Abstract: A cart for wafer transportation includes a cart body, a separator disposed between first and second wafer holders, an airtight lock configured to seal the cart body. A wafer transfer system includes a cart including a space for holding a wafer holder, a first workstation configured to load the wafer holder into the space and pressurize the space, and a second workstation configured to depressurize the space and unload the wafer holder from the space, wherein the cart is transportable between the first workstation and the second workstation. A method for transporting wafers includes docking a cart in a workstation; loading a wafer holder into a space of the cart; pressurizing the space to cause a pressure of the space to be greater than an atmospheric pressure; maintaining the pressure of the space at the pressure; and moving the cart carrying the wafer holder away from the workstation.

Abstract: A collection and test device for a rapid test is provided. The device comprises a test fluid accommodation part having a test fluid accommodation space, a test paper accommodation part having a test paper accommodation space, and a collection probe having a channel for the test fluid to flow out from the collection probe. The two ends of the test paper accommodation part are respectively connected to the test fluid accommodation part and the collection probe, and the test paper accommodation space communicates with the channel of the collection probe. The test fluid accommodation space and the test paper accommodation space are separated from each other by a temporary barrier. The temporary barrier can be manually removed or broken to make the test fluid accommodation space communicate with the test paper accommodation space. The device of the present invention can provide the test results conveniently and rapidly.

Abstract: A cart for wafer transportation includes a cart body, a separator disposed between first and second wafer holders, an airtight lock configured to seal the cart body. A wafer transfer system includes a cart including a space for holding a wafer holder, a first workstation configured to load the wafer holder into the space and pressurize the space, and a second workstation configured to depressurize the space and unload the wafer holder from the space, wherein the cart is transportable between the first workstation and the second workstation. A method for transporting wafers includes docking a cart in a workstation; loading a wafer holder into a space of the cart; pressurizing the space to cause a pressure of the space to be greater than an atmospheric pressure; maintaining the pressure of the space at the pressure; and moving the cart carrying the wafer holder away from the workstation.

Abstract: Embodiments include nanostructure devices and methods of forming nanostructure devices which include a treatment process to expand a sidewall spacer material to close a seam in the sidewall spacer material after deposition. The treatment process includes oxidation anneal and heat anneal to expand the sidewall spacer material and crosslink the open seam to form a closed seam, lower k-value, and decrease density.

Abstract: Embodiments include nanostructure devices and methods of forming nanostructure devices which include a treatment process to expand a sidewall spacer material to close a seam in the sidewall spacer material after deposition. The treatment process includes oxidation anneal and heat anneal to expand the sidewall spacer material and crosslink the open seam to form a closed seam, lower k-value, and decrease density.

Abstract: An electrode plate is provided, which includes a metal base with a flow channel structure disposed between rib portions. A graphite layer wraps the bottom of the flow channel structure, the sidewalls of the flow channel structure, and the rib portions. A hydrophobic layer is disposed on the graphite layer overlying the bottom and the sidewalls of the flow channel structure, and not on the graphite layer overlying the rib portions. The hydrophobic layer on the bottom of the flow channel structure and the hydrophobic layer on the sidewalls of the flow channel structure have a substantially equal thickness.

Abstract: A bipolar plate, a fuel cell, and a fuel cell stack are provided. The bipolar plate includes a first flow-field plate and a second flow-field plate. The first flow-field plate and the second flow-field plate are stacked, and the edges of the first and second flow-field plates have a continuous welding portion to seal the periphery of the bipolar plate by a welding method.

Abstract: A bipolar plate, a fuel cell, and a fuel cell stack are provided. The bipolar plate includes a first flow-field plate and a second flow-field plate. The first flow-field plate and the second flow-field plate are stacked, and the edges of the first and second flow-field plates have a continuous welding portion to seal the periphery of the bipolar plate by a welding method.

Abstract: A bipolar plate and a fuel cell module using the same are provided. The bipolar plate includes a plate body and a temperature management component. The plate body has a plurality of reactive gas channels located on two opposite surfaces of the plate body, and the material of the plate body has a first thermal conductivity. The temperature management component is embedded within the plate body, and the material of the temperature management component has a second thermal conductivity. The first thermal conductivity is smaller than the second thermal conductivity. The temperature management component includes a plurality of tubes and a plurality of connecting elements, and the tubes communicate with each other through the connecting elements.

Abstract: Disclosed is a magnetic catalyst formed by a single or multiple nano metal shells wrapping a carrier, wherein at least one of the metal shells is iron, cobalt, or nickel. The magnetic catalyst with high catalyst efficiency can be applied in a hydrogen supply device, and the device can be connected to a fuel cell. Because the magnetic catalyst can be recycled by a magnet after generating hydrogen, the practicability of the noble metals such as Ru with high catalyst efficiency is dramatically enhanced.

Abstract: Disclosed is a magnetic catalyst formed by a single or multiple nano metal shells wrapping a carrier, wherein at least one of the metal shells is iron, cobalt, or nickel. The magnetic catalyst with high catalyst efficiency can be applied in a hydrogen supply device, and the device can be connected to a fuel cell. Because the magnetic catalyst can be recycled by a magnet after generating hydrogen, the practicability of the noble metals such as Ru with high catalyst efficiency is dramatically enhanced.

Abstract: Disclosed is a magnetic catalyst formed by a single or multiple nano metal shells wrapping a carrier, wherein at least one of the metal shells is iron, cobalt, or nickel. The magnetic catalyst with high catalyst efficiency can be applied in a hydrogen supply device, and the device can be connected to a fuel cell. Because the magnetic catalyst can be recycled by a magnet after generating hydrogen, the practicability of the noble metals such as Ru with high catalyst efficiency is dramatically enhanced.

Abstract: Disclosed is a magnetic catalyst formed by a single or multiple nano metal shells wrapping a carrier, wherein at least one of the metal shells is iron, cobalt, or nickel. The magnetic catalyst with high catalyst efficiency can be applied in a hydrogen supply device, and the device can be connected to a fuel cell. Because the magnetic catalyst can be recycled by a magnet after generating hydrogen, the practicability of the noble metals such as Ru with high catalyst efficiency is dramatically enhanced.

Abstract: A method of manufacturing a catalyst for catalyzing hydrogen releasing reaction includes following steps. First, a solution with metal catalyst ions is provided. Next, several catalyst supports are provided. Each catalyst support includes several chelating units. Then, the catalyst supports are mixed with the solution, so that the metal catalyst ions in the solution chelate with the chelating units on the surface of each catalyst support. Subsequently, the metal catalyst ions chelating with the surface of the catalyst supports are reduced, so that metal catalyst nano-structures and/or metal catalyst atoms are coated on the surface of the catalyst supports, for forming catalysts.

Abstract: A printed circuit board includes a first layer including a first power portion and a first ground portion isolated from each other, and a second layer including a second power portion and a second ground portion isolated from each other. The second layer is spaced from the first layer. The second ground portion is arranged below the first power portion. The second power portion is arranged below the first ground portion. One portion of the first power portion overlaps one portion of the second power portion, and one portion of the first ground portion overlaps one portion of the second ground portion to provide a zero-intensity electric field between the first layer and the second layer. The first power portion is coupled to the second power portion via a first via. The first ground portion is coupled to the second ground portion via a second via.

Abstract: A signal transmission line used in a printed circuit board (PCB), the signal transmission line comprises a driving terminal for driving a signal, a contact portion, the signal line connected with the driving terminal and the contact portion to transmit the signal wherein a length of the signal line is so arranged that a time for the signal transmitted from the driving terminal to the contact portion is not less than half of a time for the transmitted signal to reach a receiving terminal.

Abstract: A printed circuit board (PCB) includes at least one signal layer, a ground layer, at least two signal lines, and at least one grounded line. The signal lines are arranged on the signal layer for transmitting signals. The grounded line is arranged on the signal layer and between the signal lines. A plurality of vias are defined in the grounded line, and the vias are connected to the ground layer. A distance between each two adjacent vias is so arranged that a resonant frequency of an electromagnetic wave transmitted on the grounded line must greater than a highest frequency of the signals transmitted on the signal lines. A related method for designing the PCB is also provided.

Abstract: A method for impedance matching between differential vias and associated transmission lines is provided. The method includes: deducing a relationship of a space between the differential vias, and a radius of the differential vias while a characteristic impedance of the differential vias matches a characteristic impedance of the differential transmission lines; and determining the space and the radius according to the relationship between the space and the radius.

Abstract: An exemplary printed circuit board includes at least a pair of differential vias defined therein, each of the differential vias has an annular ring formed on the PCB, a conductive hole defined in the PCB, and a clearance hole defined in at least one inner layer of the PCB. Each of the clearance holes of the differential vias is oval shaped thus providing a greater area for the clearance holes and needed clearance between vias without creating a superposition zone.

Abstract: A printed circuit board includes a first layer including a first power portion and a first ground portion isolated from each other, and a second layer including a second power portion and a second ground portion isolated from each other. The second layer is spaced from the first layer. The second ground portion is arranged below the first power portion. The second power portion is arranged below the first ground portion. One portion of the first power portion overlaps one portion of the second power portion, and one portion of the first ground portion overlaps one portion of the second ground portion to provide a zero-intensity electric field between the first layer and the second layer. The first power portion is coupled to the second power portion via a first via. The first ground portion is coupled to the second ground portion via a second via.