first bonding layer to the second bonding layer.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 30, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ke-Han SHEN, Chih-Yuan CHEN, Jiung WU, Hung-Yi Kuo, Chung-Ju LEE, Tung-He CHOU, Ji CUI, Kuo-Chung YEE, Chen-Hua YU, Cheng-Chieh HSIEH, Yu-Jen LIEN, Yian-Liang KUO, Shih-Hao TSENG, Jen Yu WANG, Tzu-Chieh Chou
  • Patent number: 12211789
    Abstract: A method includes following steps. First transistors are formed over a substrate. An interconnect structure is formed over the plurality of first transistors. A dielectric layer is formed over the interconnect structure. 2D semiconductor seeds are formed over the dielectric layer. The 2D semiconductor seeds are annealed. An epitaxy process is performed to laterally grow a plurality of 2D semiconductor films respectively from the plurality of 2D semiconductor seeds. Second transistors are formed on the plurality of 2D semiconductor films.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: January 28, 2025
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL YANG MING CHIAO TUNG UNIVERSITY
    Inventors: Chenming Hu, Shu-Jui Chang, Chen-Han Chou, Yen-Teng Ho, Chia-Hsing Wu, Kai-Yu Peng, Cheng-Hung Shen
  • Patent number: 8929447
    Abstract: In an image deblurring method, an image processor determines an absolute difference between a pixel value of each pixel in a current image frame and a pixel value of a corresponding pixel in a reference image frame to obtain a total absolute difference corresponding to the current image frame by summing up the absolute differences corresponding respectively the pixels of the current image frame. When the total absolute difference is smaller than a predetermined first threshold value and not smaller than a predetermined third threshold value, the image processor generates an interpolated image frame based on the current and reference image frames using one of unidirectional motion estimation and bidirectional motion estimation.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: January 6, 2015
    Assignee: Chang Jung Christian University
    Inventors: Chih-Hsien Kung, Chih-Ming Kung, Cheng-Han Shen, Chuan-Chun Ku
  • Publication number: 20140023141
    Abstract: In an image deblurring method, an image processor determines an absolute difference between a pixel value of each pixel in a current image frame and a pixel value of a corresponding pixel in a reference image frame to obtain a total absolute difference corresponding to the current image frame by summing up the absolute differences corresponding respectively the pixels of the current image frame. When the total absolute difference is smaller than a predetermined first threshold value and not smaller than a predetermined third threshold value, the image processor generates an interpolated image frame based on the current and reference image frames using one of unidirectional motion estimation and bidirectional motion estimation.
    Type: Application
    Filed: July 19, 2012
    Publication date: January 23, 2014
    Applicant: CHANG JUNG CHRISTIAN UNIVERSITY
    Inventors: Chih-Hsien Kung, Chih-Ming Kung, Cheng-Han Shen, Chuan-Chun Ku