Abstract: Semiconductor structures and fabrication methods are provided. In one example, a method includes forming a first dielectric layer on a semiconductor structure. The semiconductor structure includes a substrate and a multi-layer interconnect (MLI) structure on the substrate. The MLI structure includes multiple metallization layers. The first dielectric layer is formed on a topmost metallization layer. The method further includes forming a through-substrate-via (TSV) opening extending vertically through the first dielectric layer and the multiple metallization layers into the substrate, forming a TSV in the TSV opening, performing a first planarization process to planarize the TSV, forming multiple first metal vias and first metal lines in the first dielectric layer after the first planarization process, forming multiple first metal capping layers respectively on the multiple first metal lines, and performing a second planarization process to planarize the first metal capping layers.

Abstract: Semiconductor structures, die stack structures, and fabrication methods are provided. In one example, a semiconductor structure includes a die having a test pad disposed on a front side of the die. The test pad has a probe mark in an upper portion of the test pad. The probe mark has an open end at a top surface of the test pad, a bottom wall, a sidewall connected to the bottom wall, and a space between the open end, the bottom wall and the sidewall. The semiconductor structure further includes a first cover layer and a second cover layer. The first cover layer is disposed on the front side of the first test pad and the sidewall and the bottom wall of the probe mark. The second cover layer is disposed on the first cover layer. The first and second cover layers comprise different materials.

Abstract: A blade server system with a management bus and method for managing the same. The blade server system includes a connection board and a management module. The connection board is used for modular interconnection, including communication paths for conducting signals including a management bus signal group and a first bus signal group. The management module is used for management of the blade server system using signals including the management bus signal group and the first bus signal group. If a module is detected, the management module selects the detected module through the management bus and acquires module configuration information of the detected module through the first bus signal group. Distribution of power from a power source to the blade server system is determined according to system configuration information including the module configuration information of the module so that the power source is prevented from being overloaded.

Abstract: A blade server system with a management bus and method for managing the same. The blade server system includes a connection board and a management module. The connection board is used for modular interconnection, including communication paths for conducting signals including a management bus signal group and a first bus signal group. The management module is used for management of the blade server system using signals including the management bus signal group and the first bus signal group. If a module is detected, the management module selects the detected module through the management bus and acquires module configuration information of the detected module through the first bus signal group. Distribution of power from a power source to the blade server system is determined according to system configuration information including the module configuration information of the module so that the power source is prevented from being overloaded.

Abstract: A method for automatically assigning a communication port address and the blade server system thereof are provided. The blade server system comprises a middle plane and a plurality of hot-swappable devices. The middle plane has a plurality of slots. Each of the hot-swappable devices has a connector coupled to one of the slots. Each of the slots respectively corresponds to a slot ID. A particular hot-swappable device plurality of the hot-swappable devices is received at a particular slot of a plurality of slots. The particular hot-swappable device obtains the corresponding slot ID of the particular slot via the particular connector. The particular hot-swappable device generates a particular communication port address according to the particular slot ID. The particular hot-swappable device further broadcasts the particular communication port address to other hot swap devices already received at the middle plane, and receives the respective communication port address thereof.

Abstract: A blade server system with integrated KVM switches is described. The blade server system has a chassis, a management board, a plurality of blade servers, and an output port. Each of the blade servers has a decoder and a switch. Each of the blade servers further has a select button and a processor. The decoder receives an encoded data from the management board and decodes the encoded data into command information when one of the blade servers is selected. The switch receives the command information and is switched according to the command information. The command information indicates which switch is to be turned on and which are to be turned off. The output port connects the peripheral devices for controlling the selected blade server. The management board may determine which blade server is to be selected by the button condition, commands from the peripheral devices or a request from a network computer.

Abstract: A dummy process and a polishing-pad conditioning process suitable for a chemical mechanical polishing (CMP) is provided. The CMP apparatus includes a polishing head, a polishing table, and a polishing pad. The polishing head includes a protective hood, a base, a retaining ring and a wafer supporting assembly. The wafer is attached to an attaching surface in the wafer receiving recess. Next, the wafer supporting assembly is moved to make the bottom surface of the retaining ring more protrusive than the bottom surface of the wafer such that the wafer does not contact the surface of the polishing pad. Accordingly, the need for a large number of dummy wafers can be effectively avoided.

Abstract: A blade server system with an integrated KVM switch is described. The blade server system has a chassis, a management board, a plurality of blade servers, and an output port. Each of the blade servers has a decoder and a switch. Each of the blade servers further has a select button and a processor. The decoder receives an encoded data from the management board and decodes the encoded data to command information when one of the blade servers is selected. The switch receives the command information and is switched according to the command information. The command information indicates which switch is turned on and which are turned off. The output port connects the peripheral devices for controlling the selected blade server. The management board may determine which blade server is to be selected by the button condition, commands from the peripheral devices or a request from a network computer.