Abstract: An image processing system includes one or more processors operative to receive a graph application programming interface (API) call to add a complex node to a graph. The graph includes at least the complex node connected to other nodes by edges that are directed and acyclic. The one or more processors are further operative to process, by a graph compiler at compile time, the complex node by iteratively expanding the complex node into multiple nodes with each node corresponding to one operation in an image processing pipeline. The system further includes one or more target devices to execute executable code compiled from each node to perform operations of the image processing pipeline. The system further includes memory to store the graph compiler and the executable code.

Abstract: A graph application programming interface (API) is used to control an image processing flow. A system receives graph API calls to add nodes to respective subgraphs. The system further receives a given graph API call to add a control flow node to a main graph. The given graph API call identifies the subgraphs as parameters. The main graph includes the control flow node connected to other nodes by edges that are directed and acyclic. A graph compiler compiles the main graph and the subgraphs into corresponding executable code. At runtime, a condition is evaluated before the subgraphs identified in the given graph API call are executed. One or more target devices execute the corresponding executable code to perform operations of an image processing pipeline while skipping execution of one or more of the subgraphs depending on the condition.

Abstract: A semiconductor structure and manufacturing method thereof are provided. The semiconductor structure includes a metallization structure with a top surface. A conductive pad is over the top surface. An upper passivation layer is over the top surface and the conductive pad and includes a first implanted region. A polymer layer is over the upper passivation layer and the conductive pad. A conductive via penetrates through the upper passivation layer and the polymer layer, and electrically coupled to the conductive pad. A method for manufacturing a semiconductor structure is also provided.

Abstract: A semiconductor structure and manufacturing method thereof are provided. The semiconductor structure includes a metallization structure with a top surface. A conductive pad is over the top surface. An upper passivation layer is over the top surface and the conductive pad and includes a first implanted region. A polymer layer is over the upper passivation layer and the conductive pad. A conductive via penetrates through the upper passivation layer and the polymer layer, and electrically coupled to the conductive pad. A method for manufacturing a semiconductor structure is also provided.

Abstract: A method applied to an equipment for improving confidentiality protection of neural network model is provided. An operating system of the equipment may comprise a framework and a hardware abstraction layer (HAL), and the method may comprise: before a source model in an application (app) is executed, by a processor of the equipment, modifying the source model to form a modified model by running a modification subroutine associated with the app, and causing the framework to accept the modified model, instead of the source model, as the model to be executed, so the framework instructs the HAL to prepare execution of the modified model.