Patents by Inventor Cheng-Hua Lee

Cheng-Hua Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145132
    Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, and a conductive filler. The polymer matrix has a fluoropolymer. The total volume of the PTC material layer is calculated as 100%, and the fluoropolymer accounts for 47-62% by volume of the PTC material layer. The fluoropolymer has a melt viscosity higher than 3000 Pa·s.
    Type: Application
    Filed: March 16, 2023
    Publication date: May 2, 2024
    Inventors: CHENG-YU TUNG, CHEN-NAN LIU, Chia-Yuan Lee, HSIU-CHE YEN, YUNG-HSIEN CHANG, Yao-Te Chang, FU-HUA CHU
  • Publication number: 20240145133
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.
    Type: Application
    Filed: April 5, 2023
    Publication date: May 2, 2024
    Inventors: CHEN-NAN LIU, YUNG-HSIEN CHANG, CHENG-YU TUNG, HSIU-CHE YEN, Chia-Yuan LEE, Yao-Te CHANG, FU-HUA CHU
  • Patent number: 11973260
    Abstract: A light-transmitting antenna includes a substrate, a first and a second conductive pattern. The first and the second conductive pattern is disposed on a first and a second surface of the substrate respectively. The first conductive pattern includes a first feeder unit, a first and a second radiation unit, a first and a second coupling unit and a first parasitic unit. The first feeder unit is connected to the second radiation unit. The first and the second radiation unit are located between the first and the second coupling unit. One side and the other side of the first parasitic unit is connected to the second coupling unit and adjacent to the first coupling unit respectively. The second conductive pattern includes a second feeder unit, a third coupling unit, a second parasitic unit, and a fourth coupling unit.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: April 30, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Ruo-Lan Chang, Mei-Ju Lee, Cheng-Hua Tsai, Meng-Hsuan Chen, Wei-Chung Chen
  • Publication number: 20240127989
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.
    Type: Application
    Filed: January 25, 2023
    Publication date: April 18, 2024
    Inventors: CHIA-YUAN LEE, CHENG-YU TUNG, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, YAO-TE CHANG, FU-HUA CHU
  • Publication number: 20240127988
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.
    Type: Application
    Filed: March 2, 2023
    Publication date: April 18, 2024
    Inventors: HSIU-CHE YEN, YUNG-HSIEN CHANG, CHENG-YU TUNG, Chia-Yuan Lee, CHEN-NAN LIU, Yao-Te Chang, FU-HUA CHU
  • Publication number: 20240120656
    Abstract: A light-transmitting antenna includes a substrate, a first conductive pattern, and a second conductive pattern. The first conductive pattern has a first feeder unit, a first radiation unit, a second radiation unit, and a first connection unit. The first feeder unit and the first connection unit are connected to two sides of the first radiation unit. The first connection unit connects the first radiation unit and the second radiation unit. The second conductive pattern has a second feeder unit, a third radiation unit, a fourth radiation unit, and a second connection unit. The second feeder unit and the second connection unit are connected to two sides of the third radiation unit. The second connection unit connects the third radiation unit and the fourth radiation unit. An orthogonal projection of the second feeder unit on a first surface of the substrate at least partially overlaps the first feeder unit.
    Type: Application
    Filed: December 22, 2022
    Publication date: April 11, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Meng-Hsuan Chen, Cheng-Hua Tsai, Mei-Ju Lee, Ruo-Lan Chang, Wei-Chung Chen
  • Patent number: 11942376
    Abstract: Methods of manufacturing a semiconductor structure are provided. One of the methods includes: receiving a substrate including a first conductive region of a first transistor and a second conductive region of a second transistor, wherein the first transistor and the second transistor have different conductive types; performing an amorphization on the first conductive region and the second conductive region; performing an implantation over the first conductive region of the first transistor; forming a contact material layer over the first conductive region and the second conductive region; performing a thermal anneal on the first conductive region and the second conductive region; and performing a laser anneal on the first conductive region and the second conductive region.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chun Hsiung Tsai, Cheng-Yi Peng, Ching-Hua Lee, Chung-Cheng Wu, Clement Hsingjen Wann
  • Patent number: 11929422
    Abstract: The structure of a semiconductor device with passivation layers on active regions of FET devices and a method of fabricating the semiconductor device are disclosed. The semiconductor device includes a substrate, first and second source/drain (S/D) regions disposed on the substrate, nanostructured channel regions disposed between the first and second S/D regions, a passivation layer, and a nanosheet (NS) structure wrapped around the nanostructured channel regions. Each of the S/D regions have a stack of first and second semiconductor layers arranged in an alternating configuration and an epitaxial region disposed on the stack of first and second semiconductor layers.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Yi Peng, Ching-Hua Lee, Song-Bor Lee
  • Publication number: 20240076422
    Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Inventors: Jing-Cherng TSAI, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Jing-Yu LEE, Jun-Ye HONG, Zih-Yu SHIH, Cheng-Hung CHIANG, Gang-Wei SHEN, Yu-Chuan SUNG, Chung-Hua WENG, Hsing-Ya CHEN
  • Patent number: 11795058
    Abstract: The present invention relates to a silicon dioxide composite particle with far-infrared radioactivity, which is formed by the hydrolysis, condensation and polymerization of an organic silane precursor having the structure of the formula (I) with a tetra-alkoxysilane. The high stability of organic silane precursor compounds and the low biotoxicity of silicon dioxide composite particles make the present far-infrared radioactive silicon dioxide composite particles of great potential for extensive use in related bio-products.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: October 24, 2023
    Assignees: NATIONAL CHI NAN UNIVERSITY, GREAT CHAIN CHEMICAL LTD.
    Inventors: Long-Li Lai, Cheng-Hua Lee, Yao-Chih Lu, Ya-Lin Chang
  • Publication number: 20220333006
    Abstract: A far infrared (FIR)-emitting composition includes a first polymer component and a silicon dioxide composite particle which is prepared by subjecting a tetraalkoxysilane and a compound represented by Formula (A) to hydrolysis and condensation polymerization: Y—Si(ORa)3??(A), wherein each Ra independently represents a C1-4 alkyl group or a C1-4 alkanoyl group, Y represents X—R1—, a non-substituted C1-18 linear alkyl group or a non-substituted C3-18 branched alkyl group, and X and R1 are defined as set forth in the Specification and Claims. A FIR-emitting fiber including the FIR-emitting composition is also disclosed.
    Type: Application
    Filed: October 22, 2021
    Publication date: October 20, 2022
    Applicants: National Chi Nan University, The Heart of Taiwan Science, Innovation, Culture and Art Co., Ltd.
    Inventors: Long-Li LAI, Yan-Chih LU, Han-Hsuan KUO, Cheng-Hua LEE
  • Patent number: 11406566
    Abstract: A pill cutter has a base, a clamping assembly, a connecting unit, a cover, and a cutting assembly. The clamping assembly has two first clamping units moveably mounted on the base. The connecting unit has a base end moveably mounted on the base and a cover end pivotally mounted on the cover. The cutting assembly has a pressing unit moveably mounted on the cover and a blade securely mounted on the pressing unit. When the cover is opened, the connecting unit moves along with the cover and pulls the two first clamping units away from each other. When the cover is closed, the two first clamping units move toward each other by springs to stably clamp a pill in any shape or size. Therefore, a user can simply press the pressing unit to move the blade to safely cut the clamped pill.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: August 9, 2022
    Assignee: E-LINK PLASTIC & METAL INDUSTRIAL CO., LTD.
    Inventor: Cheng-Hua Lee
  • Patent number: 11299504
    Abstract: A process for preparing a triazine-based precursor for producing a micro-particulate complex containing a far infrared-emissive silica particle comprises steps of: a) subjecting 2-4-6-trichloro-1,3,5-triazine and a first nucleophilic compound to a displacement reaction in the presence of a first solvent at a first temperature range to form an intermediate; and b) subjecting the intermediate and a second nucleophilic compound to a further displacement reaction in the presence of a second solvent at a second temperature range higher than the first temperature range.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: April 12, 2022
    Assignees: NATIONAL CHI NAN UNIVERSITY, GREAT CHAIN CHEMICAL LTD
    Inventors: Long-Li Lai, Cheng-Hua Lee, Jhih-Yuan Tong, Yan-Chih Lu, Yu-You Lin, Ya-Lin Chang
  • Publication number: 20220000719
    Abstract: A pill cutter has a base, a clamping assembly, a connecting unit, a cover, and a cutting assembly. The clamping assembly has two first clamping units moveably mounted on the base. The connecting unit has a base end moveably mounted on the base and a cover end pivotally mounted on the cover. The cutting assembly has a pressing unit moveably mounted on the cover and a blade securely mounted on the pressing unit. When the cover is opened, the connecting unit moves along with the cover and pulls the two first clamping units away from each other. When the cover is closed, the two first clamping units move toward each other by springs to stably clamp a pill in any shape or size. Therefore, a user can simply press the pressing unit to move the blade to safely cut the clamped pill.
    Type: Application
    Filed: July 6, 2020
    Publication date: January 6, 2022
    Applicant: E-LINK PLASTIC & METAL INDUSTRIAL CO., LTD.
    Inventor: Cheng-Hua LEE
  • Patent number: 11166873
    Abstract: A pill box has a case holder and multiple pill cases. The case holder is divided into multiple compartments by multiple crosswise partitions, a rear panel and a bottom panel. The pill cases are fitted in the compartments of the case holder. Each pill case is able to pivot relative to the case holder between a close position and an open position. When intending to get pills that are in the pill box, a user can rotate one of the pill cases to the open position. Thus, the pill case protrudes forwardly from the case holder. Accordingly, the pills are able to be precisely poured onto the user's hand.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: November 9, 2021
    Assignee: E-LINK PLASTIC & METAL INDUSTRIAL CO., LTD.
    Inventor: Cheng-Hua Lee
  • Patent number: 11123263
    Abstract: A pill box has a container having a compartment frame, multiple front covers pivotally mounted to the container and selectively covering a front side of the container, and a rear lid. The rear lid is detachably mounted on a rear side of the container and has a main covering panel having an outer peripheral frame and multiple inner annular frames, and two side locking panels. With the compartment frame of the container protruding in a groove formed between the outer peripheral frame and the inner peripheral frames of the main covering panel when the main covering panel covers the rear side of the container, the rear side of the container can be tightly sealed by the rear lid easily, so as to prevent dust and moisture from entering the pill box. Accordingly, pills can be properly reserved in the pill box of the present application.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: September 21, 2021
    Assignee: E-LINK PLASTIC & METAL INDUSTRIAL CO., LTD.
    Inventor: Cheng-Hua Lee
  • Publication number: 20210177698
    Abstract: A pill container has at least one pair of compartment units. Each pair of compartment units has two compartment units and a connection portion being hollow and mounted between the compartment units to connect the two compartment units with each other. Each compartment unit has a compartment, a locking button, a lid, and a resilient pushing bar. The compartment is hollow and has a front wall and a rear wall connected with the connection portion. The locking button is formed on the front wall of the compartment. The lid is pivotally connected with the rear wall of the compartment to selectively close the compartment, is engaged detachably with the locking button, and has an inner surface facing the compartment. The resilient pushing bar is mounted in the connection portion, extends over the rear wall of the compartment, and abuts against the inner surface of the lid.
    Type: Application
    Filed: December 13, 2019
    Publication date: June 17, 2021
    Inventor: Cheng-Hua LEE
  • Patent number: D933949
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: October 26, 2021
    Assignee: E-LINK PLASTIC & METAL INDUSTRIAL CO., LTD.
    Inventor: Cheng-Hua Lee
  • Patent number: D939203
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: December 28, 2021
    Assignee: E-LINK PLASTIC & METAL INDUSTRIAL CO., LTD.
    Inventor: Cheng-Hua Lee
  • Patent number: D953731
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: June 7, 2022
    Assignee: E-LINK PLASTIC & METAL INDUSTRIAL CO., LTD.
    Inventor: Cheng-Hua Lee