Abstract: A height-adjustable electromagnetic shielding structure is located above an electronic element of a circuit board and includes an electromagnetic screen member, a connecting portion connected to the electromagnetic screen member, and a height stacking member. The height stacking member includes a coupling portion which is formed in a stepped structure and perpendicular to the electromagnetic screen member and circuit board, and contains an upper coupling portion and a lower coupling portion. The upper coupling portion has one end connected to the electromagnetic screen member through the connecting portion and another end connected to the lower coupling portion. At least two height stacking members are stacked over one another through the upper and lower coupling portions to perform height adjustment. The electromagnetic screen member, connecting portion and height stacking member are formed integrally, hence merely one set of mold is needed to reduce the cost.