Abstract: A thermoplastic vulcanizate material comprises: a continuous phase comprising polyester, wherein a melting point of the polyester is less than or equal to 180° C., a dispersant phase comprising cross-linked rubber, wherein an average particle diameter of the cross-linked rubber is less than or equal to 100 ?m.

Abstract: An electronic device includes a substrate, a pixel defining layer disposed on the substrate and at least three light-emitting units respectively disposed in a first opening, a second opening and a third opening of the pixel defining layer. The first opening and the second opening are arranged along a first direction, and the first opening and the third opening are arranged along a second direction. An included angle between an extending direction of a first long axis of the first opening and the first direction is greater than 45 degrees, an included angle between the extending direction of the first long axis and the second direction is less than 45 degrees, and an included angle between an extending direction of a third long axis of the third opening and the second direction is greater than 45 degrees.

Abstract: A wireless charger is configured to charge a mobile device and be connected to an air conditioner. The wireless charger includes a casing, a wireless charging module, and a valve assembly. The casing includes a first accommodation space, a second accommodation space, and an air inlet. The first accommodation space is in fluid communication with the second accommodation space, the first accommodation space is configured to accommodate the mobile device, and the air inlet is in fluid communication with the first accommodation space and the second accommodation space. The wireless charging module is located in the second accommodation space and configured to charge the mobile device. The valve assembly is mounted to the air inlet and configured to be connected to the air conditioner.

Abstract: A forming method of a ReRAM array includes steps as follows: Firstly, a first pulse is applied to a first ReRAM unit in the ReRAM array. Afterwards, a second pulse is applied to the first ReRAM unit, wherein the electrical property of the first pulse is opposite to that of the second pulse. Then, a verification pulse is applied to the first ReRAM unit to verify whether the first resistance value of the first ReRAM unit passes a preset threshold. When the first resistance value passes the preset threshold value, a third pulse is applied to the first ReRAM unit, wherein the first pulse and the third pulse have the same electrical property, and the first pulse has a voltage value substantially the same to that of the third pulse.

Abstract: A wireless charging device includes a casing, a wireless charging module, an air guide and a fan assembly. The casing has an interior space and an opening communicating with the interior space. The wireless charging module is disposed in the interior space. The wireless charging module has a through hole. The air guide is located in the interior space and penetrates through the through hole and the opening. The air guide and an inner surface of the opening are spaced apart from each other so as to form an inlet slot, the air guide has an inlet, a channel and an outlet, and the inlet communicates with the interior space through the channel, the outlet and the inlet slot. The fan assembly is disposed on the casing and drives air to pass through the inlet, the channel, the outlet and the inlet slot and enter into the interior space.

Abstract: A package structure and manufacturing method thereof. The package structure includes first package assembly and a second package assembly. The first package assembly includes a first dielectric layer, a first chip and a first conductive structure. The first chip is disposed in the first dielectric layer, and a first electrical connection surface of the first conductive structure is exposed on a first bonding surface of the first dielectric layer. The second package assembly includes a second dielectric layer, a second chip and a second conductive structure. The second chip is disposed in the second dielectric layer, and a second electrical connection surface of the second conductive structure is exposed on a second bonding surface of the second dielectric layer. The first bonding surface is directly bonded to the second bonding surface, and the first electrical connection surface is directly bonded to the second electrical connection surface.

Abstract: A pixel structure includes a pixel driving circuit, a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, multiple bonding pads and a light-emitting element. The first conductive pattern is disposed on the first insulating layer and is electrically connected to the pixel driving circuit through a first contact window of the first insulation layer. The second conductive pattern is disposed on the second insulating layer and is electrically connected to the first conductive pattern through a second contact window of the second insulation layer. In a top view of the pixel structure, the first contact window and the second contact window have a first spacing in a first direction, and the first contact window and the second contact window have a second spacing in a second direction.

Abstract: A wireless charging assembly including a base body, a charging coil, a magnet and a plurality of partitions. The charging coil is disposed in the base body. The magnet includes a body part and a plurality of protruding parts. The plurality of protruding parts protrude from a side of the body part. The body part and the plurality of protruding parts are integrally formed as a single piece. The body part is disposed in the base body. The plurality of partitions are connected to the base body. The plurality of protruding parts of the magnet are spaced apart from each other by the plurality of partitions.

Abstract: An edge emitting laser (EEL) device includes a substrate, an n-type buffer layer, a first n-type cladding layer, a grating layer, a spacer layer, a lower confinement unit, an active layer, an upper confinement unit, a p-type cladding layer, a tunnel junction layer and a second n-type cladding layer sequentially arranged from bottom to top. The tunnel junction layer can stop an etching process from continuing to form the second n-type cladding layer into a predetermined ridge structure and converting a part of the p-type cladding layer into the n-type cladding layer to reduce series resistance of the EEL device. Therefore, the optical field and active layer tend to be coupled at the middle of the active layer, the lower half of the active layer can be utilized effectively, and the optical field is near to the grating layer to achieve better optical field/grating coupling efficiency and lower threshold current.

Abstract: A button structure includes a switch, a shell, an elastic member, a button and at least one adjustable limiting member. The elastic member includes a fixing portion, a compressive portion and an elastic portion. The fixing portion is connected to the shell. The compressive portion is configured to abut against the switch. The elastic portion is connected between the fixing portion and the compressive portion. The elastic portion is suitable for deformation. The button is connected to the compressive portion, and the compressive portion is located between the button and the switch. The adjustable limiting member is disposed on the button, and is configured to abut against the elastic portion. The adjustable limiting member adjustably protrudes for a length toward the elastic portion relative to the button.

Abstract: A semiconductor package includes a carrier plate, a photonic integrated circuit chip, an electronic integrated circuit chip and an interposer substrate. The carrier plate has a notch and a first surface and a second surfaces opposite to the first surface, and the notch extends from the first surface toward the second surface. The photonic integrated circuit chip is disposed within the notch. The electronic integrated circuit chip is disposed on the first surface of the carrier plate. The photonic integrated circuit chip and the electronic integrated circuit chip are disposed on the carrier through the interposer substrate.

Abstract: A display device has a transmissive area and a reflective area. The transmissive area corresponds to a first sub-pixel, and the reflective area corresponds to a second sub-pixel. The display device includes a backlight module, a liquid crystal module, and an anti-reflective layer. The liquid crystal module is disposed on the backlight module and includes a first substrate, a component layer, and a reflective layer. The component layer is disposed on the first substrate and includes a first transistor and a second transistor. The first transistor is configured to drive the first sub-pixel, and the second transistor is configured to drive the second sub-pixel. The reflective layer is disposed on the component layer and corresponds to the reflective area. The anti-reflective layer is disposed on the liquid crystal module.

Abstract: Provided is an anti-fuse memory including a anti-fuse memory cell including an isolation structure, a select gate, first and second gate insulating layers, an anti-fuse gate, and first, second and third doped regions. The isolation structure is disposed in a substrate. The select gate is disposed on the substrate. The first gate insulating layer is disposed between the select gate and the substrate. The anti-fuse gate is disposed on the substrate and partially overlapped with the isolation structure. The second gate insulating layer is disposed between the anti-fuse gate and the substrate. The first doped region and the second doped region are disposed in the substrate at opposite sides of the select gate, respectively, wherein the first doped region is located between the select gate and the anti-fuse gate. The third doped region is disposed in the substrate and located between the first doped region and the isolation structure.

Abstract: A current sampling circuit for a bridgeless power factor corrector is provided. The current sampling circuit comprises a sampling resistor, a first and second current sampling modules. In the first and second current sampling modules, primary windings of transformers are respectively serially connected to a first and second fast switches of the bridgeless power factor corrector. In a positive half cycle of the AC power, a second sampled current phase switching unit is turned on to form a second sampling circuit, and a first main current freewheeling unit is turned on to form a freewheeling path of a first transformer. In a negative half cycle of the AC power, a first sampled current phase switching unit is turned on to form a first sampling circuit, and a second main current freewheeling unit is turned on to form a freewheeling path of a second transformer.

Abstract: A power supply having ORing MOSFETs mounts a voltage regulating unit between a main power module and an auxiliary power module of a secondary side of the power supply. The voltage regulating unit regulates a control voltage received by a driving unit, such that a voltage difference between a gate voltage and a source voltage of one of the ORing MOSFETs can be less than a rated voltage threshold for avoiding damaging the one ORing MOSFET.

Abstract: A wireless charging device includes a casing, a wireless charging module, an air guide and a fan assembly. The casing has an interior space and an opening communicating with the interior space. The wireless charging module is disposed in the interior space. The wireless charging module has a through hole. The air guide is located in the interior space and penetrates through the through hole and the opening. The air guide and an inner surface of the opening are spaced apart from each other so as to form an inlet slot, the air guide has an inlet, a channel and an outlet, and the inlet communicates with the interior space through the channel, the outlet and the inlet slot. The fan assembly is disposed on the casing and drives air to pass through the inlet, the channel, the outlet and the inlet slot and enter into the interior space.

Abstract: A vehicle charging device includes a base, a circuit board, a plurality of supporting pillars and a plurality of conductors. The base has an accommodating space. The circuit board is located in the accommodating space. The plurality of supporting pillars are located in the accommodating space, and are connected to the base. Each of the plurality of conductors includes a contact portion and a connection portion. The plurality of contact portions are disposed on the base. The plurality of contact portions are located outside the accommodating space. The plurality of connection portions are connected to the plurality of contact portions, respectively. The plurality of connection portions penetrate through the base. The plurality of connection portions are partially located in the accommodating space. The plurality of connection portions are electrically connected to the circuit board.

Abstract: Disclosed is an electronic device including a driving unit, a plurality of sub-pixel circuits and a plurality of control signal lines. Each of the plurality of sub-pixel circuits includes a first switching element and at least one light emitting element, and the sub-pixel circuits are electrically connected to the driving unit in parallel. The control signal lines are electrically connected to the sub-pixel circuits respectively.

Abstract: The present disclosure relates to optical waveguide termination devices. In some embodiments, an optical waveguide termination device is coupled to an end of an optical waveguide. The optical waveguide termination device is a tapered structure. In various embodiments, an optical absorption rate of the tapered structure is increased to enhance a termination efficiency. The optical absorption is increased by highly-doped material, multi-layer structure, different cladding, and periodic structure. The enhancement of the termination efficiency benefits size reduction of the tapered structure.

Abstract: A vertical cavity surface emitting laser (VCSEL) device includes a substrate, a first mirror layer, a tunnel junction layer, a second mirror layer, an active layer, an oxide layer and a third mirror layer sequentially stacked with one another. The first mirror layer and the third mirror layer are N-type distributed Bragg reflectors (N-DBR), and the second mirror layer is P-type distributed Bragg reflector (P-DBR). The tunnel junction layer is provided for the VCSEL device to convert a part of the P-DBR into N-DBR to reduce the series resistance of the VCSEL device, and the tunnel junction layer is not used as current-limiting apertures. This disclosure further discloses a VCSEL device manufacturing method with the in-situ and one-time epitaxy features to avoid the risk of process variation caused by moving the device into and out from an epitaxial cavity.