Abstract: Disclosed herein are electrospun fibrous matrix and its production method. The method mainly includes the steps of, mixing a first polymer and a drug to form a first mixture, and sonicating the first mixture until a plurality of microparticles are formed with the drug encapsulated therein; and mixing the plurality of microparticles with a second polymer to form a second mixture, subjecting the second mixture to a wet electrospinning process to form the electrospun fibrous matrix. The thus-produced electrospun fibrous matrix is characterized by having a plurality of first and second fibrils woven together, in which each second fibril has a plurality of drug-encapsulated microparticles independently integrated and disposed along the longitudinal direction of the second fibril. Also disclosed herein is a method for treating a wound of a subject. The method includes applying the present electrospun fibrous matrix to the wound of the subject.

Abstract: Disclosed herein are electrospun fibrous matrix and its production method. The method mainly includes the steps of, mixing a first polymer and a drug to form a first mixture, and sonicating the first mixture until a plurality of microparticles are formed with the drug encapsulated therein; and mixing the plurality of microparticles with a second polymer to form a second mixture, subjecting the second mixture to a wet electrospinning process to form the electrospun fibrous matrix. The thus-produced electrospun fibrous matrix is characterized by having a plurality of first and second fibrils woven together, in which each second fibril has a plurality of drug-encapsulated microparticles independently integrated and disposed along the longitudinal direction of the second fibril. Also encompassed in the present disclosure is a method for treating a wound of a subject. The method includes applying the present electrospun fibrous matrix to the wound of the subject to accelerate wound healing.

Abstract: A high-voltage semiconductor device includes a substrate, a first insulating structure, a gate, a drain region, a source region and a doped region. The substrate has a first conductive type, and the first insulating structure is disposed on the substrate. The drain region and the source region are disposed in the substrate. The source region has a first portion and a second portion. The first portion has the second conductive type and the second portion has the first conductive type. The gate is disposed on the substrate, between the source region and the drain region to partially cover a side of the first insulating structure. The doped region is disposed in the substrate and has a first doped region and a second doped region, and the first doped region and the second doped region both include the first conductive type and separately disposed under the first insulating structure.

Abstract: A welding wire feeding device includes a base, a fixing post, a pressing member, a motor, and a conveying mechanism. The pressing member is pivotally connected with a driven wheel. A tension spring is provided between the fixing post and the pressing member. A shaft portion of the motor is pivotally connected with a driving wheel. The conveying mechanism is coupled to the base and has an air hole. The base is formed with a first passage and a second passage connected with a gas cylinder. The length of the conveying tube of the conveying mechanism can be adjusted by pressing. A wire is sandwiched between the driving wheel and the driven wheel through the tension spring. The motor drives the driving wheel to rotate the driven wheel so as to continuously convey the wire; meanwhile, the inert gas can be sent out through the second passage and the conveying mechanism to prevent a workpiece from being oxidized.

Abstract: A smart tape has a flexible substrate, chip, conductive glue, shielding layer and back glue layer. The chip is disposed above or below the flexible substrate. The conductive glue is electrically connected to the chip through the flexible substrate and has a specific pattern, so as to function as a sensing unit for sensing whether the smart tape has been peeled off. The shielding layer is disposed above the chip to protect the chip and prevent oxidation of the conductive glue. The back glue layer is disposed below the flexible substrate.

Abstract: An impedance chip detection system for biological testing includes a sensor and a portable detector. The sensor includes an absorbing layer, a sensing layer, and a transmitting layer, and the detector includes a detection slot, a control module provided for an impedance measurement and calculation of a specimen, and a display module for displaying a detection result of the specimen, so that after the sensor is plugged into the detection slot, the sensor performs an impedance measurement and calculation of the specimen and the detector displays the detection result.

Abstract: An ultrasonic tactile sensor for detecting a clamping force includes an ultrasonic detector and a sensing layer, and the sensing layer includes a first soft layer and a second soft layer, and the first soft layer has plural spherical microstructures arranged in contact with the ultrasonic detector, so that after a pressure is applied to the sensing layer, the ultrasonic detector generates an ultrasonic wave and receives a reflected wave signal, and the signal is provided for identifying the contact area of the spherical microstructures and deriving the force exerted on the tactile sensor.

Abstract: A laser wire feeding system includes a wire feeding device, a laser device, a first controller, and a second controller, and the first and second controllers are provided for sensing whether or not the wire feeding device normally conveys wires and whether or not a wire output end of the wire feeding device shifts is offset from the laser irradiation position of the laser device, and driving a motor to shift a horizontal shifting seat fixed with the wire feeding device to fine tune the wire feeding position according to the offset position.

Abstract: A surface-mount piezoelectric sensor applied to logistics for real-time monitoring is provided. The piezoelectric sensor includes a flexible substrate in the form of a cross and a conductive line formed on the flexible substrate. A plurality of sensing members corresponding in number to end faces of a packaging box is adhered to the conductive line. The cross-shaped piezoelectric sensor is placed at the bottom of the packaging box, and the sensing members of the piezoelectric sensors are bonded to the respective end faces of the packaging box by means of a turnover operation, thereby simplifying the operation process and providing an all-round monitoring effect.

Abstract: A stretchable piezoelectric sensor applied to logistics for real-time monitoring includes a stretchable flexible substrate and a conductive layer formed on the flexible substrate. A plurality of sensing members corresponding in number to end faces of a packaging box is adhered to the conductive layer. When the piezoelectric sensor is placed at the bottom of the packaging box containing goods, two ends of the piezoelectric sensor can be stretched to fit on the diagonal corners of the packaging box, and the sensing members are located on the respective end faces of the packaging box to achieve an all-round monitoring.

Abstract: A stretchable piezoelectric sensor applied to logistics for real-time monitoring includes a stretchable flexible substrate and a conductive layer formed on the flexible substrate. A plurality of sensing members corresponding in number to end faces of a packaging box is adhered to the conductive layer. When the piezoelectric sensor is placed at the bottom of the packaging box containing goods, two ends of the piezoelectric sensor can be stretched to fit on the diagonal corners of the packaging box, and the sensing members are located on the respective end faces of the packaging box to achieve an all-round monitoring.

Abstract: An ultrasonic tactile sensor for detecting a clamping force includes an ultrasonic detector and a sensing layer, and the sensing layer includes a first soft layer and a second soft layer, and the first soft layer has plural spherical microstructures arranged in contact with the ultrasonic detector, so that after a pressure is applied to the sensing layer, the ultrasonic detector generates an ultrasonic wave and receives a reflected wave signal, and the signal is provided for identifying the contact area of the spherical microstructures and deriving the force exerted on the tactile sensor.

Abstract: A welding wire feeding device includes a base, a fixing post, a pressing member, a motor, and a conveying mechanism. The pressing member is pivotally connected with a driven wheel. A tension spring is provided between the fixing post and the pressing member. A shaft portion of the motor is pivotally connected with a driving wheel. The conveying mechanism is coupled to the base and has an air hole. The base is formed with a first passage and a second passage connected with a gas cylinder. The length of the conveying tube of the conveying mechanism can be adjusted by pressing. A wire is sandwiched between the driving wheel and the driven wheel through the tension spring. The motor drives the driving wheel to rotate the driven wheel so as to continuously convey the wire; meanwhile, the inert gas can be sent out through the second passage and the conveying mechanism to prevent a workpiece from being oxidized.

Abstract: A spring type firing mechanism applied to an endoscope accessory includes a housing, a cap, a bottom cover, a driving module, a buffering module and a spring pipeline, and the spring pipeline includes a push-rod coupled to the sensor, and the driving module includes a firing spring and a restoring spring, and the two springs have different rigidities so as to form a reciprocating structure of the firing mechanism. After the sensor of the firing mechanism is triggered, the resilience of the restoring spring compresses the firing spring back to its firing length, so as to restore its position by a single driving point and allow users to complete the firing operation by one hand and simplify the operation of doctors to improve convenience and efficiency.

Abstract: An apparatus for detecting tissue hardness of a living body includes a housing, a cap, a bottom cover, a driving module, a buffering module, a spring pipeline, a push-rod and a detecting module, and the driving module includes a firing spring and a restoring spring, and the two springs have different rigidities so as to form a reciprocating structure of the firing mechanism. After the detecting module of a firing mechanism is triggered, the resilience of the restoring spring compresses the firing spring back to its firing length, so as to restore its position by a single driving point and allow users to complete the firing operation by one hand and simplify the operation of doctors to improve convenience and efficiency.

Abstract: An apparatus for detecting tissue hardness of a living body includes a housing, a cap, a bottom cover, a driving module, a buffering module, a spring pipeline, a push-rod and a detecting module, and the driving module includes a firing spring and a restoring spring, and the two springs have different rigidities so as to form a reciprocating structure of the firing mechanism. After the detecting module of a firing mechanism is triggered, the resilience of the restoring spring compresses the firing spring back to its firing length, so as to restore its position by a single driving point and allow users to complete the firing operation by one hand and simplify the operation of doctors to improve convenience and efficiency.

Abstract: A spring type firing mechanism applied to an endoscope accessory includes a housing, a cap, a bottom cover, a driving module, a buffering module and a spring pipeline, and the spring pipeline includes a push-rod coupled to the sensor, and the driving module includes a firing spring and a restoring spring, and the two springs have different rigidities so as to form a reciprocating structure of the firing mechanism. After the sensor of the firing mechanism is triggered, the resilience of the restoring spring compresses the firing spring back to its firing length, so as to restore its position by a single driving point and allow users to complete the firing operation by one hand and simplify the operation of doctors to improve convenience and efficiency.

Abstract: A transparent conductive film includes a transparent substrate. A support layer is formed on one surface of the substrate. A surface of the support layer away from the substrate defines grooves formed in a mesh pattern. An ink layer is formed at a bottom of the grooves. A conductive layer is formed on the ink layer and in a mesh pattern. A top of the conductive layer protrudes out of the grooves.

Abstract: Disclosed are a substrate with a microstructure and a method for producing the same. In this method microparticles of a random allocation by means of a natural self-assembly mechanism are used to coat on a master mold. Firstly, hollow micro glass particles within a specific size range are mixed with a UV-curable adhesive to become a mixed solution. Afterwards, the master mold is dip-coated in the mixed solution and the microparticles coated on the master mold are self-assembled. To fix the microparticles on the master mold to form a sphere array microstructure with a three dimensional random allocation, a UV light source is used to radiate the master mold for curing. Afterwards, an inverse mold with the corresponding microstructure is fabricated by electroforming or polydimethylsiloxane (PDMS) casting the master mold. Thus, the inverse mold can be applied to the fabrication of a substrate with the corresponding microstructure.

Abstract: The present invention provides an apparatus for performing a measurement inside a living body. The apparatus includes a first sensing element, a manipulating device and an analyzing device. The first sensing element performs the measurement. The manipulating device is coupled to the first sensing element, and manipulates the first sensing element. The analyzing device is for analyzing the measurement.