Abstract: An electrical connection assembly includes two electrical connectors and a bridge connector. Each of the two electrical connectors includes plural terminals and an insulation housing that accommodates the terminals. The bridge connector is located between the two electrical connectors. The bridge connector includes an insulation body, a conductive plastic, plural signal terminals, and plural ground terminals. The conductive plastic is covered by the insulation body. The ground terminals and the signal terminals of the bridge connector are arranged at intervals. The ground terminals of the bridge connector are in electrical contact with the conductive plastic. When two opposite sides of the insulation body are respectively coupled to the two electrical connectors so as to be surrounded by the two electrical connectors, the ground terminals of the bridge connector are respectively in electrical contact with the ground terminals of the two electrical connectors.

Abstract: An electronic device is provided, including a main body and a camera module. The camera module has a frame, a lens unit disposed in the frame, a guiding member, and a hinge. The guiding member is affixed to the main body and has a rail and a spring sheet. The hinge pivotally connects to the frame and the guiding member. When the camera module is in the retracted position, the camera module is hidden in a recess of the main body. When the camera module slides out of the recess from the retracted position along the rail into the operational position, the spring sheet is pressed by the hinge to increase the friction between the hinge and the guiding member.

Abstract: An electrical connector is configured to couple to a butt plug. The electrical connector includes an insulation body, plural signal terminals, plural ground terminals, and at least one conductive plastic. The insulation body has an accommodating recess. The signal terminals are located in the accommodating recess. The ground terminals are located in the accommodating recess, and the ground terminals and the signal terminals are arranged at intervals. The conductive plastic is located on a top surface of the insulation body facing the butt plug. When the butt plug is inserted into the accommodating recess of the insulation body, plural ground terminals of the butt plug are in electrical contact with the conductive plastic.

Abstract: An electrical connector is configured to couple to a butt plug. The electrical connector includes an insulation body, plural signal terminals, plural ground terminals, and at least one conductive plastic. The insulation body has a tongue portion. The signal terminals are located in the insulation body. The ground terminals are located in the insulation body, and the ground terminals and the signal terminals are arranged at intervals. The conductive plastic is located on the tongue portion of the insulation body and is disposed along the tongue portion. When the tongue portion of the insulation body is coupled to the butt plug so as to be surrounded by the butt plug, plural ground terminals of the butt plug are in electrical contact with the conductive plastic.

Abstract: A package structure is provided. The package structure includes a conductive structure having a first portion and a second portion, and the second portion is wider than the first portion. The package structure also includes a semiconductor chip laterally separated from the conductive structure. The package structure further includes a protective layer laterally surrounding the conductive structure and the semiconductor chip. The first portion of the conductive structure has a sidewall extending from the second portion to a surface of the protective layer. The protective layer laterally surrounds an entirety of the sidewall of the first portion.

Abstract: A chip package structure is provided. The chip package structure includes a first substrate. The chip package structure includes a conductive via structure passing through the first substrate. The chip package structure includes a barrier layer over a surface of the first substrate. The chip package structure includes an insulating layer over the barrier layer. The chip package structure includes a conductive pad over the insulating layer. The conductive pad has a first portion passing through the insulating layer and the barrier layer and connected to the conductive via structure. The chip package structure includes a conductive bump over the conductive pad. The chip package structure includes a second substrate. The chip package structure includes an underfill layer between the first substrate and the second substrate.

Abstract: A portable electronic device including a first body, a second body, a pivot element, a heat source, a first flexible heat conductive element, and a flip cover is provided. The pivot element is connected to the second body, and the second body is pivotally connected to the first body through the pivot element. The heat source is disposed in the first body. The first flexible heat conductive element is thermally coupled to the heat source and extends toward the pivot element from the heat source. The first flexible heat conductive element passes through the pivot element and extends into the inside of the second body and is thus thermally coupled to the second body. The flip cover is pivotally connected to the first body and located on a moving path of the pivot element.

Abstract: A server including a backplane, first and second EM units is provided. The signal of the first EM unit is determined whether or not to be transmitted to a bus at the backplane according to statuses of the first EM unit and other EM unit(s). The signal of the second EM unit is determined whether or not to be transmitted to the bus according to statuses of the second EM unit and other EM unit(s). Thus, the server prevents the first and the second EM units on the backplane simultaneously connected to the backplane to cause a signal short between the first and the second EM units.

Abstract: A test method for a plurality of circuits respectively having inputs for greatly reducing the required test time and the control circuit complexity is provided. The method includes steps of providing a set of test patterns for detecting a characteristic of the circuits, providing a common data line, and electrically connecting the circuit inputs to the common data line so that the test pattern can be broadcasted to the circuits through the common data line. The present invention also provides an architecture for implementing such method.

Abstract: A method and system are provided to identify coordinate information of a selected position on a three-dimensional object or on a leaf among plural pages with pre-formed reference indications. While identifying the coordinated information on the leaf, identification of page number is accomplished based on the reference indications formed around margins of the sheet. Moreover, by using at least one corner of the leaf and symbols printed around the margins as the reference coordinate data, the actual coordinate information of the selected position is derived. Corresponding to the actual coordinated information, accessory data in a form of voice, image or text are then output.

Abstract: A test method for a plurality of circuits respectively having inputs for greatly reducing the required test time and the control circuit complexity is provided. The method includes steps of providing a set of test patterns for detecting a characteristic of the circuits, providing a common data line, and electrically connecting the circuit inputs to the common data line so that the test pattern can be broadcasted to the circuits through the common data line. The present invention also provides an architecture for implementing such method.