Patents by Inventor Cheng-Huang Lee

Cheng-Huang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12221461
    Abstract: The present disclosure is related to the six isomer structures (OBI-821-1990-V1A, OBI-821-1990-V1B, OBI-821-1990-V2A, OBI-821-1990-V2B, OBI-821-1858-A, and OBI-821-1858-B) of isolated OBI-821 adjuvant and the method for evaluating the quality thereof. The method of the present disclosure adopts hydrophilic interaction liquid chromatography (HILIC) and reverse phase high performance liquid chromatography (RP-HPLC) either alone or in tandem and is able to separate the isomers of OBI-821 adjuvant in the consequent chromatography. Accordingly, the quality of OBI-821 adjuvant can be further evaluated.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: February 11, 2025
    Assignee: OBI PHARMA, INC.
    Inventors: Cheng-Der Tony Yu, Yih-Huang Hsieh, Wei Han Lee, Yu Chen Lin, Nan Hsuan Wang
  • Publication number: 20250017907
    Abstract: The present disclosure provides a method for preventing and/or treating liver fibrosis by using 6-methoxybenzoxazolinone and a Coix lachryma-jobi L. extract including 6-methoxybenzoxazolinone. The 6-methoxybenzoxazolinone and the Coix lachryma-jobi L. extract including 6-methoxybenzoxazolinone of the present disclosure achieve the effect of preventing and/or treating liver fibrosis through various efficacy experiments.
    Type: Application
    Filed: July 11, 2023
    Publication date: January 16, 2025
    Inventors: Yu-Hsin Chen, Cheng Huang, Ching-Kuo Lee, Yu-Lin Cai
  • Patent number: 10172257
    Abstract: A heat dissipation module is provided. The heat dissipation includes a base, a frame, and a positioning member. The frame is disposed on the base and has a passage for containing an electronic component. At least a segment of the edge of the frame that is adjacent to the base is distant from the base so as to form an air path inlet that communicates with the passage therebetween. The positioning member is disposed in the passage and is connected to the frame and configured to position an electronic assembly in the frame.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: January 1, 2019
    Assignee: SYNOLOGY INC.
    Inventor: Cheng-Huang Lee
  • Publication number: 20180271727
    Abstract: A lift chair is provided, including a base, a seat, and a driving mechanism connected to the base and the seat. The driving mechanism can drive the seat to move relative to the base between a first position and a second position. When the seat is in the first position, a first distance is formed between the seat and the base. When the seat is in the second position, a second distance exceeding the first distance is formed between the seat and the base. When the seat is in the second position, the driving mechanism can drive the seat to rotate relative to the base.
    Type: Application
    Filed: March 21, 2017
    Publication date: September 27, 2018
    Inventors: Cheng-Huang LEE, Fan-Chen KAO
  • Patent number: 10067541
    Abstract: An electronic device is provided. The electronic device includes a supporting member, a case, at least two positioning structures, a guiding structure, and a protrusion. The two positioning structures are respectively disposed on the supporting member and the case, and are configured to facilitate assembly of the case and the supporting member. The guiding structure is disposed on the supporting member. The protrusion is disposed on the case. The protrusion is guided by the guiding structure so as to simplify the assembly process and improve the efficiency of assembly.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: September 4, 2018
    Assignee: SYNOLOGY INC.
    Inventor: Cheng-Huang Lee
  • Publication number: 20180164858
    Abstract: An electronic device is provided. The electronic device includes a supporting member, a case, at least two positioning structures, a guiding structure, and a protrusion. The two positioning structures are respectively disposed on the supporting member and the case, and are configured to facilitate assembly of the case and the supporting member. The guiding structure is disposed on the supporting member. The protrusion is disposed on the case. The protrusion is guided by the guiding structure so as to simplify the assembly process and improve the efficiency of assembly.
    Type: Application
    Filed: August 23, 2017
    Publication date: June 14, 2018
    Inventor: Cheng-Huang LEE
  • Publication number: 20180124946
    Abstract: A heat dissipation module is provided. The heat dissipation includes a base, a frame, and a positioning member. The frame is disposed on the base and has a passage for containing an electronic component. At least a segment of the edge of the frame that is adjacent to the base is distant from the base so as to form an air path inlet that communicates with the passage therebetween. The positioning member is disposed in the passage and is connected to the frame and configured to position an electronic assembly in the frame.
    Type: Application
    Filed: August 23, 2017
    Publication date: May 3, 2018
    Inventor: Cheng-Huang LEE
  • Publication number: 20070077364
    Abstract: A method to coat insulation film on aluminum body of electrolytic capacitor, which is to produce ion beam according to the high potential difference between anode and cathode, or microwave controlled electric field with microwave generator; this ion strikes polytetrafluoroethylene so as to strike out fluorine atom, then gaseous ion substitute it (such as oxygen) and produce skin layer in 10?˜15? thick, then adhere to surface of aluminum body, this skin layer is directly coated on surface of aluminum body, which can insulate and protect the aluminum body, so that it needn't be glued with PVC or PET felt plastic film, therefore, this method can coat insulation film quickly and answer to requirements of environmental protection.
    Type: Application
    Filed: October 5, 2005
    Publication date: April 5, 2007
    Inventor: Cheng-Huang Lee