Patents by Inventor Cheng-Hsiung Wang

Cheng-Hsiung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12108530
    Abstract: A circuit board structure includes a circuit substrate, a first circuit layer, and a second circuit layer. The circuit substrate has a surface and includes at least one conductive structure and at least one patterned circuit layer. The conductive structure is electrically connected to the patterned circuit layer, and an upper surface of the conductive structure is aligned with the surface. The first circuit layer is directly disposed on the surface of the circuit substrate and electrically connected to the conductive structure. A line width of the first circuit layer is less than or equal to 1/4 of a line width of the patterned circuit layer. The second circuit layer is directly disposed on the first circuit layer and electrically connected to the first circuit layer.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: October 1, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Kuang-Ching Fan, Chih-Peng Hsieh, Cheng-Hsiung Wang
  • Publication number: 20230225050
    Abstract: A circuit board structure includes a circuit substrate, a first circuit layer, and a second circuit layer. The circuit substrate has a surface and includes at least one conductive structure and at least one patterned circuit layer. The conductive structure is electrically connected to the patterned circuit layer, and an upper surface of the conductive structure is aligned with the surface. The first circuit layer is directly disposed on the surface of the circuit substrate and electrically connected to the conductive structure. A line width of the first circuit layer is less than or equal to ΒΌ of a line width of the patterned circuit layer. The second circuit layer is directly disposed on the first circuit layer and electrically connected to the first circuit layer.
    Type: Application
    Filed: August 30, 2022
    Publication date: July 13, 2023
    Applicant: Unimicron Technology Corp.
    Inventors: Kuang-Ching Fan, Chih-Peng Hsieh, Cheng-Hsiung Wang
  • Patent number: 8649328
    Abstract: A system and a method for controlling a power line network are provided. In the system and the method, a control unit device in every control network generates its own control network identification (CNID) and sends query messages to the other control networks to ensure each CNID is unique in the signal-reachable networks. The system and the method differentiate messages of the local control network from messages of the other control networks based on received signal strength of the messages in order to correctly demarcate multiple control networks.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: February 11, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Max Meng-Yu Lee, Cheng-Hsiung Wang, Chun-Yu Wang
  • Publication number: 20130039219
    Abstract: A system and a method for controlling a power line network are provided. In the system and the method, a control unit device in every control network generates its own control network identification (CNID) and sends query messages to the other control networks to ensure each CNID is unique in the signal-reachable networks. The system and the method differentiate messages of the local control network from messages of the other control networks based on received signal strength of the messages in order to correctly demarcate multiple control networks.
    Type: Application
    Filed: November 29, 2011
    Publication date: February 14, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Max Meng-Yu Lee, Cheng-Hsiung Wang, Chun-Yu Wang
  • Patent number: 6132846
    Abstract: A method for producing a plastic tile includes the steps of: preparing a molding material consisting essentially of a resinous powder, diatom powder, barium sulfate and organo-tin; and injection molding the molding material. The resinous powder contains, by weight, 60% of acrylonitrile butadiene styrene and 40% of polyvinyl chloride.
    Type: Grant
    Filed: August 26, 1998
    Date of Patent: October 17, 2000
    Inventors: Cheng-Hsiung Wang, Yi-Chin Wang