Patents by Inventor Cheng-Hung Chen
Cheng-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250051073Abstract: A food packaging barrier film is provided. The food packaging barrier film includes a base film, an inorganic laminated film formed on a surface of the base film, and a barrier coating layer formed on the inorganic laminated film. The inorganic laminated film includes at least one first inorganic material deposition layer and a second inorganic material deposition layer stacked upon each other, and the at least one first inorganic material deposition layer and the second inorganic material deposition layer are formed in a same vacuum deposition process and in a vacuum condition. The at least one first inorganic material deposition layer and the second inorganic material deposition layer are respectively formed by different inorganic metal oxides in the same vacuum deposition process. The barrier coating layer is formed by coating a barrier coating solution on the inorganic laminated film and then curing the barrier coating solution.Type: ApplicationFiled: October 29, 2024Publication date: February 13, 2025Inventors: TE-CHAO LIAO, CHUN-CHE TSAO, CHENG-HUNG CHEN
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Patent number: 12220208Abstract: An intelligent epidemic prevention system includes a calibration device, an access control system, a visible-light camera recording a first calibration device image of the calibration device and a first user image of a user, a thermographic camera recording a second calibration device image of the calibration device and a second user image of the user, and a computing device that calculates a calibration value according to the first and second calibration device images. The computing device determines whether the user wears a mask properly according to the first user image and generates a first result, and determines whether the temperature of the user is greater than or equal to a threshold temperature according to the calibration value and the second user image and generates a second result. The computing device controls the access control system to open or close according to the first and second results.Type: GrantFiled: January 31, 2023Date of Patent: February 11, 2025Assignee: ACER INCORPORATEDInventors: Andy Ho, Tsung-Yao Chen, Cheng-Hung Chen
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Publication number: 20250010570Abstract: A transparent solder mask protection film, a method for producing the same, and a method for using the same are provided. The transparent solder mask protection film includes a first film layer, a second film layer, and a release film material. The first film layer is a polyester base film layer. The second film layer is formed on a surface of the first film layer. The second film layer is a pressure sensitive adhesive film layer. The release film material includes a release base film and a release coating layer disposed between the release base film and the second film layer. The release base film is a polyester release film. The release coating layer includes a silicone resin material and inorganic particles. After the release film material is separated from the second film layer, a surface of the second film layer is formed into a concave-convex microstructure.Type: ApplicationFiled: September 7, 2023Publication date: January 9, 2025Inventors: TE-CHAO LIAO, CHUN-CHE TSAO, CHENG-HUNG CHEN
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Patent number: 12172812Abstract: A food packaging barrier film and a method for producing the same are provided. The method includes providing a base film, depositing an inorganic laminated film on a surface of the base film, and coating a barrier coating solution on the inorganic laminated film and then curing the barrier coating solution to form a barrier coating layer. The inorganic laminated film includes at least one first inorganic material deposition layer and a second inorganic material deposition layer stacked upon each other, and the at least one first inorganic material deposition layer and the second inorganic material deposition layer are formed in a same vacuum deposition process and in a vacuum condition. The at least one first inorganic material deposition layer and the second inorganic material deposition layer are respectively formed by different inorganic metal oxides in the same vacuum depositing process.Type: GrantFiled: July 24, 2022Date of Patent: December 24, 2024Assignee: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Chun-Che Tsao, Cheng-Hung Chen
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Publication number: 20240402464Abstract: An ophthalmic lens includes a first lens group having a positive refractive power, a second lens group having a positive refractive power, and a third lens group having a positive refractive power. The first lens group includes a first lens, and a lens in the second lens group closest to the first lens group is a second lens. The ophthalmic lens satisfies the condition of 0.65<R1/R2<7.69, where R1 is a shortest distance from a central axis of an optical surface of the first lens to an outermost turning point of the optical surface of the first lens, and R2 is a shortest distance from a central axis of an optical surface of the second lens to an outermost turning point of the optical surface of the second lens.Type: ApplicationFiled: May 13, 2024Publication date: December 5, 2024Inventors: CHING-SHENG CHANG, CHENG-HUNG CHEN, CHING-LUN LIN
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Patent number: 12153433Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.Type: GrantFiled: May 4, 2022Date of Patent: November 26, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Cheng-Kang Hu, Cheng-Hung Chen, Yan-Han Chen, Feng-Kuang Wu, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo
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Publication number: 20240382090Abstract: An ophthalmic imaging system includes a first lens group, an illumination light source, an imaging module, a fixation light, a reflective element, at least one light-blocking member, and a first polarizer. The first lens group includes an aspheric first lens. The fixation light provides a light beam and includes at least three light-emitting components. The reflective element is configured to reflect the light beam and direct the light beam towards the aspheric first lens. The light-blocking member is disposed downstream from and in a light path of the fixation light and disposed upstream from and in a light path of the reflective element. The first polarizer is disposed downstream from and in the light path of the fixation light and disposed upstream from and in the light path of the reflective element to polarize the light beam.Type: ApplicationFiled: March 29, 2024Publication date: November 21, 2024Inventors: Ching-Lun LIN, Ching-Sheng CHANG, Cheng-Hung CHEN
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Publication number: 20240377826Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.Type: ApplicationFiled: July 25, 2024Publication date: November 14, 2024Inventors: Cheng-Kang HU, Cheng-Hung CHEN, Yan-Han CHEN, Feng-Kuang WU, Hsu-Shui LIU, Jiun-Rong PAI, Shou-Wen KUO
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Publication number: 20240297138Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first substrate and through vias formed through the first substrate. The package further includes redistribution layers formed over the first substrate and connected to the through vias and a first pillar layer formed over the redistribution layers. The package further includes a first barrier layer formed over the first pillar layer and a first cap layer formed over the first barrier layer. The package further includes an underfill layer formed over the redistribution layers and surrounding the first pillar layer, the first barrier layer, and the first cap layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first sidewall surface of the first pillar layer and a second sidewall surface of the first cap layer.Type: ApplicationFiled: May 13, 2024Publication date: September 5, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Cheng-Hung CHEN, Yu-Nu HSU, Chun-Chen LIU, Heng-Chi HUANG, Chien-Chen LI, Shih-Yen CHEN, Cheng-Nan HSIEH, Kuo-Chio LIU, Chen-Shien CHEN, Chin-Yu KU, Te-Hsun PANG, Yuan-Feng WU, Sen-Chi CHIANG
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Publication number: 20240191105Abstract: A pressure-sensitive adhesive tape suitable for component cutting process is provided. The pressure-sensitive adhesive tape includes a release film layer, an adhesive layer, and a support base layer that are stacked in sequence. Based on the adhesive layer having a total weight percent of 100 wt %, the adhesive layer includes 40-50 wt % of an acrylic resin, 40-65 wt % of an epoxy monomer, 0.05-0.5 wt % of a hardener, and 0.5-1.0 wt % of an initiator. The adhesive layer has a first acid value before being exposed to an ultraviolet light, the adhesive layer has a second acid value after being exposed to the ultraviolet light, and the second acid value is smaller than the first acid value.Type: ApplicationFiled: February 15, 2023Publication date: June 13, 2024Inventors: TE-CHAO LIAO, CHUN-CHE TSAO, CHENG-HUNG CHEN
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Patent number: 11984419Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.Type: GrantFiled: July 26, 2022Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen, Cheng-Nan Hsieh, Kuo-Chio Liu, Chen-Shien Chen, Chin-Yu Ku, Te-Hsun Pang, Yuan-Feng Wu, Sen-Chi Chiang
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Publication number: 20240145867Abstract: A separator for a lithium battery and a method for manufacturing the same are provided. The separator includes a substrate layer and a coating layer. The substrate layer is a polyolefin porous film and has a substrate thickness ranging from 10 to 30 micrometers. The coating layer is coated on the substrate layer, and has a coating layer thickness ranging from 1 to 5 micrometers. The coating layer includes a heat-resistant resin material and a plurality of inorganic ceramic particles glued in the heat-resistant resin material. The heat-resistant resin material has a melting point (Tm) or a glass transition temperature (Tg) of not less than 150° C. An average particle size of the inorganic ceramic particles is 10% to 40% of the coating layer thickness of the coating layer. The inorganic ceramic particles are stacked in the coating layer with a height of at least three layers.Type: ApplicationFiled: January 17, 2023Publication date: May 2, 2024Inventors: TE-CHAO LIAO, CHUN-CHE TSAO, CHENG-HUNG CHEN, LI-TING WANG
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Patent number: 11958996Abstract: A protection tape includes a base film, an antistatic layer and an adhesive layer. The antistatic layer is located on the base film. The surface impedance of the antistatic layer is less than 1E+9?, and the antistatic layer includes a first resin and conductive materials dispersed in the first resin. The conductive materials include at least one of metal ions and carbon. The adhesive layer is located on a corona treated surface of the base film. The protection tape provided by the present disclosure has the advantage of having resistant to corona treatment.Type: GrantFiled: July 14, 2022Date of Patent: April 16, 2024Assignee: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Chun-Che Tsao, Cheng-Hung Chen
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Publication number: 20240096834Abstract: A method is provided. The method includes determining a first bump map indicative of a first set of positions of bumps. The method includes determining, based upon the first bump map, a first plurality of bump densities associated with a plurality of regions of the first bump map. The method includes smoothing the first plurality of bump densities to determine a second plurality of bump densities associated with the plurality of regions of the first bump map. The method includes determining, based upon the second plurality of bump densities, a second bump map indicative of the first set of positions of the bumps and a set of sizes of the bumps.Type: ApplicationFiled: March 27, 2023Publication date: March 21, 2024Inventors: Shih Hsuan HSU, Chan-Chung CHENG, Chun-Chen LIU, Cheng-Hung CHEN, Peng-Ren CHEN, Wen-Hao CHENG, Jong-l MOU
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Publication number: 20230407146Abstract: A protection tape includes a base film, an antistatic layer and an adhesive layer. The antistatic layer is located on the base film. The surface impedance of the antistatic layer is less than 1E+9?, and the antistatic layer includes a first resin and conductive materials dispersed in the first resin. The conductive materials include at least one of metal ions and carbon. The adhesive layer is located on a corona treated surface of the base film. The protection tape provided by the present disclosure has the advantage of having resistant to corona treatment.Type: ApplicationFiled: July 14, 2022Publication date: December 21, 2023Applicant: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Chun-Che Tsao, Cheng-Hung Chen
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Publication number: 20230346228Abstract: An intelligent epidemic prevention system includes a calibration device, an access control system, a visible-light camera recording a first calibration device image of the calibration device and a first user image of a user, a thermographic camera recording a second calibration device image of the calibration device and a second user image of the user, and a computing device that calculates a calibration value according to the first and second calibration device images. The computing device determines whether the user wears a mask properly according to the first user image and generates a first result, and determines whether the temperature of the user is greater than or equal to a threshold temperature according to the calibration value and the second user image and generates a second result. The computing device controls the access control system to open or close according to the first and second results.Type: ApplicationFiled: January 31, 2023Publication date: November 2, 2023Inventors: Andy HO, Tsung-Yao CHEN, Cheng-Hung CHEN
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Patent number: 11646325Abstract: The present disclosure discloses a pixel structure, an array substrate and a display panel. The pixel structure includes a first data line; a first gate line and a second gate line; a first pixel unit and a second pixel unit. The first pixel units and second pixel units arranged along a second direction; a first pixel electrode relative to the second pixel electrode is close to the first data line, a first thin film transistor and second thin film transistors are arranged close to the first data line; first connecting trace is set between the first drain electrode and the first pixel electrode, a second connecting trace is set between the second drain electrode and the second pixel electrode to make a capacitance of the first pixel unit matching with a capacitance of the second pixel unit.Type: GrantFiled: March 19, 2021Date of Patent: May 9, 2023Assignee: HKC CORPORATION LIMITEDInventors: Hung-chun Lin, Tienhao Chang, Yunqin Hu, Hongyan Chang, Ming hung Shih, Cheng-hung Chen, Wei Li
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Publication number: 20230109604Abstract: A food packaging barrier film and a method for producing the same are provided. The method includes providing a base film, depositing an inorganic laminated film on a surface of the base film, and coating a barrier coating solution on the inorganic laminated film and then curing the barrier coating solution to form a barrier coating layer. The inorganic laminated film includes at least one first inorganic material deposition layer and a second inorganic material deposition layer stacked upon each other, and the at least one first inorganic material deposition layer and the second inorganic material deposition layer are formed in a same vacuum deposition process and in a vacuum condition. The at least one first inorganic material deposition layer and the second inorganic material deposition layer are respectively formed by different inorganic metal oxides in the same vacuum depositing process.Type: ApplicationFiled: July 24, 2022Publication date: April 6, 2023Inventors: TE-CHAO LIAO, CHUN-CHE TSAO, CHENG-HUNG CHEN
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Patent number: 11586257Abstract: A mother substrate and a display panel including the mother substrate are disclosed. The mother substrate includes: an input pad located on an edge of the mother substrate; and a sub-substrate. A switch array and one or more signal lines connected to the switch array are arranged in a display area of the sub-substrate. One end of the signal line lead out a first test portion, and another end of the signal line is connected to the input pad and lead out a second test portion. The first test portion and the second test portion are located on different conductive layers and are insulated from each other. Partial orthographic overlapping of the first test portion is overlapped with partial orthographic overlapping of the second test portion in the non-display area.Type: GrantFiled: July 26, 2021Date of Patent: February 21, 2023Assignees: Beihai HKC Optoelectronics Technology Co., Ltd., HKC Corporation LimitedInventors: Cheng-Hung Chen, Haijiang Yuan
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Patent number: 11518150Abstract: A release liner and a method for producing the same are provided. The release liner includes a resin base layer and two resin release layers. The resin base layer has two surfaces opposite to each other. The two resin release layers are respectively formed on the two surfaces of the resin base layer. Each of the resin release layers includes: a non-polar resin material and a polar resin material. In each of the resin release layers, the polar resin material is dispersed in the non-polar resin material in a plurality of granular forms, an average particle size of the polar resin material ranges from 0.1 ?m to 10 ?m, and a content of the polar resin material in the resin release layer ranges from 10 wt % to 50 wt %, so that a surface roughness (Ra) of the resin release layer ranges from 0.1 ?m to 10 ?m.Type: GrantFiled: September 16, 2020Date of Patent: December 6, 2022Assignee: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Chun-Che Tsao, Cheng-Hung Chen