Patents by Inventor Cheng-Hui Chu
Cheng-Hui Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10701794Abstract: A printed circuit board and a power copper surface configuration method are provided. The method includes the following steps: configuring a first power supply component, a second power supply component, a power sink component, a convergence copper surface portion, a first grounding copper surface portion and a second grounding copper surface portion; determining whether currents of the first and second power supply components flow to the power sink component through the convergence copper surface portion; when the currents of the first and second power supply components flow to the power sink component through the convergence copper surface portion, determining whether the convergence copper surface portion conforms to a current balancing design of the printed circuit board according to at least one of first and second tolerable difference values and an average current. When the convergence copper surface portion conforms to the current balancing design, the method is ended.Type: GrantFiled: October 22, 2019Date of Patent: June 30, 2020Assignee: Pegatron CorporationInventors: Yang-Chih Hsieh, Cheng-Hui Chu
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Publication number: 20200137878Abstract: A printed circuit board and a power copper surface configuration method are provided. The method includes the following steps: configuring a first power supply component, a second power supply component, a power sink component, a convergence copper surface portion, a first grounding copper surface portion and a second grounding copper surface portion; determining whether currents of the first and second power supply components flow to the power sink component through the convergence copper surface portion; when the currents of the first and second power supply components flow to the power sink component through the convergence copper surface portion, determining whether the convergence copper surface portion conforms to a current balancing design of the printed circuit board according to at least one of first and second tolerable difference values and an average current. When the convergence copper surface portion conforms to the current balancing design, the method is ended.Type: ApplicationFiled: October 22, 2019Publication date: April 30, 2020Applicant: Pegatron CorporationInventors: Yang-Chih Hsieh, Cheng-Hui Chu
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Patent number: 10470299Abstract: A power signal transmission structure and a design method are provided. The power supply signal transmission structure is adapted for a circuit board having a first surface and a second surface opposite to the first surface, and the power signal transmission structure includes a first power electrode, a second power electrode, and a plurality of vias. The first power electrode is disposed on the first surface and has a plurality of power pad regions for receiving a power signal. The second power electrode is disposed on the second surface. The vias penetrate the circuit board to electrically connect the first power electrode and the second power electrode. The vias are arranged in accordance with the current direction of the power signal to balance the current received by the vias.Type: GrantFiled: March 23, 2018Date of Patent: November 5, 2019Assignee: PEGATRON CORPORATIONInventors: Ching Ou Yang, Cheng-Hui Chu
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Publication number: 20180302978Abstract: A power signal transmission structure and a design method are provided. The power supply signal transmission structure is adapted for a circuit board having a first surface and a second surface opposite to the first surface, and the power signal transmission structure includes a first power electrode, a second power electrode, and a plurality of vias. The first power electrode is disposed on the first surface and has a plurality of power pad regions for receiving a power signal. The second power electrode is disposed on the second surface. The vias penetrate the circuit board to electrically connect the first power electrode and the second power electrode. The vias are arranged in accordance with the current direction of the power signal to balance the current received by the vias.Type: ApplicationFiled: March 23, 2018Publication date: October 18, 2018Applicant: PEGATRON CORPORATIONInventors: Ching Ou Yang, Cheng-Hui Chu
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Publication number: 20110095839Abstract: A prevention structure to prevent signal lines from time-skew is described. The prevention structure includes a plurality pairs of differential signal lines and a prevention line. The adjacent pairs of differential signal lines are separated from each other by a first gap. Each pair of the differential signal lines includes a positive signal line and a negative signal line each having a first line width. The prevention line has the second line width substantially equal to the first line width and is separated from the outmost differential signal line by a second distance substantially equal to the first distance.Type: ApplicationFiled: December 28, 2009Publication date: April 28, 2011Applicant: INVENTEC CORPORATIONInventor: Cheng-Hui CHU
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Patent number: 7750761Abstract: A signal transmission structure includes two power planes, a signal line and a first pillar. The power planes spaced by an interval space provide a first voltage and a second voltage respectively. The signal line, disposed on first surfaces of the power planes, is disposed across the interval space. The first pillar is disposed within the interval space and is aside the signal line, in which the first pillar is apart from the power planes and the signal line.Type: GrantFiled: September 16, 2008Date of Patent: July 6, 2010Assignee: Inventec CorporationInventor: Cheng-Hui Chu
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Patent number: 7703202Abstract: A method for manufacturing an equalizer used to compensate a digital signal passed by a transmission line, in which the digital signal can be presented as a frequency-domain function. The method includes measuring a the transmission line scattering-parameter; performing an integration and a differentiation about the transmission line scattering-parameter, the frequency-domain function, the ideal gain, and an equalizer scattering-parameter to get the component impedances of the equalizer; and manufacturing the equalizer circuit with the derived component impedances.Type: GrantFiled: January 18, 2008Date of Patent: April 27, 2010Assignee: Inventec CorporationInventor: Cheng-Hui Chu
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Publication number: 20100007431Abstract: A signal transmission structure includes two power planes, a signal line and a first pillar. The power planes spaced by an interval space provide a first voltage and a second voltage respectively. The signal line, disposed on first surfaces of the power planes, is disposed across the interval space. The first pillar is disposed within the interval space and is aside the signal line, in which the first pillar is apart from the power planes and the signal line.Type: ApplicationFiled: September 16, 2008Publication date: January 14, 2010Inventor: Cheng-Hui CHU
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Publication number: 20090183362Abstract: A method for manufacturing an equalizer used to compensate a digital signal passed by a transmission line, in which the digital signal can be presented as a frequency-domain function. The method includes measuring a the transmission line scattering-parameter; performing an integration and a differentiation about the transmission line scattering-parameter, the frequency-domain function, the ideal gain, and an equalizer scattering-parameter to get the component impedances of the equalizer; and manufacturing the equalizer circuit with the derived component impedances.Type: ApplicationFiled: January 18, 2008Publication date: July 23, 2009Inventor: Cheng-Hui Chu
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Patent number: 7504906Abstract: A method for manufacturing an equalizer. The method first acquires a transmission line scattering-parameter, and a gain of the transmission line scattering-parameter at a frequency 1 ? ? ? ? , in which the gain represents an ideal gain; next, performs an integration about the transmission line scattering-parameter, the ideal gain and an equalizer scattering-parameter, and performs a differentiation about the transmission line scattering-parameter and the equalizer scattering-parameter to get the component impedances of the equalizer. Then manufacture the equalizer circuit with the derived component impedances.Type: GrantFiled: August 2, 2007Date of Patent: March 17, 2009Assignee: Inventec CorporationInventor: Cheng-Hui Chu
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Publication number: 20090034600Abstract: A method for manufacturing an equalizer. The method first acquires a transmission line scattering-parameter, and a gain of the transmission line scattering-parameter at a frequency 1 / ?? , in which the gain represents an ideal gain; next, performs an integration about the transmission line scattering-parameter, the ideal gain and an equalizer scattering-parameter, and performs a differentiation about the transmission line scattering-parameter and the equalizer scattering-parameter to get the component impedances of the equalizer. Then manufacture the equalizer circuit with the derived component impedances.Type: ApplicationFiled: August 2, 2007Publication date: February 5, 2009Inventor: Cheng-Hui Chu