Patents by Inventor Cheng-Hsiung Wang

Cheng-Hsiung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120317
    Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.
    Type: Application
    Filed: July 13, 2023
    Publication date: April 11, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Cheng-Hsiung Yang, Chien Te Chen, Cong Zhang, Ching-Chuan Hsieh, Yu-Ying Tan, Juan Zhou, Ai-wen Wang, Yih-Fran Lee, Yu-Wen Huang
  • Publication number: 20230225050
    Abstract: A circuit board structure includes a circuit substrate, a first circuit layer, and a second circuit layer. The circuit substrate has a surface and includes at least one conductive structure and at least one patterned circuit layer. The conductive structure is electrically connected to the patterned circuit layer, and an upper surface of the conductive structure is aligned with the surface. The first circuit layer is directly disposed on the surface of the circuit substrate and electrically connected to the conductive structure. A line width of the first circuit layer is less than or equal to ΒΌ of a line width of the patterned circuit layer. The second circuit layer is directly disposed on the first circuit layer and electrically connected to the first circuit layer.
    Type: Application
    Filed: August 30, 2022
    Publication date: July 13, 2023
    Applicant: Unimicron Technology Corp.
    Inventors: Kuang-Ching Fan, Chih-Peng Hsieh, Cheng-Hsiung Wang
  • Patent number: 8649328
    Abstract: A system and a method for controlling a power line network are provided. In the system and the method, a control unit device in every control network generates its own control network identification (CNID) and sends query messages to the other control networks to ensure each CNID is unique in the signal-reachable networks. The system and the method differentiate messages of the local control network from messages of the other control networks based on received signal strength of the messages in order to correctly demarcate multiple control networks.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: February 11, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Max Meng-Yu Lee, Cheng-Hsiung Wang, Chun-Yu Wang
  • Publication number: 20130039219
    Abstract: A system and a method for controlling a power line network are provided. In the system and the method, a control unit device in every control network generates its own control network identification (CNID) and sends query messages to the other control networks to ensure each CNID is unique in the signal-reachable networks. The system and the method differentiate messages of the local control network from messages of the other control networks based on received signal strength of the messages in order to correctly demarcate multiple control networks.
    Type: Application
    Filed: November 29, 2011
    Publication date: February 14, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Max Meng-Yu Lee, Cheng-Hsiung Wang, Chun-Yu Wang
  • Patent number: 6132846
    Abstract: A method for producing a plastic tile includes the steps of: preparing a molding material consisting essentially of a resinous powder, diatom powder, barium sulfate and organo-tin; and injection molding the molding material. The resinous powder contains, by weight, 60% of acrylonitrile butadiene styrene and 40% of polyvinyl chloride.
    Type: Grant
    Filed: August 26, 1998
    Date of Patent: October 17, 2000
    Inventors: Cheng-Hsiung Wang, Yi-Chin Wang