Abstract: The present disclosure describes a semiconductor device having artificial field plates. The semiconductor device includes a first gallium nitride (GaN) layer on a substrate, an aluminum gallium nitride (AlGaN) layer on the first GaN layer, and a second GaN layer on the AlGaN layer. The first and second GaN layers includes different types of dopants. The semiconductor device further includes a gate contact structure in contact with the second GaN layer, first and second source/drain (S/D) contact structures in contact with the AlGaN layer, one or more artificial field plates between the gate contact structure and the first S/D contact structure. The first and second S/D contact structures are disposed at opposite sides of the gate contact structure. The one or more artificial field plates are separated from the first and second S/D contact structures and above the AlGaN layer.

Abstract: Some implementations described herein include operating components in a lithography system at variable speeds to reduce, minimize, and/or prevent particle generation due to rubbing of or collision between contact parts of the components. In some implementations, a component in a path of transfer of a semiconductor substrate in the lithography system is operated at a relatively high movement speed through a first portion of an actuation operation, and is operated at a reduced movement speed (e.g., a movement speed that is less than the high movement speed) through a second portion of the actuation operation in which contact parts of the component are to interact. The reduced movement speed reduces the likelihood of particle generation and/or release from the contact parts when the contact parts interact, while the high movement speed provides a high semiconductor substrate throughput in the lithography system.

Abstract: In an embodiment, a method of forming a semiconductor device includes forming a dummy gate stack over a substrate; forming a first spacer layer over the dummy gate stack; oxidizing a surface of the first spacer layer to form a sacrificial liner; forming one or more second spacer layers over the sacrificial liner; forming a third spacer layer over the one or more second spacer layers; forming an inter-layer dielectric (ILD) layer over the third spacer layer; etching at least a portion of the one or more second spacer layers to form an air gap, the air gap being interposed between the third spacer layer and the first spacer layer; and forming a refill layer to fill an upper portion of the air gap.

Abstract: An apparatus for synchronous Ethernet comprises a processor, a field programmable gate array, a synchronizer, a physical layer implementor and a media accessing controller, wherein, the processor transmits a control data through a first transmission interface; the field programmable gate array receives the control data, generates a control instruction in accordance with the control data and transmits the control instruction through a second transmission interface; the synchronizer receives the control instruction and generates a synchronous clock in accordance with the control instruction; and each of the physical layer implementor and the media accessing controller receives and works in accordance with the synchronous clock and media accessing control protocol.

Abstract: A platform through-beam sensor device includes a transmitter module and a receiver module. A light emitted by a light-emitting element of the transmitter module is shaped into a light pattern range by a transmitter mask. A range of the light received by a light-receiving element of the receiver module is changed to a receiving range by a receiver mask. When the present invention is used, the transmitter module and the receiver module are respectively installed on two ends of a mechanical apparatus that move relative to each other. After determining a safety range of the relative movement of the two ends, a state that the light-receiving element falls into the light pattern range and the light-emitting element falls into the receiving range is set to be within the safety range. Upon exceeding the safety range, a flying platform is controlled to stop, thereby improving the safety of the flying platform.

Abstract: A key structure including a base plate, a thin film circuit, a display key, an elastic supporting member, and a lifting mechanism is provided. The thin film circuit is disposed on the base plate. The display key is disposed above the thin film circuit. The elastic supporting member is disposed between the display key and the thin film circuit. The lifting mechanism is disposed between the display key and the base plate.

Abstract: A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.

Abstract: An inflatable product includes an inflatable chamber and an elongated element. The inflatable chamber includes fusion portions. The elongated element is flexible, is disposed in the inflatable chamber, includes enlarged portions, and is connected to the inflatable chamber with the enlarged portions constrained by the fusion portions. The elongated element is in tension for controlling expansion of the inflatable chamber to a desired shape when the inflatable chamber is inflated to expand. The enlarged portions are constrained by the fusion portions to avoid separation of the elongated element from the inflatable chamber when the inflatable chamber is inflated to expand.

Abstract: In an embodiment, a method of forming a semiconductor device includes forming a dummy gate stack over a substrate; forming a first spacer layer over the dummy gate stack; oxidizing a surface of the first spacer layer to form a sacrificial liner; forming one or more second spacer layers over the sacrificial liner; forming a third spacer layer over the one or more second spacer layers; forming an inter-layer dielectric (ILD) layer over the third spacer layer; etching at least a portion of the one or more second spacer layers to form an air gap, the air gap being interposed between the third spacer layer and the first spacer layer; and forming a refill layer to fill an upper portion of the air gap.

Abstract: A power metal-oxide-semiconductor structure includes a semiconductor substrate, a gate electrode disposed above the semiconductor substrate, a field plate, and an electrically conductive pattern. The gate electrode and the field plate are disposed above the semiconductor substrate, the electrically conductive pattern is disposed between the field plate and the semiconductor substrate in a vertical direction, and the field plate and the electrically conductive pattern are located at the same side of the gate electrode in a horizontal direction. A manufacturing method of a power metal-oxide-semiconductor structure includes the following steps. The electrically conductive pattern and the field plate are formed above a first region of the semiconductor substrate. Subsequently, the gate electrode is formed above the first region of the semiconductor substrate.

Abstract: A method of forming a gas spacer in a semiconductor device and a semiconductor device including the same are disclosed. In accordance with an embodiment, a method includes forming a gate stack over a substrate; forming a first gate spacer on sidewalls of the gate stack; forming a second gate spacer on sidewalls of the first gate spacer; removing the second gate spacer using an etching process to form a first opening, the etching process being performed at a temperature less than 0° C., the etching process using an etching solution including hydrogen fluoride; and depositing a dielectric layer over the first gate spacer and the gate stack, the dielectric layer sealing a gas spacer in the first opening.

Abstract: A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.

Abstract: An improved switching power converting apparatus (10) includes a power converting circuit (102), a sampling circuit (104), a signal gain adjustment circuit (106), a frequency limiting circuit (108) and a pulse width modulation controller (110). The sampling circuit (104) is configured to detect the power converting circuit (102) to obtain a sampled signal (Vs) and transmit the sampled signal (Vs) to the signal gain adjustment circuit (106). The signal gain adjustment circuit (106) is configured to adjust the sampled signal (Vs) to obtain a control signal (Vcon) and transmit the control signal (Vcon) to the frequency limiting circuit (108). The pulse width modulation controller (110) is configured to control an operating frequency of the pulse width modulation controller (110) based on the control signal (Vcon).

Abstract: A method, system, and computer program product for data reorganization and logs reorganization. The method includes receiving, by one or more processing units, original data. The method also includes classifying, by the one or more processing units, the original data into different types based on a trained type classification model. The method also includes generating, by the one or more processing units, at least one severity for at least part of the original data based on a trained severity classification model, the at least part of the original data corresponding to at least one type. The method also includes outputting, by the one or more processing units, at least one message, the at least one message indicating the severity of the at least part of the original data.

Abstract: An electronic package structure includes first and second package modules combined with each other. The first package module includes a substrate and a first electronic component disposed thereon, at least one second electronic component, and an insulation film. The first electronic component and the second electronic component are adjacent to each other. The insulation film includes a base material and a foam glue body, and the foam glue body is viscous and compressible. The second package module includes a heat dissipation plate and a liquid metal and an insulation protrusion portion disposed thereon. The liquid metal is pressed by the heat dissipation plate and the first electronic component. The insulation protrusion portion covers and abuts against the insulation film to press the foam glue body through the base material so as to deform the foam glue body and enable the foam glue body to cover the second electronic component.

Abstract: An encrypted hard disk device is provided, including a near-field communication (NFC) sensing module, a processor, a storage unit, and a power switch. The NFC sensing module is configured to read a user identification (UID) of at least one sensor element. The processor is electrically connected to the NFC sensing module and the storage unit. The processor receives the UID and generates a control signal when the UID is approved. The power switch is electrically connected to the processor and the storage unit and maintains a conducting state according to the control signal and supplies power to the storage unit for accessing the storage unit.

Abstract: Systems, methods, and other embodiments are disclosed for identifying features within point cloud data. In one embodiment, point cloud data is read which represents multiple points of at least one point cloud in a multi-dimensional space. Each point in the point cloud data is defined by an attribute value quantifying an attribute of the point and a set of coordinates specifying a location of the point in the multi-dimensional space. The set of coordinates for each point is transformed into a space-filling distance value representing a distance along a space-filling curve. The points are sorted according to the space-filling distance values to generate a sorted order of the points. The points are traversed in the sorted order and output data points are derived, while traversing the points, based on a specified feature criterion. The output data points identify a feature within the at least one point cloud.

Abstract: Systems, methods, and other embodiments associated with aggregated network modeling with component network aggregation are described. In one embodiment, a method for modeling an aggregated network includes storing a first set of nodes associated with a first network and a first set of links associated with the first network, wherein each link in the first set of links connects a pair of nodes in the first set of nodes. A second set of nodes associated with a second network and a second set of links associated with the second network are also stored. A set of transfer links is stored. Each transfer link connects a node in the first network to a node in the second network. Metadata defines the aggregated network as the first set of nodes, the first set of links, the second set of nodes, the second set of links, and the set of transfer links.

Abstract: Systems, methods, and other embodiments are disclosed for identifying features within point cloud data. In one embodiment, point cloud data is read which represents multiple points of at least one point cloud in a multi-dimensional space. Each point in the point cloud data is defined by an attribute value quantifying an attribute of the point and a set of coordinates specifying a location of the point in the multi-dimensional space. The set of coordinates for each point is transformed into a space-filling distance value representing a distance along a space-filling curve. The points are sorted according to the space-filling distance values to generate a sorted order of the points. The points are traversed in the sorted order and output data points are derived, while traversing the points, based on a specified feature criterion. The output data points identify a feature within the at least one point cloud.

Abstract: Systems, methods, and other embodiments associated with aggregated network modeling with component network aggregation are described. In one embodiment, a method for modeling an aggregated network includes storing a first set of nodes associated with a first network and a first set of links associated with the first network, wherein each link in the first set of links connects a pair of nodes in the first set of nodes. A second set of nodes associated with a second network and a second set of links associated with the second network are also stored. A set of transfer links is stored. Each transfer link connects a node in the first network to a node in the second network. Metadata defines the aggregated network as the first set of nodes, the first set of links, the second set of nodes, the second set of links, and the set of transfer links.