Abstract: Examples pertaining to preamble puncturing negotiation in wireless communications are described. A station (STA) may receive a control frame, and, in response, apply the MRU pattern for one or more transmissions or receptions in a transmission opportunity (TXOP). In the control frame, either a plurality of first reserved bits in a SERVICE field or a plurality of bits in a User Info field are set to indicate a multiple resource unit (MRU) pattern regarding preamble puncturing.

Abstract: A sensing circuit coupled to a sensor includes a first transistor, a second transistor, a third transistor, a fourth transistor, and an oscillator. The first transistor, coupled to a first current source and the sensor, receives a sensing current from the sensor. A gate terminal of the first transistor is connected to a source terminal of the first transistor. The second transistor, coupled to the first transistor and a second current source, generates a first current according to the sensing current. The first current is greater than the sensing current. The third transistor, coupled to the second transistor and the second current source, generates a second current according to the first current. The fourth transistor, coupled to the third transistor, generates a third current. The oscillator is coupled to the fourth transistor. The oscillator generates a signal having an oscillation frequency according to the third current.

Abstract: A capacitive biosensor is provided. The capacitive biosensor includes: a transistor, an interconnect structure on the transistor, and a passivation layer on the interconnect structure. The interconnect structure includes a first metal structure on the transistor, a second metal structure on the first metal structure, and a third metal structure on the second metal structure. The third metal structure includes a first conductive layer, a second conductive layer, and a third conductive layer that are sequentially stacked. The passivation has an opening exposing a portion of the third metal structure. The capacitive biosensor further includes a sensing region on the interconnect structure. The sensing region includes a first sensing electrode and a second sensing electrode. The first sensing electrode is formed of the third conductive layer, and the second sensing electrode is disposed on the passivation layer.

Abstract: The present disclosure relates to a method for fabricating a semiconductor structure. The method includes providing a substrate with a gate structure, an insulating structure over the gate structure, and a S/D region; depositing a titanium silicide layer over the S/D region with a first chemical vapor deposition (CVD) process. The first CVD process includes a first hydrogen gas flow. The method also includes depositing a titanium nitride layer over the insulating structure with a second CVD process. The second CVD process includes a second hydrogen gas flow. The first and second CVD processes are performed in a single reaction chamber and a flow rate of the first hydrogen gas flow is higher than a flow rate of the second hydrogen gas flow.

Abstract: A backlight module comprises an outer frame unit, a light guide plate arranged in the outer frame unit, a light-emitting unit, a plurality of adhesives for fixing the light-emitting unit on the light guide plate, and a plurality of abutting structures. The light-emitting unit includes a flexible circuit board and a plurality of light-emitting elements arranged on the flexible circuit board at intervals. Part of the flexible circuit board is deformed at a specific position by the abutting structures, and the position of the light-emitting elements relative to the light guide plate can be adjusted. Thereby, the light-emitting elements can be aligned with the light incident surface of the light guide plate, prevent light from leaking from the light emitting surface of the light guide plate close to the light-emitting elements, and reduce the generation of bright lines and improving the overall uniformity. The present invention also provides a display device including the backlight module.

Abstract: Aspects described herein include devices, wireless communication apparatuses, methods, and associated operations for heatsinks integrating millimeter wave and non-millimeter wave operation. In some aspects, an apparatus comprising a millimeter wave (mmW) module is provided. The apparatus includes at least one mmW antenna and at least one mmW signal node configured to communicate a data signal in association with the at least one mmW antenna. The apparatus further includes mixing circuitry configured to convert between the data signal and a mmW signal for communications associated with the at least one mmW antenna. The apparatus further includes a heatsink comprising a non-mmW antenna and a non-mmW feed point coupled to the non-mmW antenna. The non-mmW feed point is configured to provide a signal path to the non-mmW antenna for a non-mmW signal. The heatsink is mechanically coupled to the mmW module.

Abstract: Duplicated packet transmission methods are provided. The duplicated packet transmission method may include the following steps. A sender may determine whether to pad at least one duplicated packet into a multi-user physical-protocol-data-unit (MU-PPDU) based on at least one condition. Then, the sender may transmit the MU-PPDU with the duplicated packet to at least one receiver when the condition is met.

Abstract: A helical permanent magnet structure includes at least one magnet assembly. The magnet assembly includes a plurality of permanent magnets and poles. The permanent magnets are with a magnetization direction, and formed as helical shape and arranged as a helical surface, the center of the helical surface has a longitudinal passage for being passed through by a charged particle. The poles are with the same amount of the permanent magnets, wherein the poles are magnetized by the permanent magnets and absorb on one side of the permanent magnets.

Abstract: A helical permanent magnet structure includes at least one magnet assembly. The magnet assembly includes a plurality of permanent magnets and poles. The permanent magnets are with a magnetization direction, and formed as helical shape and arranged as a helical surface, the center of the helical surface has a longitudinal passage for being passed through by a charged particle. The poles are with the same amount of the permanent magnets, wherein the poles are magnetized by the permanent magnets and absorb on one side of the permanent magnets.