Abstract: A cooling device includes a cooling tank, a plurality of circuit board modules received in the cooling tank, and a fill unit received in the cooling tank. The fill unit includes a plurality of first fill modules corresponding to the plurality of circuit board modules. The plurality of first fill modules, the cooling tank and the circuit board modules form a gap, and a plurality of coolant is filled in the gap to dissipate heat for the plurality of circuit board modules.

Abstract: The disclosure heat-dissipation system for a server provides a refrigeration tank configured for containing a refrigerant, a electrical component installed inside of the refrigeration tank submerged by the refrigerant and converts the refrigerant to a vapor, a cooling device installed outside of the refrigeration tank. A heat exchanger is coupled to the cooling device and installed outside of the refrigeration tank, the heat exchanger obtains the vapor from the refrigeration tank; wherein the heat exchanger exchanges the heated fluid formed by the vapor with the cooling device, for cooling the heated fluid, to return to the refrigeration tank.

Abstract: An air duct includes a hollow main body defining a through slot, an inlet member and an outlet member connected to opposite ends of the main body. The inlet member includes a top wall, a bottom wall, a first sidewall, and a second sidewall. The second sidewall slantingly extends forward and away from the first sidewall. A space communicating with the through slot is bounded by the top wall, the bottom wall, and the first and second sidewalls. The space has an inlet wider than the through slot. The outlet member is perpendicularly connected to the main body and defines an outlet communicating with the through slot.

Abstract: An IT device managing method is applied for an electronic device. The electronic device can communicate with a number of IT devices. The method includes the following steps. Periodically obtaining a temperature of each IT device, determining a load of each IT device corresponding to the obtained temperature and comparing each determined load with a preset value to determine the load of which IT device is greater than or equal to the preset value and determine the load of which IT device is less than the preset value. Obtaining a job currently run by the IT device that has a load greater than the preset value, and control the IT device to stop running the job. Controlling one IT device that has a load less than the preset value to run the job obtained from the IT device that has a load greater than or equal to the preset value.

Abstract: An electronic device includes a chassis and an air guiding apparatus. The chassis includes a bottom wall, a first sidewall, a second sidewall, a first end wall, a second end wall, a circuit board mounted on the bottom wall, and a fan. The air guiding apparatus includes a flexible air guiding piece. The first and second end walls each define a number of vents. A chip is mounted on the circuit board. The fan is installed in the chassis adjacent to the vents of the second end wall. The air guiding apparatus is fixed to the first end wall. A first end of the air guiding piece is stretchable to be fixed to the second end wall. The air guiding piece, the first sidewall, the first end wall, and the second end wall cooperatively bound an airflow channel for receiving the fan and the chip.

Abstract: An electronic device includes a main body and a number of fan modules. The main body defines a number of vents in a top of the main body. The fan modules are mounted to the top of the main body. Each fan module includes a housing and a fan. The housing includes a side plate defining an opening aligned with the vents. A stop plate is pivotably connected to a first end of the opening, and is operable to cover the opening. The fan is mounted in the housing, and is near a second end of the opening opposite to the first end.

Abstract: An air duct includes a hollow main body defining a through slot, an inlet member and an outlet member connected to opposite ends of the main body. The inlet member includes a top wall, a bottom wall, a first sidewall, and a second sidewall. The second sidewall slantingly extends forward and away from the first sidewall. A space communicating with the through slot is bounded by the top wall, the bottom wall, and the first and second sidewalls. The space has an inlet wider than the through slot. The outlet member is perpendicularly connected to the main body and defines an outlet communicating with the through slot.

Abstract: A method for selecting fans for a server cabinet includes the following steps. First, a type of fan stored in a database is selected, and the parameters related to the fan of the selected type are compared to input parameters of a server cabinet. Second, a maximum quantity of the fan of the selected type that can be accommodated in the server cabinet is calculated. Third, an airflow of an initial quantity of the fan of the selected type is calculated when the initial quantity of the fan of the selected type is determined to be less than the maximum quantity. Fourth, the initial quantity of the fan of the selected type and the related parameters of the fan of the selected type are output to a display if the calculated airflow is determined to be greater than or equal to a minimum required airflow of the server cabinet.

Abstract: An enclosure includes a sidewall defining a number of first vents and a shield apparatus installed to the sidewall. The shield apparatus includes a shield plate spaced from the sidewall. A distance between the sidewall and the shield plate is greater than a size of the first vent. The shield plate defines a number of second vents respectively aligning with the first vents.

Abstract: A thermal test determining method is executed by a computing device to set a preset test time of each thermal test of a server. To-be-monitored channels of the server are selected. A fan rotation speed for each thermal test is set. In each thermal test, a control command is transmitted to the server to control fans to work according to the fan rotation speed. The temperature of each to-be-monitored channel is obtained from the temperature recorder. A reference temperature is selected from N obtained temperatures of each to-be-monitored channel. The reference temperature is compared with each temperature obtained after the reference temperature. The server is determined to has reached temperature equalization if each comparison result is not greater than a preset value, and the actual test time of each thermal test is not greater than the preset test time. A related computing device and storage medium is also provided.

Abstract: A fan selection method is provided. The method determines an optimal amount of each type of fan to be used in a cabinet. The optimal amount of each type of fan is determined by an intersection between a fan performance curve and an airflow resistance curve of the cabinet. The model number and optimal amount of each type of fan is output to a user.

Abstract: A welding apparatus to weld two wires includes a chassis, a direct current (DC) power supply, and a contacting plate. The contacting plate is electrically connected to a cathode of the DC power supply. The chassis defines an entrance aligned with the contacting plate. A socket is attached to the chassis and electrically connected to the anode of the DC power supply. Separated ends of the wires are connected to the socket. Joint ends of the metal wires are twisted together and extend into the chassis through the entrance to contact with the contacting plate to cause a rush current to flow through the wires.

Abstract: An electronic device includes a plate and an air baffle assembly. The plate defines a through hole. The air baffle assembly is mounted in the through hole. The air baffle assembly includes a base mounted to a portion of the plate bounding the through hole, and a number of bristle-shaped flexible air baffle portions formed on the base to partially cover the through hole.

Abstract: An airflow guide member includes an airflow guide cover and a movable plate. The airflow guide cover includes a top plate and a number of airflow guide plates extending in a fore-and-aft direction from a bottom of the top plate. Front ends of the airflow guide plates extend forward and out of a front side of the top plate. The movable plate is slidably connected to the top plate and is capable of sliding forward to cover the front ends of the airflow guide plates.

Abstract: A card socket assembly includes a card socket and a non-conductive airflow guide member. The card socket includes a main body defining a slot, and two latches rotatably connected to opposite ends of the main body. The airflow guide member includes a main plate and an airflow guide plate. A bottom of the main plate is inserted into the slot of the card socket. Two notches are defined in a first end and a second end of the main plate opposite to the first end, to receive the latches. The airflow guide plate is formed on the first end of the main plate, and includes an airflow guide portion slanted relative to the main plate, to guide airflow away from the card socket.

Abstract: An electronic device includes a chassis and an air guiding apparatus. The chassis includes a bottom wall, a first sidewall, a second sidewall, a first end wall, a second end wall, a circuit board mounted on the bottom wall, and a fan. The air guiding apparatus includes a flexible air guiding piece. The first and second end walls each define a number of vents. A chip is mounted on the circuit board. The fan is installed in the chassis adjacent to the vents of the second end wall. The air guiding apparatus is fixed to the first end wall. A first end of the air guiding piece is stretchable to be fixed to the second end wall. The air guiding piece, the first sidewall, the first end wall, and the second end wall cooperatively bound an airflow channel for receiving the fan and the chip.

Abstract: An enclosure includes a sidewall defining a number of first vents and a shield apparatus installed to the sidewall. The shield apparatus includes a shield plate spaced from the sidewall. A distance between the sidewall and the shield plate is greater than a size of the first vent. The shield plate defines a number of second vents respectively aligning with the first vents.

Abstract: A heat sink assembly includes a fixing plate, a heat sink, a number of first fasteners, and a second fastener. The fixing plate includes a number of first poles and a second pole extending from a top of the fixing plate. A first threaded hole is defined in a top of each first pole, and a first threaded portion is formed on a top of the second pole. The heat sink includes a base. The first and second fasteners are extended through the base. A second threaded portion is formed on a bottom of each first fastener, and engages in a corresponding one of the first threaded holes. A second threaded hole is defined in a bottom of the second fastener, and engages with the first threaded portion. The second pole and the second fastener can limit the heat sink fixed to the fixing plate to only one angle.