Abstract: The present invention disclose a medical image-based system for predicting lesion classification and a method thereof. The system comprises a feature data extracting module for providing a raw feature data based on a medical image, and a predicting module for outputting a predicted class and a risk index according to the raw feature data. The predicting module comprises a classification unit for generating the predicted class and a prediction score corresponding thereto according to the raw feature data, and a risk evaluation unit for generating the risk index according to the prediction score. The system provides medical personnels a reference score and a risk index to determine progression of a certain disease.

Abstract: A pixel sensor array of an image sensor device described herein may include a deep trench isolation (DTI) structure that includes a plurality of DTI portions that extend into a substrate of the image sensor device. Two or more subsets of the plurality of DTI portions may extend around photodiodes of a pixel sensor of the pixel sensor array, and may extend into the substrate to different depths. The different depths enable the photocurrents generated by the photodiodes to be binned and used to generate unified photocurrent. In particular, the different depths enable photons to intermix in the photodiodes, which enables quadradic phase detection (QPD) binning for increased PDAF performance. The increased PDAF performance may include increased autofocus speed, increased high dynamic range, increased quantum efficiency (QE), and/or increased full well conversion (FWC), among other examples.

Abstract: A method of making a semiconductor image sensor includes forming a photodiode in a substrate. The method further includes forming a recess in the substrate. The method further includes depositing a sacrificial material in the recess. The method further includes forming an interconnect structure over the sacrificial material. The method further includes etching a plurality of trenches in the interconnect structure. The method further includes removing the sacrificial material by passing an etchant through the plurality of trenches.

Abstract: A semiconductor image sensor includes a pixel. The pixel includes a first substrate; and a photodiode in the first substrate. The semiconductor image sensor further includes an interconnect structure electrically connected to the pixel. The semiconductor image sensor further includes a reflection structure between the interconnect and the photodiode, wherein the reflection structure is configured to reflect light passing through the photodiode back toward the photodiode.

Abstract: An image sensor includes a substrate having first and second surfaces opposite to each other, an image pixel area, and a black level calibration (BLC) area adjacent to the image pixel area. The BLC area includes a dark current sensing circuit including photo diodes disposed in the substrate, a first seal ring disposed over the second surface and surrounding the image pixel area in plan view, a second seal ring disposed over the second surface and surrounding the image pixel area in plan view such that the dark current sensing circuit is disposed between the first and second seal rings, an opaque cover disposed over the first surface and covering the dark current sensing circuit, the first and second seal rings, and one or more first trench isolation structures extending from the first surface to an inside the substrate and disposed between the first seal ring and the opaque cover.

Abstract: A semiconductor image sensor includes a pixel. The pixel includes a first substrate; and a photodiode in the first substrate. The semiconductor image sensor further includes an interconnect structure electrically connected to the pixel. The semiconductor image sensor further includes a reflection structure between the interconnect and the photodiode, wherein the reflection structure is configured to reflect light passing through the photodiode back toward the photodiode.

Abstract: In certain embodiments, a gaming pedal assembly comprises a base platform and a pedal arm rotatably coupled to the base platform at a first mounting location that provides a first axis of rotation for the pedal arm relative to the base platform. The gaming pedal assembly further includes a piston assembly having a resistance profile, the piston assembly coupled to the pedal arm at a coupling location that provides a second axis of rotation for the piston assembly relative to the pedal arm. The piston assembly is rotatably coupled to the base platform at a second mounting location that provides a third axis of rotation for the piston assembly relative to the base platform. The piston assembly compresses according to the resistance profile of the piston assembly in response to a user interface region of the pedal arm receiving a pressing force.

Abstract: In certain embodiments, a gaming pedal assembly comprises a base platform and a pedal arm rotatably coupled to the base platform at a first mounting location that provides a first axis of rotation for the pedal arm relative to the base platform. The gaming pedal assembly further includes a piston assembly having a resistance profile, the piston assembly coupled to the pedal arm at a coupling location that provides a second axis of rotation for the piston assembly relative to the pedal arm. The piston assembly is rotatably coupled to the base platform at a second mounting location that provides a third axis of rotation for the piston assembly relative to the base platform. The piston assembly compresses according to the resistance profile of the piston assembly in response to a user interface region of the pedal arm receiving a pressing force.

Abstract: A LGF roll-to-roll manufacturing includes the steps of: preparing a first optical layer with a first surface and a second surface; mechanically extruding a first integrated microstructure on the first surface of the first optical layer; subsequently coating a second optical layer on the first or second surface of the first optical layer; and curing the second optical layer to directly form a second microstructure on the first or second surface of the first optical layer. The first integrated microstructure and the second microstructure are separately formed at a time to provide a light guide film structure. In an embodiment, an additional optical layer is provided on the first optical layer.

Abstract: A mold system includes a carrier platform and an adjustment mechanism. The carrier platform is provided to arrange at least one mold member. The adjustment mechanism includes at least two adjustment units arranged on the carrier platform. Each of the adjustment units includes a positioning member and an electrically-driven adjustment member pivotally-connected therewith. In adjustment operation, the positioning members commonly engage with the mold member and are driven by the electrically-driven adjustment members.

Abstract: A LGP plate-to-plate manufacturing includes the steps of: preparing an optical substrate with a first surface and a second surface; mechanically extruding a first integrated microstructure on the first surface of the optical substrate; coating an optical layer on the first or second surface of the optical substrate; and curing the optical layer to directly form a second microstructure on the first or second surface of the optical substrate; wherein the first integrated microstructure and the second microstructure are separately formed at a time to provide a light guide plate structure. In an embodiment, an additional optical layer is provided on the optical substrate.

Abstract: A mold system includes a carrier platform and an adjustment mechanism. The carrier platform is provided to arrange at least one mold member. The adjustment mechanism includes at least two adjustment units arranged on the carrier platform. Each of the adjustment units includes a positioning member and an electrically-driven adjustment member pivot-connected therewith. In adjustment operation, the positioning members commonly engage with the mold member and are driven by the electrically-driven adjustment members.

Abstract: A LGP plate-to-plate manufacturing includes the steps of: preparing an optical substrate with a first surface and a second surface; mechanically extruding a first integrated microstructure on the first surface of the optical substrate; coating an optical layer on the first or second surface of the optical substrate; and curing the optical layer to directly form a second microstructure on the first or second surface of the optical substrate; wherein the first integrated microstructure and the second microstructure are separately formed at a time to provide a light guide plate structure. In an embodiment, an additional optical layer is provided on the optical substrate.

Abstract: A LGF roll-to-roll manufacturing includes the steps of: preparing a first optical layer with a first surface and a second surface; mechanically extruding a first integrated microstructure on the first surface of the first optical layer; subsequently coating a second optical layer on the first or second surface of the first optical layer; and curing the second optical layer to directly form a second microstructure on the first or second surface of the first optical layer; wherein the first integrated microstructure and the second microstructure are separately formed at a time to provide a light guide film structure. In an embodiment, an additional optical layer is provided on the first optical layer.