Patents by Inventor Cheng-Hsiu Ku

Cheng-Hsiu Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150136359
    Abstract: A flexible heat transfer assembly includes a covering layer (100) and a functional filler (200). The covering layer (100) surroundingly forms a sealed chamber (11), in which the material of the covering layer (100) is one of rubber, silica rubber, and resin. The functional filler (200) is filled in the sealed chamber (110). The functional filler (200) comprises at least one of silicone, silicone oil, silica gel, and paraffin, and at least one of ceramic powder, metal powder, metal oxide powder, and graphene. By means of the covering layer (100) tightly attached to a heat-generating part and by means of the heat transfer of the functional filler (200), the flexible heat transfer assembly can absorb or dissipate the heat generated by the heat-generating part.
    Type: Application
    Filed: November 19, 2013
    Publication date: May 21, 2015
    Applicant: NEWTECH ENTERPRISE LIMITED
    Inventor: Cheng-Hsiu KU
  • Patent number: 8461282
    Abstract: The present invention discloses an iridium complex containing a (pentaphenyl)phenyl ligand, having the following general equation: in which G is primary ligand, R? and R? are auxiliary ligands. On the other hand, the present invention discloses a compound with a 9-[(pentaphenyl)phenyl]carbazole structure and its polymeric derivative.
    Type: Grant
    Filed: December 2, 2009
    Date of Patent: June 11, 2013
    Assignee: National Taiwan University
    Inventors: Kuo-Huang Hsieh, Man-Kit Leung, Wen-Chang Chen, Chao-Hui Kuo, Hong-Jun Chen, Hsin-Chung Ke, Cheng-Hsiu Ku
  • Publication number: 20100137461
    Abstract: The present invention discloses an iridium complex containing a (pentaphenyl)phenyl ligand, having the following general equation: in which G is primary ligand, R? and R? are auxiliary ligands. On the other hand, the present invention discloses a compound with a 9-[(pentaphenyl)phenyl]carbazole structure and its polymeric derivative.
    Type: Application
    Filed: December 2, 2009
    Publication date: June 3, 2010
    Applicant: National Taiwan University
    Inventors: Kuo-Huang Hsieh, Man-Kit Leung, Wen-Chang Chen, Chao-Hui Kuo, Hong-Jun Chen, Hsin-Chung Ke, Cheng-Hsiu Ku
  • Publication number: 20100026168
    Abstract: The present invention discloses a photo-curable hole-transport material used in a polymer light-emitting diode. The photo-curable hole-transport material comprises at least one first conjugate structure, at least one connecting structure, and at least one second conjugate structure. The first conjugate structure is a triarylamine derivative. The second conjugate structure is a carbazole derivative. The connecting structure is derived from one structure selected from the group consisting of the following or the combination thereof: urethane and urea structures.
    Type: Application
    Filed: January 21, 2009
    Publication date: February 4, 2010
    Applicant: National Taiwan University
    Inventors: Kuo-Huang Hsieh, Man-Kit Leung, Wen-Chang Chen, Cheng-Hsiu Ku, Chih-Yu Chen, Cheng-Dar Liu, Ching-Nan Chuang, Yu-Shan Cheng
  • Publication number: 20080293945
    Abstract: The present invention discloses an iridium complex containing a (pentaphenyl)phenyl ligand, having the following general equation: in which G is primary ligand, R? and R? are auxiliary ligands. On the other hand, the present invention discloses a compound with a 9-[(pentaphenyl)phenyl]carbazole structure and its polymeric derivative.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 27, 2008
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: Kuo-Huang Hsieh, Man-Kit Leung, Wen-Chang Chen, Chao-Hui Kuo, Hong-Jun Chen, Hsin-Chung Ke, Cheng-Hsiu Ku