Abstract: A spliced reflective display includes multiple display devices, a front light guide plate, and at least one light source. Among the multiple display devices, one display device is joined side-by-side with another to form an adjacent joint. The front light guide plate is affixed above the multiple display devices and is close to the display side. It has a top surface near the display side and includes an optical structure. The at least one light source is positioned at the side of the front light guide plate, and light therefrom reflects off the top surface of the front light guide plate onto the multiple display devices, and the reflected light from the display devices forms image light that is directed towards the display side to produce an image. The optical structure directs the path of the image light to obscure the adjacent joint from being visible on the display side.

Abstract: A double-layer cholesteric liquid crystal display and its manufacturing method are disclosed. The double-layer cholesteric liquid crystal display includes three transparent substrates, two opposing electrode layers, two cholesteric liquid crystal layers, and a first light-absorbing layer. Additionally, the double-layer cholesteric liquid crystal display incorporates two drive ICs and a second light-absorbing layer. The two drive ICs can be positioned either on the same side or on opposite sides within the non-display area of the double-layer cholesteric liquid crystal display. Furthermore, the first cholesteric liquid crystal layer exhibits a first color light, and the second cholesteric liquid crystal layer exhibits a second color light, where the colors are selected as contrasting colors. Additionally, the two cholesteric liquid crystal layers possess mutually opposite optical rotary properties.

Abstract: A device includes a semiconductor substrate, a fin structure on the semiconductor substrate, a gate structure on the fin structure, and a pair of source/drain features on both sides of the gate structure. The gate structure includes an interfacial layer on the fin structure, a gate dielectric layer on the interfacial layer, and a gate electrode layer of a conductive material on and directly contacting the gate dielectric layer. The gate dielectric layer includes nitrogen element.

Abstract: A cart for wafer transportation includes a cart body, a separator disposed between first and second wafer holders, an airtight lock configured to seal the cart body. A wafer transfer system includes a cart including a space for holding a wafer holder, a first workstation configured to load the wafer holder into the space and pressurize the space, and a second workstation configured to depressurize the space and unload the wafer holder from the space, wherein the cart is transportable between the first workstation and the second workstation. A method for transporting wafers includes docking a cart in a workstation; loading a wafer holder into a space of the cart; pressurizing the space to cause a pressure of the space to be greater than an atmospheric pressure; maintaining the pressure of the space at the pressure; and moving the cart carrying the wafer holder away from the workstation.

Abstract: A cart for wafer transportation includes a cart body, a separator disposed between first and second wafer holders, an airtight lock configured to seal the cart body. A wafer transfer system includes a cart including a space for holding a wafer holder, a first workstation configured to load the wafer holder into the space and pressurize the space, and a second workstation configured to depressurize the space and unload the wafer holder from the space, wherein the cart is transportable between the first workstation and the second workstation. A method for transporting wafers includes docking a cart in a workstation; loading a wafer holder into a space of the cart; pressurizing the space to cause a pressure of the space to be greater than an atmospheric pressure; maintaining the pressure of the space at the pressure; and moving the cart carrying the wafer holder away from the workstation.

Abstract: A charging device includes a liquid cooled cable, a charging gun, a charging station, a station connector and a communicating pipe. The liquid cooled cable has a gun end and a station end. The liquid cooled cable includes a first insulating tube, a second insulating tube, a tape, a filler and a sheath. The first insulating tube has a first channel. The second insulating tube has a second channel and a braided copper mesh. The charging gun is connected to the gun end of the liquid cooled cable. The charging gun includes a gun connector and a first liquid return channel. The station connector includes a second liquid return channel and a connection part. One end of the second liquid return channel communicates to the second channel. The connection part is connected to the station end of the liquid cooled cable.

Abstract: Embodiments include nanostructure devices and methods of forming nanostructure devices which include a treatment process to expand a sidewall spacer material to close a seam in the sidewall spacer material after deposition. The treatment process includes oxidation anneal and heat anneal to expand the sidewall spacer material and crosslink the open seam to form a closed seam, lower k-value, and decrease density.

Abstract: A device includes a semiconductor substrate, a fin structure on the semiconductor substrate, a gate structure on the fin structure, and a pair of source/drain features on both sides of the gate structure. The gate structure includes an interfacial layer on the fin structure, a gate dielectric layer on the interfacial layer, and a gate electrode layer of a conductive material on and directly contacting the gate dielectric layer. The gate dielectric layer includes nitrogen element.

Abstract: An integrated circuit (IC) device includes a master latch circuit having a data output, a slave latch circuit having a data input electrically coupled to the data output of the master latch circuit, and a clock circuit electrically coupled to the master latch circuit and the slave latch circuit. The slave latch circuit is physically between the master latch circuit and at least a part of the clock circuit.

Abstract: Embodiments include nanostructure devices and methods of forming nanostructure devices which include a treatment process to expand a sidewall spacer material to close a seam in the sidewall spacer material after deposition. The treatment process includes oxidation anneal and heat anneal to expand the sidewall spacer material and crosslink the open seam to form a closed seam, lower k-value, and decrease density.

Abstract: A ZIF socket assembly used with an integrated circuit package (6) comprises a ZIF socket (5) and a protector (7). The socket comprises a base (51) and a sliding cover (53). The base comprises a recess (514) at an end thereof. The sliding cover is moveably assembled on the base for mounting the package and comprises a slot (533) in alignment with the recess. The protector is placed upon the package and comprises a number of legs (71) extending downwardly for pressing against edges of the package. A contacting portion (73) extends outwardly from an edge of the protector. An actuating tool is inserted into the recess through the slot and drives the cover, the package and the protector to move with respect to the base, thereby achieving an electrical connection between the package and the socket.

Abstract: A conductive contact for an electrical connector is disclosed. The conductive contact comprises a lower inserting section for inserting into an external circuit board, an upper contacting section for engaging a mating lead pin of a chip, a middle fixing section for fixing onto a cooperating housing for an electrical connector, and anti-wicking means for prevention of wicking during wave soldering procedure. The anti-wicking means can be an inverted V-shaped groove formed on the fixing section or a horizontal plate stamped from the fixing section. The conductive contact can be formed by stamping and bending.

Abstract: A ZIF PGA socket (20) includes a base (22) having a plurality of passageways (24) extending vertically therethrough for receiving a corresponding number of contacts (26) therein, and a cover (28) having a corresponding number of holes (30) extending therethrough in alignment with the corresponding passageways (24) in the base (22) for allowing a corresponding number of pins extending from the PGA component. A lever (44) includes a cam shaft (48) embedded within a channel (50) formed adjacent the rear region of the socket (20) wherein cover (28) includes a retention device (54) and the base includes a restriction plane (64) to cooperate with the retention device (54) of the cover (28), and both of the retention device (54) and the restriction plane (64) are disposed adjacent the cam shaft (48) for efficiently fastening the cover (28) and the base (22) together to resist the larger resistance force occurring thereabout during the socket (20) in a closed state.