Abstract: A method of forming a semiconductor device includes: forming a fin protruding above a substrate, where a top portion of the fin comprises a layer stack that includes alternating layers of a first semiconductor material and a second semiconductor material; forming a dummy gate structure over the fin; forming openings in the fin on opposing sides of the dummy gate structure; forming source/drain regions in the openings; removing the dummy gate structure to expose the first semiconductor material and the second semiconductor material under the dummy gate structure; performing a first etching process to selectively remove the exposed first semiconductor material, where after the first etching process, the exposed second semiconductor material form nanostructures, where each of the nanostructures has a first shape; and after the first etching process, performing a second etching process to reshape each of the nanostructures into a second shape different from the first shape.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.

Abstract: An integrated power supply DC output line serves as a power output line of a power supply unit and includes at least an integrated wire harness and a first connector. The integrated wire harness includes spaced first and second ends. The integrated wire harness is characteristic of the first end connected with the power supply unit for power receiving as well as the second end connected with a wire terminal from which the integrated wire harness is transformed to a plurality of leading wires. The integrated wire harness includes an insulating layer at an outermost layer thereof and a plurality of wires within the insulating layer. The first connector is electrically connected with the plurality of leading wires.

Abstract: A pluggable power supply wire harness includes a PCI-E pluggable wire harness which has a power receiving terminal at one end thereof and first and second power transmitting terminals at the other end thereof. Each of the power receiving terminal, the first power transmitting terminal and the second power transmitting terminal is equipped with 8 pins wherein pins 1, 2 and 3 of the power receiving terminal are prepared for supply of +12V and pins 5, 6, 7 and 8 are defined as grounding pins. The pluggable wire harness is further provided with a leading wire which has a first end connected with the pin 4 of the power receiving terminal and a second end connected with one of pins 1, 2 and 3 of the power receiving terminal or connected with one of pins 1, 2 and 3 of the first and second power transmitting terminals.

Abstract: A motor housing has a heat-dissipating casing having an outer casing and an inner casing. The outer casing is tubular and has an inner surface. The inner casing is tubular, is co-axially mounted in the outer casing and has multiple fins and multiple baffle ribs. The fins are formed on and protrude radially from an outer surface of the inner casing. The baffle ribs are formed on and protrude radially from the outer surface of the inner casing and are connected to the inner surface of the outer casing to form multiple air passages between the inner surface of the outer casing and the outer surface of the inner casing. Each baffle rib has two ends and a front threaded hole and a rear threaded hole defined respectively in the ends of the baffle rib.

Abstract: A liquid cooled motor assembly and a cover thereof The cover of the liquid cooled motor assembly has an outer cylinder, an inner cylinder, a channel and multiple fins. The inner cylinder is mounted in and connected securely with the outer cylinder. The channel is zigzag and is formed between the inner cylinder and the outer cylinder. The fins are mounted securely on an outer surface of the inner cylinder. With the fins mounted on the outer surface of the inner cylinder, water can dissipate heat from the fins quickly and a dissipating efficiency is enhanced.

Abstract: The laser medical device includes a Nd:YAlO.sub.3 laser crystal; a pumping system which illuminates the laser crystal with light irradiated from a pumping light source and achieves population inversion of Nd.sup.3+ ion in the laser crystal; and a resonant cavity for resonating light emitted from the Nd.sup.3+ ion to output a laser light having a predetermined wavelength, wherein the wavelength of the laser light falls within the transparent range of quartz optical fibers. The laser medical device may also include a quartz optical fiber for transmitting the laser light; an optical fiber injector for focusing the laser light output by the resonant cavity on one end of the optical fiber; and an optical fiber pen which is coupled to another end of the optical fiber for aiming the laser light transmitted through the optical fiber at a desired location of a subject. These devices use Nd:YAlO.sub.3 crystal as an active laser material and output laser light having a wavelength, such as 1341.4 nm and 1079.