Patents by Inventor Cheng-Hung CHU

Cheng-Hung CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162064
    Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.
    Type: Application
    Filed: January 23, 2024
    Publication date: May 16, 2024
    Inventors: Chih-Hung HUANG, Cheng-Lung WU, Zheng-Lin HE, Yang-Ann CHU, Jiun-Rong PAI, Hsuan LEE
  • Publication number: 20240162071
    Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
    Type: Application
    Filed: January 19, 2024
    Publication date: May 16, 2024
    Inventors: Chih-Hung HUANG, Cheng-Lung WU, Yi-Fam SHIU, Yu-Chen CHEN, Yang-Ann CHU, Jiun-Rong PAI
  • Publication number: 20240096998
    Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shuen-Shin LIANG, Chij-chien CHI, Yi-Ying LIU, Chia-Hung CHU, Hsu-Kai CHANG, Cheng-Wei CHANG, Chein-Shun LIAO, Keng-chu LIN, KAi-Ting HUANG
  • Patent number: 11915957
    Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hung Huang, Cheng-Lung Wu, Yi-Fam Shiu, Yu-Chen Chen, Yang-Ann Chu, Jiun-Rong Pai
  • Patent number: 11915954
    Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hung Huang, Cheng-Lung Wu, Zheng-Lin He, Yang-Ann Chu, Jiun-Rong Pai, Hsuan Lee
  • Patent number: 11686885
    Abstract: Compound eyes of insects are great optical system for imaging and sensing by the nature creator, which is an unsurpassed challenge due to its precision and small size. Here, we use meta-lens consisting of GaN nano-antenna to open the fascinating doorway to full-color achromatic light field imaging and sensing. A 60×60 multi-channels meta-lens array is used for effectively capturing multi-dimensional optical information including image and depth. Based on this, the multi-dimensional light field imaging and sensing of a moving object is capable to be experimentally implemented. Our system presents a diffraction-limit resolution of 1.95 micrometer via observing the standard resolution test chart under white light illumination. This is the first mimic optical light field imaging and sensing system of insect compound eye, which has potential applications in micro robotic vision, non-men vehicle sensing, virtual and augmented reality, etc.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: June 27, 2023
    Assignee: ACADEMIA SINICA
    Inventors: Din-Ping Tsai, Cheng-Hung Chu, Ren-Jie Lin, Mu-Ku Chen, Pin-Chieh Wu
  • Publication number: 20200225386
    Abstract: Compound eyes of insects are great optical system for imaging and sensing by the nature creator, which is an unsurpassed challenge due to its precision and small size. Here, we use meta-lens consisting of GaN nano-antenna to open the fascinating doorway to full-color achromatic light field imaging and sensing. A 60×60 multi-channels meta-lens array is used for effectively capturing multi-dimensional optical information including image and depth. Based on this, the multi-dimensional light field imaging and sensing of a moving object is capable to be experimentally implemented. Our system presents a diffraction-limit resolution of 1.95 micrometer via observing the standard resolution test chart under white light illumination. This is the first mimic optical light field imaging and sensing system of insect compound eye, which has potential applications in micro robotic vision, non-men vehicle sensing, virtual and augmented reality, etc.
    Type: Application
    Filed: December 19, 2019
    Publication date: July 16, 2020
    Inventors: Din-Ping TSAI, Cheng-Hung CHU, Ren-Jie LIN, Mu-Ku CHEN, Pin-Chieh WU