Abstract: A package structure includes a die, an encapsulation layer, a redistribution layer structure and an adhesive material. The die includes a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a passivation layer disposed over the semiconductor substrate and around the conductive pads. The encapsulation layer laterally encapsulates the die. the redistribution layer structure is disposed on the die and the encapsulation layer, and includes at least one redistribution layer embedded in at least one polymer layer, and the polymer layer contacts a portion of the passivation layer. The adhesive material is disposed on the die and covers an interface between the polymer layer and the passivation layer.

Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.

Abstract: An axial-flow heat-dissipation fan including a frame and a blade wheel is provided. The frame has an inlet, an outlet, and an inner wall connected between the inlet and the outlet. The inner wall surrounding the blade wheel has at least one rough region. The blade wheel is rotatably disposed in the frame and located between the inlet and the outlet, and an air flows into the frame via the inlet and flows out of the frame via the outlet by rotation of the blade wheel. A gap exists between a blade end of the blade wheel and the inner wall. A laminar flow is generated at the gap when the blade wheel is rotating and the blade end passes through the rough region so as to prevent a backflow generated at the gap, wherein a flowing direction of the backflow is opposite to a flowing direction of the air flow.

Abstract: A memory control method includes a processor initiating a memory access instruction to a cache controller to search a cache memory, an address detector checking if the memory access instruction is corresponding to predetermined conditions if a cache miss occurs, the address detector transmitting a signal to inform a replacement mask logic unit if the memory access instruction is corresponding to the predetermined conditions, and the replacement mask logic unit providing predetermined data to store the predetermined data into the cache memory.

Abstract: A semiconductor package includes a circuit substrate, a die, a frame structure, and a heat sink lid. The die is disposed on the circuit substrate and electrically connected with the circuit substrate. The die includes two first dies disposed side by side and separate from each other with a gap between two facing sidewalls of the two first dies. The frame structure is disposed on the circuit substrate and surrounding the die. The heat sink lid is disposed on the die and the frame structure. The head sink lid has a slit that penetrates through the heat sink lid in a thickness direction and exposes the gap between the two facing sidewalls of the two first dies.

Abstract: A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.

Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

Abstract: A package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. The prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.

Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.

Abstract: A package structure and a method for forming the same are provided. The package structure includes a first package structure and a second package structure. The first package structure includes a first device formed over a first substrate. The first device includes a first conductive plug connected to a through substrate via (TSV) structure formed in the first substrate. A buffer layer surrounds the first substrate. A first bonding layer is formed over the first substrate and the buffer layer. The second package structure includes a second device formed over a second substrate. A second bonding layer is formed over the second device. A hybrid bonding structure is between the first package structure and the second package structure by bonding the first bonding layer to the second bonding layer.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: An axial-flow heat dissipation fan including a frame, a hub, and a plurality of blades is provided. The frame has an air inlet and an air outlet. The hub is rotatably arranged in the frame. The blades disposed at side of the hub respectively and rotate along with the hub. Each of the blades has a front surface facing toward the air inlet and a rear surface facing toward the air outlet. A surface roughness of the front surface is different from a surface roughness of the rear surface.

Abstract: The present invention provides an automated optical inspection and classification apparatus based on a deep learning system, comprising a camera and a processor. The processor executes a deep learning system after loading data from a storage unit and the processor, and comprises an input layer, a neural network layer group, and a fully connected-layer group. The neural network layer group is for extracting to an input image and thereby obtaining a plurality of image features. The fully connected-layer group is for performing weight-based classification and outputting an inspection result.

Abstract: A labeling system for defect classification having a storage unit and a processing unit is provided. The storage unit stores a defect classification module, a defect labeling module, and a catalog generation module. The processing unit performs the modules aforementioned. The defect classification module is configured to provide a defect type information. The defect labeling module marks a defect type label to at least one test object image according to an image feature and the defect type information on the at least one test object image. The catalog generation module receives the labeled test object images and moves test object images having the same defect type label to a corresponding file catalog.

Abstract: The present invention provides an automated optical inspection and classification apparatus based on a deep learning system, comprising a camera and a processor. The processor executes a deep learning system after loading data from a storage unit and the processor, and comprises an input layer, a neural network layer group, and a fully connected-layer group. The neural network layer group is for extracting to an input image and thereby obtaining a plurality of image features. The fully connected-layer group is for performing weight-based classification and outputting an inspection result.

Abstract: A training method of an iterative deep learning system, comprising the steps of: providing at least one unlabeled image of an object; labeling the unlabeled image of the object to produce a labeled image of the object; storing the labeled image of the object into an image database if the deep learning system is being trained with a labeled version of the unlabeled image of the object for a first time; identifying the labeled image of the object in the image database and outputting an identification result through the deep learning system; and training the deep learning system according to an error between output and expected output of the identification result; and providing another unlabeled image of the object to the trained deep learning system to identify said another unlabeled image of the object and to produce an inspection result; wherein determining whether the inspection result has satisfied a qualification condition and terminating training if the inspection result has satisfied the qualification co

Abstract: A safety syringe assembly includes a syringe and a concealing apparatus. The syringe includes a cylinder, two wings formed on two opposite sides of the cylinder, a needle connected to a front end of the cylinder, and a tube connected to a rear end of the cylinder. The concealing apparatus includes a guiding element and two covers. The guiding element is located around the tube. The two covers are engaged with each other and movable along the guiding element between an original position for exposing the guiding element and a concealing position for concealing the needle.