Abstract: A method for estimating a flight time of a hydrogen fuel cell UAV (unmanned aerial vehicle) includes multiple steps performed by a controller: obtaining an internal pressure of a hydrogen tank by a pressure sensor installed on the hydrogen tank, calculating a remaining hydrogen volume according to the internal pressure and a capacity of the hydrogen tank, obtaining a reaction current value of the fuel cell, calculating a first hydrogen consumption rate according to the reaction current value, the number of a set of membrane electrodes connected in series and a Faraday constant, obtaining a second hydrogen consumption rate of a purge operation of an anode of the full cell; obtaining a hydrogen leakage rate of a stack of the fuel cell, and calculating the flight time according to the remaining hydrogen volume, the first hydrogen consumption rate, the second hydrogen consumption rate and the hydrogen leakage rate.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: An anti-eavesdropping system for mobile phone communication is disclosed, wherein a mobile phone is paired with a Bluetooth headset for voice data encryption and decryption, the Bluetooth headset having a microprocessor unit to perform encryption and decryption of voice data, wherein the Bluetooth headset transmits the encrypted voice data to the mobile phone, and decrypts the voice data from the mobile phone and outputs the decrypted voice data to a speaker.

Abstract: The present disclosure relates to semiconductor packages and methods of manufacturing the same. In an embodiment, the semiconductor package includes a substrate, a semiconductor element, at least one connecting element, and an encapsulant. The semiconductor element is mounted to the substrate. The connecting element is disposed on the substrate and adjacent to the semiconductor element. The encapsulant covers at least a portion of the semiconductor element and at least a portion of the connecting element and defines at least one first groove surrounding the connecting element.

Abstract: The present disclosure relates to a semiconductor package. In an embodiment, the semiconductor package includes a substrate having a lateral surface and an upper surface, a semiconductor device mounted to the substrate, and a molding compound covering the lateral surface and the upper surface of the substrate and at least a portion of the semiconductor device. A surface of the semiconductor device is substantially coplanar with a surface of the molding compound.

Abstract: An anti-eavesdropping system for mobile phone communication is disclosed, wherein a mobile phone is paired with a Bluetooth headset for voice data encryption and decryption, the Bluetooth headset having a microprocessor unit to perform encryption and decryption of voice data, wherein the Bluetooth headset transmits the encrypted voice data to the mobile phone, and decrypts the voice data from the mobile phone and outputs the decrypted voice data to a speaker.

Abstract: The present disclosure relates to a semiconductor package. In an embodiment, the semiconductor package includes a substrate having a lateral surface and an upper surface, a semiconductor device mounted to the substrate, and a molding compound covering the lateral surface and the upper surface of the substrate and at least a portion of the semiconductor device. A surface of the semiconductor device is substantially coplanar with a surface of the molding compound.

Abstract: The present disclosure relates to a semiconductor package. In an embodiment, the semiconductor package includes a substrate, a semiconductor device, a thermal conductive element and a molding compound. The semiconductor device is mounted to the substrate. The thermal conductive element is disposed above the semiconductor device. The molding compound covers a side surface of the substrate and at least a part of a side surface of the semiconductor device.

Abstract: The present disclosure relates to a semiconductor package. In an embodiment, the semiconductor package includes a substrate, a semiconductor device, a thermal conductive element and a molding compound. The semiconductor device is mounted to the substrate. The thermal conductive element is disposed above the semiconductor device. The molding compound covers a side surface of the substrate and at least a part of a side surface of the semiconductor device.

Abstract: The present disclosure relates to semiconductor packages and methods of manufacturing the same. In an embodiment, the semiconductor package includes a substrate, a semiconductor element, at least one connecting element, and an encapsulant. The semiconductor element is mounted to the substrate. The connecting element is disposed on the substrate and adjacent to the semiconductor element. The encapsulant covers at least a portion of the semiconductor element and at least a portion of the connecting element and defines at least one first groove surrounding the connecting element.

Abstract: An exemplary backlight module (3) includes a light guide plate (32) and a frame (34) accommodating the light guide plate. The light guide plate includes a main body including two side surfaces (321), and two sliding strips (325). The sliding strips extend outward from the side surfaces of the main body. Each sliding strip includes a flexible detent (326). The frame includes two opposite first walls (341). The first walls defines two sliding guides (3411) slidably receiving the light guide plate whereby the light guide plate is slidable into the frame and detachably fixed in the frame by snapping engagement of the flexible detents with the frame.

Abstract: An exemplary backlight module (20) includes a light guiding plate (240) with a light incident surface (241), a frame (230) receiving the light guiding plate, and at least one point light source (260) disposed between the light incident surface of the light guiding plate and the frame, the at least one point light sources includes a light emitting portion (262) and an elastic member (263). The light emitting portion and the elastic member are at opposite sides of the at least one point light source, and the elastic member elastically urges the frame such that the light emitting portion firmly contacts the light incident surface. A liquid crystal display using the backlight module is also provided.

Abstract: An exemplary backlight module (3) includes a light guide plate (32) and a frame (34) accommodating the light guide plate. The light guide plate includes a main body including two side surfaces (321), and two sliding strips (325). The sliding strips extend outward from the side surfaces of the main body. Each sliding strip includes a flexible detent (326). The frame includes two opposite first walls (341). The first walls defines two sliding guides (3411) slidably receiving the light guide plate whereby the light guide plate is slidable into the frame and detachably fixed in the frame by snapping engagement of the flexible detents with the frame.

Abstract: An exemplary backlight module (20) includes a light guiding plate (240) with a light incident surface (241), a frame (230) receiving the light guiding plate, and at least one point light source (260) disposed between the light incident surface of the light guiding plate and the frame, the at least one point light sources includes a light emitting portion (262) and an elastic member (263). The light emitting portion and the elastic member are at opposite sides of the at least one point light source, and the elastic member elastically urges the frame such that the light emitting portion firmly contacts the light incident surface. A liquid crystal display using the backlight module is also provided.

Abstract: An exemplary backlight module (20) includes an optical film assembly (22) having at least two optical films, each optical film having at least one ear (221) attached together; a frame (24) having at least one concave groove (243) receiving the at least one ear.

Abstract: An exemplary liquid crystal display (1) includes a liquid crystal panel (13) and a frame (12) receiving the liquid crystal panel. The frame includes a stopper (126) configured for blocking the liquid crystal panel from being pulled up. The liquid crystal display further includes a light guide plate (17) having a light incident surface (172). Light beams emitted from a plurality of point illuminators (18) enter the light incident surface (172) of the light guide plate 17, and the desired optical performance of liquid crystal display is stably maintained.

Abstract: A reinforced flexible printed circuit board (20) includes a conductive portion (21) and a connection portion (22). The conductive portion includes a first metallic wire layer (23) having a plurality of conductive metallic wires, and two first Insulation layers (24). The connection portion includes a second metallic wire layer (26) having a plurality of conductive metallic wires, two second insulation layers (27), and a reinforcement board (29) having a hand-grip portion (291). The reinforcement board is attached to one of the second insulation layers to reinforce the connection portion, and the hand-grip portion is positioned at an end of the reinforcement board so that it is convenient for workers to assemble the reinforced flexible printed circuit board to other components.