Abstract: A package structure is provided, in which a second electronic element having a plurality of conductive bumps is stacked on a first electronic element arranged with a positioning layer. The plurality of conductive bumps are inserted into a plurality of positioning holes of the positioning layer, and the second electronic element is bonded onto the positioning layer and electrically connected to the first electronic element via the plurality of conductive bumps, such that the hybrid bonding technology is replaced via the arrangement of the positioning holes and the conductive bumps, thereby reducing packaging costs.