Patents by Inventor Cheng-Hsiang WANG

Cheng-Hsiang WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120304
    Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.
    Type: Application
    Filed: November 24, 2022
    Publication date: April 11, 2024
    Applicant: Innolux Corporation
    Inventors: Tzu-Sheng Wu, Haw-Kuen Liu, Chung-Jyh Lin, Cheng-Chi Wang, Wen-Hsiang Liao, Te-Hsun Lin
  • Publication number: 20230145833
    Abstract: Raw material grains according to the present invention comprise, as components, 40 to 60% plant fiber powder, 20 to 30% starch, 10 to 20% vegetable gum powder obtained by fermenting starch, 2 to 15% water-soluble polymer glue, and 1 to 10% water-soluble cellulose derivative. The production process thereof primarily includes: a step of appropriately adjusting blending ratios in accordance with the production method, rotating and kneading for 10-40 minutes the fiber powder, starch, and vegetable gum powder, each in a separate kneader, and then batch stirring and kneading all of the blending components in a fourth kneader to thereby obtain a raw material; and a step of subsequently molding the mixed raw material into a plurality of strands in a molding device, cutting the strands into granular raw material grains via a cutting unit, cooling the raw material grains, and then packaging a raw material grain product.
    Type: Application
    Filed: March 1, 2021
    Publication date: May 11, 2023
    Applicants: Amica Terra Co., Ltd., House Foods Group Inc.
    Inventor: Cheng Hsiang Wang
  • Publication number: 20220398912
    Abstract: A system for physical-distancing detection in a specified area includes a locator locating a positioning quadrangle plane in a specified area; an image-capturing device obliquely capturing an image of the specified area to generate a captured image of the specified area; and a coordinate converter defining a coordinate conversion function according to raw coordinates of selected points of the positioning quadrangle plane in the captured image of the specified area and reference coordinates of the selected points of the positioning quadrangle plane in an overlooked image of the specified area. The image-capturing device converts raw coordinates of the captured image of the specified area into converted coordinates of the overlooked image of the specified area by way of the coordinate conversion function, determines a physical-distancing condition between two persons according to the converted coordinates, and automatically takes an action corresponding to the physical-distancing condition.
    Type: Application
    Filed: January 11, 2022
    Publication date: December 15, 2022
    Inventor: CHENG-HSIANG WANG
  • Patent number: 11195841
    Abstract: A method for manufacturing an integrated circuit is provided. The method includes depositing a floating gate electrode film over a semiconductor substrate; patterning the floating gate electrode film into at least one floating gate electrode having at least one opening therein; depositing a control gate electrode film over the semiconductor substrate to overfill the at least one opening of the floating gate electrode; and patterning the control gate electrode film into at least one control gate electrode over the floating gate electrode.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: December 7, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Chung Jen, Yu-Chu Lin, Cheng-Hsiang Wang, Yi-Ling Liu
  • Publication number: 20210225855
    Abstract: A method for manufacturing an integrated circuit is provided. The method includes depositing a floating gate electrode film over a semiconductor substrate; patterning the floating gate electrode film into at least one floating gate electrode having at least one opening therein; depositing a control gate electrode film over the semiconductor substrate to overfill the at least one opening of the floating gate electrode; and patterning the control gate electrode film into at least one control gate electrode over the floating gate electrode.
    Type: Application
    Filed: January 16, 2020
    Publication date: July 22, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Chung JEN, Yu-Chu LIN, Cheng-Hsiang WANG, Yi-Ling LIU