Patents by Inventor Cheng-Hsing Lee

Cheng-Hsing Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240093114
    Abstract: A lubricant adheres to a magnetic recording medium via at least one of chemisorption or bonding, and contains a perfluorinated polyether attached to or terminated with a functional group that is phosphonic acid, silanol or carboxylic acid, and may be: R1—Rf—R1 where Rf is —CF2O(CF2CF2CF2CF2O)n—, —CF2O(CF2CF2CF2O)nCF2—, —CF2O[CF(CF3)CF2O]nCF2—, —CF2O(CF2CF2O)m(CF2O)nCF2—, —CF2O(CF2CF2O)nCF2—, n, m is from 1 to 100 and R1 is the functional group. A lubricant is formed from a multiple ether segments according to formula: Re1—Rb1-Ri-Rc-Ri-Rb2—Re2; where Rc includes perfluoroalkyl ether, Rb1 and Rb2 are, independently, a sidechain segment including a perfluoroalkyl ether, optional Ri independently is a divalent linking segment including a functional group including elements from periodic table Group 13-17, and of Re1 and Re2 are phosphonic acid, silanol or carboxylic acid.
    Type: Application
    Filed: May 31, 2023
    Publication date: March 21, 2024
    Inventors: Xingliang He, Huaming Xu, Jianming Wen, Charles Cheng-Hsing Lee
  • Patent number: 11937370
    Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: March 19, 2024
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Publication number: 20240071281
    Abstract: A display device includes a display panel and a circuit. For a first sub-pixel, the circuit obtains a corresponding second sub-pixel. The circuit calculates a first compensation value according to the grays levels of the first sub-pixel and the second sub-pixel, and calculates a second compensation value according to the polarity states of the first sub-pixel and the second sub-pixel and the difference between the gray levels of the two sub-pixels. The circuit also calculates a gain according to the position of the first sub-pixel, compensates the gray level to the first sub-pixel according to the first compensation value, the second compensation value and the gain to obtain an output gray level, and drives the first sub-pixel according to the output gray level.
    Type: Application
    Filed: June 16, 2023
    Publication date: February 29, 2024
    Inventors: Cheng-Hsun LEE, Tsai Hsing CHEN, Cheng Che TSAI, Ching-Wen WANG
  • Patent number: 7180740
    Abstract: The present invention is a method and an apparatus for side-type heat dissipation. According to the present invention, a heat dissipation unit is deposed on a CPU to absorb the heat it generates; a cover is covered on the unit, where two openings are at two opposite ends and one of the openings has an inclined plane as well as a fan, and one of the openings is corresponding to a fan on the computer case; and an air flow is guided by a fan to the heat dissipation unit and is directed to a fan of a power supplier to be blown out of the computer case. By doing so, no thermal cycling will occur in the computer case and better heat-dissipation efficiency can be obtained.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: February 20, 2007
    Assignee: Datech Technology Co., Ltd.
    Inventors: Nien-Lun Li, Yun-Yeu Yeh, To Hsu, Hung-Chung Chu, Cheng-Hsing Lee
  • Publication number: 20060102325
    Abstract: The present invention is a guiding fin heat sink, where a heat-dissipation unit is stuck on a CPU by a base and the unit has guiding channels passing through two ends; heat pipes are located between the base and the unit at one end, the other end is made penetrating through the guiding channels, and one end surface of the guiding channels is corresponding to an opening on a side wall of a computer case; and, after the heat of the CPU is absorbed by the base, it is directed to the heat-dissipation unit and the heat pipes and is carried to the outside of the computer case by an air flow made a fan between the case and the unit, so that no heat re-cycling is in the case and better heat dissipation efficiency is obtained.
    Type: Application
    Filed: November 17, 2004
    Publication date: May 18, 2006
    Inventors: Nien-Lun Li, Yun-Yeu Yeh, To Hsu, Hung-Chung Chu, Cheng-Hsing Lee
  • Publication number: 20060067050
    Abstract: The present invention is a method and an apparatus for side-type heat dissipation. According to the present invention, a heat dissipation unit is deposed on a CPU to absorb the heat it generates; a cover is covered on the unit, where two openings are at two opposite ends and one of the openings has an inclined plane as well as a fan, and one of the openings is corresponding to a fan on the computer case; and an air flow is guided by a fan to the heat dissipation unit and is directed to a fan of a power supplier to be blown out of the computer case. By doing so, no thermal cycling will occur in the computer case and better heat-dissipation efficiency can be obtained.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 30, 2006
    Inventors: Nien-Lun Li, Yun-Yeu Yeh, To Hsu, Hung-Chung Chu, Cheng-Hsing Lee
  • Patent number: 6945319
    Abstract: The present invention is a symmetrical heat sink module with a heat pipe for spreading of heat, comprising a first and a second sets of fins each with a first and a second heat dissipation areas where the first and the second heat dissipation areas each comprises corresponding concave parts; a curved heat pipe between the concave parts with the bottom being convex out of the bottom of the first and the second sets of fins; and a base at the convex bottom of the curved heat pipe. Accordingly, the first and the second sets of fins are corresponding to each other so that the heat sink module obtains larger heat dissipation area and the function of two-side dissipation to achieve better heat dissipation efficiency.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: September 20, 2005
    Assignee: Datech Technology Co., Ltd.
    Inventors: Nien-Lun Li, To Hsu, Cheng-Hsing Lee, Hung-Chung Chu
  • Patent number: 5945685
    Abstract: A glass disk substrate inspection tool uses a polarized laser beam that is directed to the first surface of the disk substrate at Brewster's angle and is then transmitted through the disk substrate to a light detector that generates a signal representative of the intensity of the light received. Because the light polarized parallel to the plane of incidence, i.e., the plane formed by the line of the incident beam and a line perpendicular to the surface of the disk substrate, is completely transmitted, there is no surface reflection at either the first or second surfaces of the disk substrate. The polarized beam is directed by a first rotating scanner to the input of a telecentric lens assembly that provides an output beam parallel to its optical axis as the beam is being scanned. The beam is then directed by a first fixed mirror to strike the first surface of the disk substrate at Brewster's angle as the beam is scanned along a line across the first disk surface.
    Type: Grant
    Filed: November 19, 1997
    Date of Patent: August 31, 1999
    Assignee: International Business Machines Corporation
    Inventors: Wayne Isami Imaino, Anthony Juliana, Jr., Milton Russell Latta, Charles Cheng-Hsing Lee, Wai Cheung Leung, Hal Jervis Rosen