Abstract: A power device suited for being assembled in a chassis and connected with a plug is provided. The power device includes a housing, and a receptacle, a spring clamp, a position limiting element disposed on the housing. The plug is removably connected to the receptacle. The spring clamp has a moving end. The position limiting element is located between the spring clamp and the receptacle. The position limiting element and the moving end of the spring clamp are linked together to move between a first position and a second position relative to the housing. When the plug connects to the receptacle, the position limiting element is interfered with the plug and the spring clamp simultaneously so that the spring clamp is constrained at the first position.

Abstract: A power device suited for being assembled in a chassis and connected with a plug is provided. The power device includes a housing, and a receptacle, a spring clamp, a position limiting element disposed on the housing. The plug is removably connected to the receptacle. The spring clamp has a moving end. The position limiting element is located between the spring clamp and the receptacle. The position limiting element and the moving end of the spring clamp are linked together to move between a first position and a second position relative to the housing. When the plug connects to the receptacle, the position limiting element is interfered with the plug and the spring clamp simultaneously so that the spring clamp is constrained at the first position.

Abstract: A solid includes crosslinked amphiphilic organosilicate precursors. The amphiphilic organosilicate precursors form a matrix with an array of micro-structures dispersed in the matrix.

Abstract: Template-based methods fabricate organosilicate materials with mesoscopic structures. The methods include providing solutions of amphiphilic template molecules, mixing amphiphilic organosilicate precursors into the solutions to form mixtures, and evaporating solvent from the mixtures. The evaporation steps produce composites in which the amphiphilic organosilicate precursors have nontrivial mesoscopic structures.

Abstract: Template-based methods fabricate organosilicate materials with mesoscopic structures. The methods include providing solutions of amphiphilic template molecules, mixing amphiphilic organosilicate precursors into the solutions to form mixtures, and evaporating solvent from the mixtures. The evaporation steps produce composites in which the amphiphilic organosilicate precursors have nontrivial mesoscopic structures.

Abstract: Template-based methods fabricate organosilicate materials with mesoscopic structures. The methods include providing solutions of amphiphilic template molecules, mixing amphiphilic organosilicate precursors into the solutions to form mixtures, and evaporating solvent from the mixtures. The evaporation steps produce composites in which the amphiphilic organosilicate precursors have nontrivial mesoscopic structures.

Abstract: A method for bonding one body to another, such as a laser device to a submount, uses a metallic layer composed of a Group VB metal, such as niobium, sandwiched between a non-metallic layer and solder layer formed by an approximate Au-Sn eutectic layer. Advantageously the Group VB layer is formed at a submount temperature of less than approximately 201.degree. C., advantageously less than approximately 125.degree. C., and preferably less than approximately 101.degree. C.--advantageously to a thickness in the approximate range 0.05 .mu.m to 0.2 .mu.m, or even thinner if pinholes do not develop. The non-metallic layer is located on one of the bodies, and the other body has a metallic coating advantageously capped with an Au layer.

Abstract: A method for enhancing linewidth control during the patterning of a substrate with a resist is disclosed. Resists used in the invention have chemically separated structures characterized by two types of regions of different chemical composition, which different types of regions are interspersed among each other. Because the resists used in the present invention have chemically separated structures, anisotropic wet development of these resists is achievable with an appropriate bicomponent wet developer. Consequently, after exposure, the image formed in a thin, upper layer of the resist is transferred with vertical walls through the thickness of the resist.