Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: The present disclosure provides semiconductor structure having an electrical contact. The semiconductor structure includes a semiconductor substrate and a doped polysilicon contact. The doped polysilicon contact is disposed over the semiconductor substrate. The doped polysilicon contact includes a dopant material having a dopant concentration equaling or exceeding about 1015 atom/cm3.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: A reactive black dye composition is disclosed, which comprises: (A) a reactive blue dye represented by the following formula (I) or a salt thereof; and (B) a reactive red dye or a salt thereof, a reactive yellow dye or a salt thereof, or a combination thereof. Herein, R11, X1, X2, X31, X41 and n are defined in the specification. In addition, a method for dying fibers using the aforesaid reactive black dye composition is also disclosed.

Abstract: The present invention provides a reactive red dye composition comprising (A) 3% to 97% by weight of a reactive azo dye of the following formula (I), wherein W, D1 and D2 are defined the same as the specification; and (B) 97% to 3% by weight of a reactive azo dye of the following formula (II), wherein R, X, Z, D3 and D4 are defined the same as the specification. The reactive red dye composition of the present invention can be utilized to dye cellulose fibers. The cellulose fibers dyed by the reactive red dye composition obtain not only good build-up and level dyeing properties but also an excellent property of white discharging.

Abstract: A reactive trichromatic set comprising (a) at least one of the following reactive red dye of formula (I), wherein R1, R2, R3, X, D, Z, and n are defined the same as in the specification; (b) at least one reactive yellow dye selected from the following Color Index; C.I. Reactive Yellow 145 and C.I. Reactive Yellow 176; and (c) at least one reactive blue dye selected from the following Color Index; C.I. Reactive Blue 194, C.I. Reactive Blue 221 and C.I. Reactive Blue 222.

Abstract: The present invention discloses a reactive yellow dye composition comprising component (A) and component (B). The component (A) is a reactive azo dye represented by the following formula (I) or formula (II), The component (B) is a reactive azo dye represented by the following formula (III), wherein the substituents of the formulas (I), (II) and (III) are defined the same as in the specification. Moreover, the reactive yellow dye composition of the present invention has excellent build-up, wash-off and light fastness and can be applied with dyestuffs in other colors.

Abstract: The present invention discloses a reactive yellow dye composition comprising component (A) and component (B). The component (A) is a reactive azo dye represented by the following formula (I) or formula (II), The component (B) is a reactive azo dye represented by the following formula (III), wherein the substituents of the formulas (I), (II) and (III) are defined the same as in the specification. Moreover, the reactive yellow dye composition of the present invention has excellent build-up, wash-off and light fastness and can be applied with dyestuffs in other colors.

Abstract: A dye composition, comprising (A) at least one disazo dye selected from the formula (I) or (II), wherein R, R1, R2, D1 and D2 are defined as in the specification; and (B) a diazo dye of the formula (III), wherein (R9)0˜2, (R10)0˜2, Q1 and Q2 are defined as in the specification. These dye compositions have high fixation and good build-up. They are distinguished also by high washing off and low nylon staining and they are suitable for dyeing and printing of materials containing either cellulose fibers, such as cotton, artificial cotton, linen, and artificial linen, or polyamide fibers, such as wool, silk, and nylon etc. Dyed materials with excellent properties can be obtained, showing especially outstanding performance in washing off, levelness, build-up, wet fastness and light fastness.

Abstract: The present invention provides a reactive red dye composition comprising (A) 3% to 97% by weight of a reactive azo dye of the following formula (I), wherein W, D1 and D2 are defined the same as the specification; and (B) 97% to 3% by weight of a reactive azo dye of the following formula (II), wherein R, X, Z, D3 and D4 are defined the same as the specification. The reactive red dye composition of the present invention can be utilized to dye cellulose fibers. The cellulose fibers dyed by the reactive red dye composition obtain not only good build-up and level dyeing properties but also an excellent property of white discharging.

Abstract: To obtain a reactive trichromatic set has superior reproducibility, and particularly light fastness and alkali perspiration light fastness under balanced affinity and reactivity, and improving Right First Time production, for dyeing cellulose fibers or cellulosic blended fibers is disclosed in the present invention. A reactive trichromatic set comprising (a) at least one of the following reactive red dye of formula (I), wherein R1, R2, R3, X, D, Z, and n are defined the same as in the specification; (b) at least one reactive yellow dye selected from the following Color Index; C.I. Reactive Yellow 145 and C.I. Reactive Yellow 176; and (c) at least one reactive blue dye selected from the following Color Index; C.I. Reactive Blue 194, C.I. Reactive Blue 221 and C.I. Reactive Blue 222.

Abstract: A dye composition, which comprising (A) at least one disazo dye selected from the formula (I) or (II), wherein R, R1, R2, D1 and D2 are defined the same as the specification; and (B) a diazo dye of the formula (III), wherein (R9)0-2, (R10)0-2, Q1 and Q2 are defined the same as the specification. These kinds of dye composition with high fixation and good build-up. They are distinguished also by high washing off and a low nylon stain and they are suitable for dyeing and printing of materials containing either cellulose fibers, such as cotton, artificial cotton, linen, and artificial linen, or polyamide fibers, such as wool, silk, and nylon etc. Dyed materials with excellent properties can be obtained, showing especially outstanding performance in of washing off, levelness, build-up, wet fastness and light fastness.

Abstract: A dye composition is disclosed, which comprises a blue anthraquinone dye of the following formula (I) wherein Y is —CH?CH2, —CH2CH2Cl or —CH2CH2OSO3H; and a gray-black azo dye of the following formula (II) wherein Y is defined as the above. The dye compositions of the present invention have good stability and build-up property. The dye compositions are suitable for dyeing and printing materials that contain either cellulose fibers, such as cotton, artificial cotton, linen, and artificial linen, or synthetic polyamide, such as wool, silk, and nylon. The materials obtained through treatment with the dye compositions aforementioned show excellent properties, especially in wash-off, level-dyeing, build-up, light fastness and perspiration-light fastness.

Abstract: Light emitting diode (LED) packages are made by first providing a platelike frame having a plurality of cells, each of which is composed of a main plate and a separate arm. Secondly, an LED die and a reflecting ring are respectively mounted on top of each main plate such that the die is located at a center of the reflecting ring. Then a conductive wire is connected between the top surface of the die and a top surface of the separate arm by wire bonding. A domed transparent encapsulant is then molded on each of the cells. The encapsulant encapsulates the die, the reflecting ring and the conductive wire and covers the main plate and the separate arm, and fills a space between the main plate and the separate arm to remain their spaced apart. Finally, the frame is cut according to the size of each cell to obtain the LED packages.

Abstract: A dye composition is disclosed, which comprises a blue anthraquinone dye of the following formula (I) 1

Abstract: Light emitting diode (LED) packages are made by first providing a platelike frame having a plurality of cells, each of which is composed of a main plate and a separate arm. Secondly, an LED die and a reflecting ring are respectively mounted on top of each main plate such that the die is located at a center of the reflecting ring. Then a conductive wire is connected between the top surface of the die and a top surface of the separate arm by wire bonding. A domed transparent encapsulant is then molded on each of the cells. The encapsulant encapsulates the die, the reflecting ring and the conductive wire and covers the main plate and the separate arm, and fills a space between the main plate and the separate arm to remain their spaced apart. Finally, the frame is cut according to the size of each cell to obtain the LED packages.

Abstract: The present invention is to provide a process for fabricating light emitting diode (LED) packages. The process begins with a first step of providing a platelike frame having a plurality of cells, each of which is composed of a main plate and a separate arm. Secondly, an LED die and a reflecting ring are respectively mounted on a top surface of each main plate such that the die is located at a center of the reflecting ring. Next, connect a conductive wire between a top surface of the die and a top surface of the separate arm by wire bonding technique. And then, mold a domed transparent encapsulant on each of the cells. The encapsulant encapsulates the die, the reflecting ring and the conductive wire and covers the main plate and the separate arm, and fills a space between the main plate and the separate arm to remain their spaced apart. Finally, cut the frame according to the size of each cell, and then LED packages are obtained.

Abstract: The present invention is to provide a process for fabricating light emitting diode (LED) packages. The process begins with a first step of providing a platelike frame having a plurality of cells, each of which is composed of a main plate and a separate arm. Secondly, an LED die and a reflecting ring are respectively mounted on a top surface of each main plate such that the die is located at a center of the reflecting ring. Next, connect a conductive wire between a top surface of the die and a top surface of the separate arm by wire bonding technique. And then, mold a domed transparent encapsulant on each of the cells. The encapsulant encapsulates the die, the reflecting ring and the conductive wire and covers the main plate and the separate arm, and fills a space between the main plate and the separate arm to remain their spaced apart. Finally, cut the frame according to the size of each cell, and then LED packages are obtained.