Abstract: Dual-function input devices for a computing device may include a housing and an actuator disposed within the housing. The actuator may be pivotable relative to the housing in a first direction and a second direction. The actuator may include a first connector and a second connector. The input devices may include an input lever that is coupleable with the actuator via one of the first connector and the second connector. The actuator may be configurable between a first mode by coupling the input lever with the first connector and a second mode by coupling the input lever with the second connector. In the first mode the input lever and the actuator may be pivotable in the first direction by a first distance. In the second mode the input lever and the actuator may be pivotable in the first direction by a second distance that is greater than the first distance.

Abstract: An image sensor structure and methods of forming the same are provided. An image sensor structure according to the present disclosure includes a semiconductor substrate including a photodiode, a transfer gate transistor disposed over the semiconductor substrate and having a first channel area, a first dielectric layer disposed over the semiconductor substrate, a semiconductor layer disposed over the first dielectric layer, a source follower transistor disposed over the semiconductor layer and having a second channel area, a row select transistor disposed over the semiconductor layer and having a third channel area, and a reset transistor disposed over the semiconductor layer and having a fourth channel area. The second channel area is greater than the first channel area, the third channel area or the fourth channel area.

Abstract: A pixel sensor array of an image sensor device described herein may include a deep trench isolation (DTI) structure that includes a plurality of DTI portions that extend into a substrate of the image sensor device. Two or more subsets of the plurality of DTI portions may extend around photodiodes of a pixel sensor of the pixel sensor array, and may extend into the substrate to different depths. The different depths enable the photocurrents generated by the photodiodes to be binned and used to generate unified photocurrent. In particular, the different depths enable photons to intermix in the photodiodes, which enables quadradic phase detection (QPD) binning for increased PDAF performance. The increased PDAF performance may include increased autofocus speed, increased high dynamic range, increased quantum efficiency (QE), and/or increased full well conversion (FWC), among other examples.

Abstract: A method of making a semiconductor image sensor includes forming a photodiode in a substrate. The method further includes forming a recess in the substrate. The method further includes depositing a sacrificial material in the recess. The method further includes forming an interconnect structure over the sacrificial material. The method further includes etching a plurality of trenches in the interconnect structure. The method further includes removing the sacrificial material by passing an etchant through the plurality of trenches.

Abstract: A semiconductor image sensor includes a pixel. The pixel includes a first substrate; and a photodiode in the first substrate. The semiconductor image sensor further includes an interconnect structure electrically connected to the pixel. The semiconductor image sensor further includes a reflection structure between the interconnect and the photodiode, wherein the reflection structure is configured to reflect light passing through the photodiode back toward the photodiode.

Abstract: An image sensor includes a substrate having first and second surfaces opposite to each other, an image pixel area, and a black level calibration (BLC) area adjacent to the image pixel area. The BLC area includes a dark current sensing circuit including photo diodes disposed in the substrate, a first seal ring disposed over the second surface and surrounding the image pixel area in plan view, a second seal ring disposed over the second surface and surrounding the image pixel area in plan view such that the dark current sensing circuit is disposed between the first and second seal rings, an opaque cover disposed over the first surface and covering the dark current sensing circuit, the first and second seal rings, and one or more first trench isolation structures extending from the first surface to an inside the substrate and disposed between the first seal ring and the opaque cover.

Abstract: A semiconductor image sensor includes a pixel. The pixel includes a first substrate; and a photodiode in the first substrate. The semiconductor image sensor further includes an interconnect structure electrically connected to the pixel. The semiconductor image sensor further includes a reflection structure between the interconnect and the photodiode, wherein the reflection structure is configured to reflect light passing through the photodiode back toward the photodiode.

Abstract: In certain embodiments, a gaming pedal assembly comprises a base platform and a pedal arm rotatably coupled to the base platform at a first mounting location that provides a first axis of rotation for the pedal arm relative to the base platform. The gaming pedal assembly further includes a piston assembly having a resistance profile, the piston assembly coupled to the pedal arm at a coupling location that provides a second axis of rotation for the piston assembly relative to the pedal arm. The piston assembly is rotatably coupled to the base platform at a second mounting location that provides a third axis of rotation for the piston assembly relative to the base platform. The piston assembly compresses according to the resistance profile of the piston assembly in response to a user interface region of the pedal arm receiving a pressing force.

Abstract: In certain embodiments, a gaming pedal assembly comprises a base platform and a pedal arm rotatably coupled to the base platform at a first mounting location that provides a first axis of rotation for the pedal arm relative to the base platform. The gaming pedal assembly further includes a piston assembly having a resistance profile, the piston assembly coupled to the pedal arm at a coupling location that provides a second axis of rotation for the piston assembly relative to the pedal arm. The piston assembly is rotatably coupled to the base platform at a second mounting location that provides a third axis of rotation for the piston assembly relative to the base platform. The piston assembly compresses according to the resistance profile of the piston assembly in response to a user interface region of the pedal arm receiving a pressing force.

Abstract: A LGF roll-to-roll manufacturing includes the steps of: preparing a first optical layer with a first surface and a second surface; mechanically extruding a first integrated microstructure on the first surface of the first optical layer; subsequently coating a second optical layer on the first or second surface of the first optical layer; and curing the second optical layer to directly form a second microstructure on the first or second surface of the first optical layer. The first integrated microstructure and the second microstructure are separately formed at a time to provide a light guide film structure. In an embodiment, an additional optical layer is provided on the first optical layer.

Abstract: A mold system includes a carrier platform and an adjustment mechanism. The carrier platform is provided to arrange at least one mold member. The adjustment mechanism includes at least two adjustment units arranged on the carrier platform. Each of the adjustment units includes a positioning member and an electrically-driven adjustment member pivotally-connected therewith. In adjustment operation, the positioning members commonly engage with the mold member and are driven by the electrically-driven adjustment members.

Abstract: A LGP plate-to-plate manufacturing includes the steps of: preparing an optical substrate with a first surface and a second surface; mechanically extruding a first integrated microstructure on the first surface of the optical substrate; coating an optical layer on the first or second surface of the optical substrate; and curing the optical layer to directly form a second microstructure on the first or second surface of the optical substrate; wherein the first integrated microstructure and the second microstructure are separately formed at a time to provide a light guide plate structure. In an embodiment, an additional optical layer is provided on the optical substrate.

Abstract: A mold system includes a carrier platform and an adjustment mechanism. The carrier platform is provided to arrange at least one mold member. The adjustment mechanism includes at least two adjustment units arranged on the carrier platform. Each of the adjustment units includes a positioning member and an electrically-driven adjustment member pivot-connected therewith. In adjustment operation, the positioning members commonly engage with the mold member and are driven by the electrically-driven adjustment members.

Abstract: A LGP plate-to-plate manufacturing includes the steps of: preparing an optical substrate with a first surface and a second surface; mechanically extruding a first integrated microstructure on the first surface of the optical substrate; coating an optical layer on the first or second surface of the optical substrate; and curing the optical layer to directly form a second microstructure on the first or second surface of the optical substrate; wherein the first integrated microstructure and the second microstructure are separately formed at a time to provide a light guide plate structure. In an embodiment, an additional optical layer is provided on the optical substrate.

Abstract: A LGF roll-to-roll manufacturing includes the steps of: preparing a first optical layer with a first surface and a second surface; mechanically extruding a first integrated microstructure on the first surface of the first optical layer; subsequently coating a second optical layer on the first or second surface of the first optical layer; and curing the second optical layer to directly form a second microstructure on the first or second surface of the first optical layer; wherein the first integrated microstructure and the second microstructure are separately formed at a time to provide a light guide film structure. In an embodiment, an additional optical layer is provided on the first optical layer.