Abstract: A semiconductor chip including a semiconductor substrate and an interconnect structure is provided. The semiconductor substrate includes semiconductor devices. The interconnect structure is disposed on the semiconductor substrate and electrically connected to the semiconductor devices. The semiconductor substrate or the interconnect structure includes at least one conductor, which includes a first conductive part and a second conductive part connected to the first conductive part. The first conductive part includes randomly oriented metal, and the second conductive part includes oriented metal. A bonding structure including the above-mentioned semiconductor chip and a fabricating method for fabricating the above-mentioned semiconductor chip are also provided.

Abstract: The application provides a memory device and an operation method thereof. The memory device includes: a memory array, for processing model computation having a plurality of input values and a plurality of interact coefficients; and at least one calculation unit. In receiving the input values, a first part and a second part of the memory cells generate a first part and a second part of the common source currents, respectively. The first part of the memory cells is electrically isolated from the second part of the memory cells based on a diagonal of the memory array. The at least one calculation unit calculates a first part and a second part of a local field energy of the model computation based on the first part and the second part of the common source currents.

Abstract: Semiconductor devices and a method for forming a semiconductor device are provided. The semiconductor device includes a substrate, a first semiconductor structure on the substrate, a second semiconductor structure on the first semiconductor structure, and a wire coupled between the substrate and the first semiconductor structure. The first semiconductor structure and the second semiconductor structure are electrically connected to the substrate through the wire. A footprint of the first semiconductor structure is greater than a footprint of the second semiconductor structure.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. The method includes forming a mask layer on a first side of a semiconductor substrate. The mask layer comprises a plurality of sidewalls defining a plurality of openings. A first etch process is performed on the semiconductor substrate to form a plurality of recesses within the semiconductor substrate. A second etch process is performed on the semiconductor substrate to expand the plurality of recesses and form a plurality of protrusions that comprise curved opposing sidewalls.

Abstract: A semiconductor structure is provided. The semiconductor structure comprises a substrate, a via, a liner layer, a barrier layer, and a conductor. The via penetrates through the substrate. The liner layer is formed on a sidewall of the via. The barrier layer is formed on the liner layer. The barrier layer comprises a conductive 2D material. The conductor fills a remaining space of the via.

Abstract: The disclosure provides an in-memory search (IMS) memory cell, an IMS method and an IMS memory device. The IMS method comprises: encoding a search data and a storage data by a first IMS encoding into a first IMS encoded search data and a first IMS encoded storage data; encoding the first IMS encoded search data by a second IMS encoding into a plurality of search voltages; encoding the first IMS encoded storage data by the second IMS encoding into a plurality of threshold voltages of a plurality of memory cells of a plurality IMS memory cells of the IMS memory device; and searching the IMS memory cells by the search voltages to generate a search result.

Abstract: A semiconductor structure is provided. The semiconductor structure comprises a substrate, a via, a liner layer, a barrier layer, and a conductor. The via penetrates through the substrate. The liner layer is formed on a sidewall of the via. The barrier layer is formed on the liner layer. The barrier layer comprises a conductive 2D material. The conductor fills a remaining space of the via.

Abstract: A cartridge assembly may be utilized in combination with an electronic nicotine delivery system for the safe, efficient and cost-effective means for delivering a controlled dose of nicotine to a user on demand. The cartridge assembly includes a reservoir with a material for holding liquid nicotine or a liquid nicotine solution and is constructed from a material that is chemically resistant to nicotine or nicotine solution. The cartridge assembly includes an anti-counterfeit feature to prevent use of an unauthorized cartridge in the electronic nicotine delivery system. The cartridge assembly also includes an anti-reuse feature that precludes reuse of the cartridge assembly once removed from the electronic nicotine delivery system. Essentially, the cartridge assembly is designed for a single use only.

Abstract: The application provides a memory device and an operation method thereof. The memory device includes: a memory array, for processing model computation having a plurality of input values and a plurality of interact coefficients; and at least one calculation unit. In receiving the input values, a first part and a second part of the memory cells generate a first part and a second part of the common source currents, respectively. The first part of the memory cells is electrically isolated from the second part of the memory cells based on a diagonal of the memory array. The at least one calculation unit calculates a first part and a second part of a local field energy of the model computation based on the first part and the second part of the common source currents.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate and a via structure. The via structure is through the substrate. The via structure includes a first conductive portion, a second conductive portion, a first barrier portion, a second barrier portion, and a third barrier portion. The first conductive portion has a ring-shaped cross section. The second conductive portion is disposed at an inner side of the first conductive portion. The second conductive portion has a ring-shaped cross section. The first barrier portion is disposed at an outer side of the first conductive portion. The second barrier portion is disposed between the first conductive portion and the second conductive portion. The third barrier portion is disposed at an inner side of the second conductive portion. At least one of the first barrier portion, the second barrier portion, or the third barrier portion includes an insulating 2D material.

Abstract: A memory device, for executing an anneal computation with first state and a second state. The memory device includes a first memory array, a second memory array, a control circuit, a sensing circuit and a processing circuit. the control circuit selects a first horizontal row of memory units from the first memory array, and selects a second horizontal row of memory units from the second memory array. The sensing circuit computes a local energy value of the first state according to the current generated by the memory units of the first horizontal row, and computes a local energy value of the second state according to the current generated by the memory units of the second horizontal row. The processing circuit updates the first state and/or the second state according to the local energy value of the first state and the local energy value of the second state.

Abstract: A memory device, for executing an anneal computation with first state and a second state. The memory device includes a first memory array, a second memory array, a control circuit, a sensing circuit and a processing circuit. the control circuit selects a first horizontal row of memory units from the first memory array, and selects a second horizontal row of memory units from the second memory array. The sensing circuit computes a local energy value of the first state according to the current generated by the memory units of the first horizontal row, and computes a local energy value of the second state according to the current generated by the memory units of the second horizontal row. The processing circuit updates the first state and/or the second state according to the local energy value of the first state and the local energy value of the second state.

Abstract: A memory device and a computing method thereof are provided in the present disclosure. The computing method includes the following steps. A plurality of input-values of a model computation are respectively received through a plurality of first-word-lines of a memory array. Inverted logic values of the input-values are respectively received through a plurality of second-word-lines. The input-values are respectively received through a plurality of first-bit-lines. The inverted logic values are respectively received through a plurality of second-bit-lines. Logic XNOR operation is performed according to each of the input-values and each of the inverted values to obtain a first computation result, and multiplied with one of self-coefficients or one of mutual coefficients of the model computation to obtain a plurality of output-values. The output-values are outputted through a plurality of common-source-lines.

Abstract: A semiconductor structure is provided. The semiconductor structure comprises a substrate, a via, a liner layer, a barrier layer, and a conductor. The via penetrates through the substrate. The liner layer is formed on a sidewall of the via. The barrier layer is formed on the liner layer. The barrier layer comprises a conductive 2D material. The conductor fills a remaining space of the via.

Abstract: A cartridge assembly may be utilized in combination with an electronic nicotine delivery system for the safe, efficient and cost-effective means for delivering a controlled dose of nicotine to a user on demand. The cartridge assembly includes a reservoir with a material for holding liquid nicotine or a liquid nicotine solution and is constructed from a material that is chemically resistant to nicotine or nicotine solution. The cartridge assembly includes an anti-counterfeit feature to prevent use of an unauthorized cartridge in the electronic nicotine delivery system. The cartridge assembly also includes an anti-reuse feature that precludes reuse of the cartridge assembly once removed from the electronic nicotine delivery system. Essentially, the cartridge assembly is designed for a single use only.

Abstract: The centrifugal channel device includes a channel body, a collecting unit and a waste liquid tank. The channel body includes a first surface and a second surface relatively disposed. The channel body includes a sample inlet, a sample channel, an isolation tank, a reagent inlet, a reagent channel and a mixing channel. The sample inlet is disposed on the first surface. The sample channel is connected to the sample inlet. The isolation tank is adjacently disposed and communicates with the sample channel. The reagent inlet is disposed on the first surface. The reagent channel is connected to the reagent inlet. One end of the mixing channel is connected with the sample channel and the reagent channel. The collecting unit has an opening and an overflow hole. The opening communicates with another end of the mixing channel. The waste liquid tank communicates with the opening of the collecting unit.

Abstract: The centrifugal channel device includes a channel body, a collecting unit and a waste liquid tank. The channel body includes a first surface and a second surface relatively disposed. The channel body includes a sample inlet, a sample channel, an isolation tank, a reagent inlet, a reagent channel and a mixing channel. The sample inlet is disposed on the first surface. The sample channel is connected to the sample inlet. The isolation tank is adjacently disposed and communicates with the sample channel. The reagent inlet is disposed on the first surface. The reagent channel is connected to the reagent inlet. One end of the mixing channel is connected with the sample channel and the reagent channel. The collecting unit has an opening and an overflow hole. The opening communicates with another end of the mixing channel. The waste liquid tank communicates with the opening of the collecting unit.

Abstract: An optical module for a digital camera includes a substrate, a light sensor installed on the substrate for sensing light, a lens holder mounted on the light sensor, a light shield disposed in a position between a top surface of the substrate and a bottom end of the lens holder, a lens installed on the lens holder for focusing light onto the light sensor, at least a fixing device, such as a screw, and at least a buffering cushion installed on a position between a top part of the screw and the substrate for reducing the impact of the top part against the substrate. The light sensor of the optical module only receives light transmitted from the lens.

Abstract: A flash unit for a camera comprises a bracket, a reflecting member, two fixed members and a flash emission tube. The bracket is disposed inside the camera, and the reflecting member is disposed inside the bracket. The fixed members are integrally formed on the bracket, and the flash emission tube is fixedly disposed inside the bracket by the fixed members. By integrally forming the fixed members on the bracket, the conventional rubber band for fixing the emission tube can be replaced. Since the number of the consisting elements of the flash unit are thereby reduced, its cost can also be reduced. In addition, assembly time can also be reduced.

Abstract: A flash unit for a camera comprises a bracket, a reflecting member, two fixed members and a flash emission tube. The bracket is disposed inside the camera, and the reflecting member is disposed inside the bracket. The fixed members are integrally formed on the bracket, and the flash emission tube is fixedly disposed inside the bracket by the fixed members. By integrally forming the fixed members on the bracket, the conventional rubber band for fixing the emission tube can be replaced. Since the number of the consisting elements of the flash unit are thereby reduced, its cost can also be reduced. In addition, assembly time can also be reduced.