Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: A portable electronic device including a first body, a second body, a pivot element, a heat source, a first flexible heat conductive element, and a flip cover is provided. The pivot element is connected to the second body, and the second body is pivotally connected to the first body through the pivot element. The heat source is disposed in the first body. The first flexible heat conductive element is thermally coupled to the heat source and extends toward the pivot element from the heat source. The first flexible heat conductive element passes through the pivot element and extends into the inside of the second body and is thus thermally coupled to the second body. The flip cover is pivotally connected to the first body and located on a moving path of the pivot element.

Abstract: The present invention provides an automated optical inspection and classification apparatus based on a deep learning system, comprising a camera and a processor. The processor executes a deep learning system after loading data from a storage unit and the processor, and comprises an input layer, a neural network layer group, and a fully connected-layer group. The neural network layer group is for extracting to an input image and thereby obtaining a plurality of image features. The fully connected-layer group is for performing weight-based classification and outputting an inspection result.

Abstract: The present invention provides an automated optical inspection and classification apparatus based on a deep learning system, comprising a camera and a processor. The processor executes a deep learning system after loading data from a storage unit and the processor, and comprises an input layer, a neural network layer group, and a fully connected-layer group. The neural network layer group is for extracting to an input image and thereby obtaining a plurality of image features. The fully connected-layer group is for performing weight-based classification and outputting an inspection result.

Abstract: A training method of an iterative deep learning system, comprising the steps of: providing at least one unlabeled image of an object; labeling the unlabeled image of the object to produce a labeled image of the object; storing the labeled image of the object into an image database if the deep learning system is being trained with a labeled version of the unlabeled image of the object for a first time; identifying the labeled image of the object in the image database and outputting an identification result through the deep learning system; and training the deep learning system according to an error between output and expected output of the identification result; and providing another unlabeled image of the object to the trained deep learning system to identify said another unlabeled image of the object and to produce an inspection result; wherein determining whether the inspection result has satisfied a qualification condition and terminating training if the inspection result has satisfied the qualification co

Abstract: A labeling system for defect classification having a storage unit and a processing unit is provided. The storage unit stores a defect classification module, a defect labeling module, and a catalog generation module. The processing unit performs the modules aforementioned. The defect classification module is configured to provide a defect type information. The defect labeling module marks a defect type label to at least one test object image according to an image feature and the defect type information on the at least one test object image. The catalog generation module receives the labeled test object images and moves test object images having the same defect type label to a corresponding file catalog.

Abstract: A safety syringe assembly includes a syringe and a concealing apparatus. The syringe includes a cylinder, two wings formed on two opposite sides of the cylinder, a needle connected to a front end of the cylinder, and a tube connected to a rear end of the cylinder. The concealing apparatus includes a guiding element and two covers. The guiding element is located around the tube. The two covers are engaged with each other and movable along the guiding element between an original position for exposing the guiding element and a concealing position for concealing the needle.