Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: An electronic device includes a substrate, a first silicon transistor, a second silicon transistor and a first oxide semiconductor transistor. The first silicon transistor, the second silicon transistor and the first oxide semiconductor transistor are disposed on the substrate. The first silicon transistor has a first terminal electrically connected to a first voltage level, a second terminal and a control terminal. The second silicon transistor has a first terminal electrically connected to the second terminal of the first silicon transistor, a second terminal electrically connected to a second voltage level, and a control terminal electrically connected to the control terminal of the first silicon transistor. The first oxide semiconductor transistor has a first terminal electrically connected to the first terminal of the second silicon transistor. Wherein, a voltage value of the first voltage level is greater than a voltage value of the second voltage level.

Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: A method implemented by a server includes: sending a link short message (LSM) to a terminal; generating a communication token (C token) based on a link request of the terminal, and determining whether the server has stored another identical C token; when negative, storing the C token, and sending web data and the C token to the terminal; when affirmative, further determining whether a web cookie in the link request contains a browsing token identical to the C token; when affirmative, sending the web data to the terminal; and when negative, sending a verification short message (VSM) to the terminal, and sending the web data to the terminal upon receiving a verification request within a predetermined duration since sending the VSM.

Abstract: A method for establishing communication includes: in receipt of identification information associated with an outside party from an inside party, transmitting, by a closed server, link information to an outside party device associated with the outside party via a public server; in receipt of a request from the outside party device executing an instant messaging application, transmitting, by the public server, an identifier associated with a communication group to the outside party device; and in receipt of the identifier, adding, by the closed server, the outside party to the communication group and enabling the outside party to communicate exclusively with the inside party via an instant messaging service.

Abstract: A method for establishing communication includes: in receipt of identification information associated with an outside party from an inside party, transmitting, by a closed server, link information to an outside party device associated with the outside party via a public server; in receipt of a request from the outside party device executing an instant messaging application, transmitting, by the public server, an identifier associated with a communication group to the outside party device; and in receipt of the identifier, adding, by the closed server, the outside party to the communication group and enabling the outside party to communicate exclusively with the inside party via an instant messaging service.

Abstract: A built-in module for an inverter and having tension control with integrated tension and velocity closed loops, where required tension feedbacks can be obtained by internal calculations of the inverter or feedback signals of a tension sensor. The tension control module is applied to provide a tension control for a winding mechanism which is operated by driving at least one motor. The tension control module firstly builds a tension control to provide a balanced tension to the winding mechanism. Afterward, the tension control module builds a velocity control to provide an accelerated or decelerated adjustment for the winding mechanism. Accordingly, the winding mechanism can stably maintain a tension-balanced operation.

Abstract: A built-in module for an inverter and having tension control with integrated tension and velocity closed loops, where required tension feedbacks can be obtained by internal calculations of the inverter or feedback signals of a tension sensor. The tension control module is applied to provide a tension control for a winding mechanism which is operated by driving at least one motor. The tension control module firstly builds a tension control to provide a balanced tension to the winding mechanism. Afterward, the tension control module builds a velocity control to provide an accelerated or decelerated adjustment for the winding mechanism. Accordingly, the winding mechanism can stably maintain a tension-balanced operation.